Microstructural evolution and failure mechanism of 62Sn36Pb2Ag/Cu solder joint during thermal cycling

2019 ◽  
Vol 99 ◽  
pp. 12-18 ◽  
Author(s):  
Qi-hai Li ◽  
Cai-Fu Li ◽  
Wei Zhang ◽  
Wei-wei Chen ◽  
Zhi-Quan Liu
Keyword(s):  
Solder Joint ◽  
Thermal Cycling ◽  
Failure Mechanism ◽  
Microstructural Evolution

scholarly journals Study on the Reliability of Sn–Bi Composite Solder Pastes with Thermosetting Epoxy under Thermal Cycling and Humidity Treatment

Crystals ◽  
2021 ◽  
Vol 11 (7) ◽  
pp. 733
Author(s):  
Lu Liu ◽  
Songbai Xue ◽  
Ruiyang Ni ◽  
Peng Zhang ◽  
Jie Wu
Keyword(s):  
Solder Joint ◽  
Thermal Cycling ◽  
Composite Solder ◽  
Solder Joints ◽  
Solder Paste ◽  
Epoxy System ◽  
Mechanical Reinforcement ◽  
Microstructure Observation ◽  
Temperature And Humidity ◽  
Thermosetting Epoxy

In this study, a Sn–Bi composite solder paste with thermosetting epoxy (TSEP Sn–Bi) was prepared by mixing Sn–Bi solder powder, flux, and epoxy system. The melting characteristics of the Sn–Bi solder alloy and the curing reaction of the epoxy system were measured by differential scanning calorimeter (DSC). A reflow profile was optimized based on the Sn–Bi reflow profile, and the Organic Solderability Preservative (OSP) Cu pad mounted 0603 chip resistor was chosen to reflow soldering and to prepare samples of the corresponding joint. The high temperature and humidity reliability of the solder joints at 85 °C/85% RH (Relative Humidity) for 1000 h and the thermal cycle reliability of the solder joints from −40 °C to 125 °C for 1000 cycles were investigated. Compared to the Sn–Bi solder joint, the TSEP Sn–Bi solder joints had increased reliability. The microstructure observation shows that the epoxy resin curing process did not affect the transformation of the microstructure. The shear force of the TSEP Sn–Bi solder joints after 1000 cycles of thermal cycling test was 1.23–1.35 times higher than the Sn–Bi solder joint and after 1000 h of temperature and humidity tests was 1.14–1.27 times higher than the Sn–Bi solder joint. The fracture analysis indicated that the cured cover layer could still have a mechanical reinforcement to the TSEP Sn–Bi solder joints after these reliability tests.

Microstructure evolution observation for SAC solder joint: Comparison between thermal cycling and thermal storage

2009 ◽  
Vol 49 (9-11) ◽  
pp. 1267-1272 ◽  
Author(s):  
M. Berthou ◽  
P. Retailleau ◽  
H. Frémont ◽  
A. Guédon-Gracia ◽  
C. Jéphos-Davennel
Keyword(s):  
Solder Joint ◽  
Thermal Cycling ◽  
Microstructure Evolution ◽  
Thermal Storage ◽  
Sac Solder

scholarly journals Prediction of mechanical properties and fatigue life of nano silver paste in chip interconnection

2020 ◽  
Author(s):  
Hui YANG ◽  
Jihui Wu
Keyword(s):  
Fatigue Life ◽  
Solder Joint ◽  
Thermal Cycling ◽  
Solder Joints ◽  
Stress And Strain ◽  
Nano Silver ◽  
Finite Element Software ◽  
Flip Chips ◽  
Empirical Correction ◽  
Prediction Of Mechanical Properties

Abstract The simulation of nano-silver solder joints in flip-chips is performed by the finite element software ANSYS, and the stress-strain distribution results of the solder joints are displayed. In this simulation, the solder joints use Anand viscoplastic constitutive model, which can reasonably simulate the stress and strain of solder joints under thermal cycling load. At the same time this model has been embedded in ANSYS software, so it is more convenient to use. The final simulation results show that the areas where the maximum stresses and strains occur at the solder joints are mostly distributed in the contact areas between the solder joints and the copper pillars and at the solder joints. During the entire thermal cycling load process, the area where the maximum change in stress and strain occurs is always at the solder joint, and when the temperature changes, the temperature at the solder joint changes significantly. Based on comprehensive analysis, the relevant empirical correction calculation equation is used to calculate and predict the thermal fatigue life of nano-silver solder joints. The analysis results provide a reference for the application of nano-silver solder in the electronic packaging industry.

scholarly journals LC/8YSZ TBCs Thermal Cycling Life and Failure Mechanism under Extreme Temperature Gradients

Coatings ◽  
2021 ◽  
Vol 11 (9) ◽  
pp. 1051
Author(s):  
Kun Liu ◽  
Xi Chen ◽  
Kangping Du ◽  
Yu Wang ◽  
Jinguang Du ◽  
...  
Keyword(s):  
High Temperature ◽  
Surface Temperature ◽  
Thermal Cycling ◽  
Thermal Shock ◽  
Failure Mechanism ◽  
Extreme Temperature ◽  
Temperature Gradients ◽  
Accelerated Life Test ◽  
Ceramic Layer ◽  
Cycling Life

The purpose of this paper is to study the thermal shock resistance and failure mechanism of La2Ce2O7/8YSZ double-ceramic-layer thermal barrier coatings (LC/8YSZ DCL TBCs) under extreme temperature gradients. At high surface temperatures, thermal shock and infrared temperature measuring modules were used to determine the thermal cycling life and insulation temperature of LC/8YSZ DCL TBCs under extreme temperature gradients by an oxygen–acetylene gas flame testing machine. A viscoelastic model was used to obtain the stress and strain law of solid phase sintering of a coating system using the finite element method. Results and Conclusion: (1) Thermal cycling life was affected by the surface temperature of LC/8YSZ DCL TBCs and decreased sharply with the increase of surface temperature. (2) The LC ceramic surface of the failure coating was sintered, and the higher the temperature, the faster the sintering process. (3) Accelerated life test results showed that high temperature thermal cycling life is not only related to thermal fatigue of ceramic layer, but is also related to the sintering degree of the coating. (4) Although the high temperature thermal stress had great influence on the coating, great sintering stress was produced with sintering of the LC ceramic layer, which is the main cause of LC/8YSZ DCL TBC failure. The above results indicate that for new TBC ceramic materials, especially those for engines above class F, their sinterability should be fully considered. Sintering affects the thermal shock properties at high temperature. Our research results can provide reference for material selection and high temperature performance research.

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