Temperature effects on BTI and soft errors in modern logic circuits

2018 ◽  
Vol 87 ◽  
pp. 259-270 ◽  
Author(s):  
W. Sootkaneung ◽  
S. Howimanporn ◽  
S. Chookaew
Keyword(s):  
Temperature Effects ◽  
Soft Errors ◽  
Logic Circuits ◽  
Modern Logic

Robust Flip-Flop against Soft Errors for Combinational and Sequential Logic Circuits

2008 ◽  
Author(s):  
T. Uemura ◽  
Y. Tosaka ◽  
H. Matsuyama ◽  
K. Takahisa ◽  
K. Hatanaka
Keyword(s):  
Soft Errors ◽  
Logic Circuits ◽  
Flip Flop ◽  
Sequential Logic

Spin-Based Fully Nonvolatile Full-Adder Circuit for Computing in Memory

SPIN ◽  
2019 ◽  
Vol 09 (01) ◽  
pp. 1950007 ◽  
Author(s):  
Abdolah Amirany ◽  
Ramin Rajaei
Keyword(s):  
High Performance ◽  
Soft Errors ◽  
Magnetic Tunnel Junction ◽  
High Volume ◽  
Full Adder ◽  
Cmos Technology ◽  
Logic Circuits ◽  
Volume Data ◽  
Single Node ◽  
Radiation Induced

As CMOS technology scales down toward below 2-digit nanometer dimensions, exponentially increasing leakage power, vulnerability to radiation induced soft errors have become a major problem in today’s logic circuits. Emerging spin-based logic circuits and architectures based on nonvolatile magnetic tunnel junction (MTJ) cells show a great potential to overcome the aforementioned issues. However, radiation induced soft errors are still a problem in MTJ-based circuits as they need sequential peripheral CMOS circuits for sensing the MTJs. This paper proposes a novel nonvolatile and low-cost radiation hardened magnetic full adder (MFA). In comparison with the previous designs, the proposed MFA is capable of tolerating particle strikes regardless of the amount of charge induced to a single node and even multiple nodes. Besides, the proposed MFA offers low power operation, low area and high performance as compared with previous counterparts. One of the most important features suggested by the proposed MFA circuit is full nonvolatility. Nonvolatile logic circuits remove the cost of high volume data transactions between memory and logic and also facilitate power gating in logic-in-memory architectures.

Robust Flip-Flop Circuit against Soft Errors for Combinational and Sequential Logic Circuits

2009 ◽  
Vol 48 (4) ◽  
pp. 04C070 ◽  
Author(s):  
Taiki Uemura ◽  
Yoshiharu Tosaka ◽  
Hideya Matsuyama ◽  
Keiji Takahisa ◽  
Mitsuhiro Fukuda ◽  
...  
Keyword(s):  
Soft Errors ◽  
Logic Circuits ◽  
Flip Flop ◽  
Sequential Logic

Characterization of carbides in M50NiL

1991 ◽  
Vol 49 ◽  
pp. 606-607
Author(s):  
L. S. Lin ◽  
K. P. Gumz ◽  
A. V. Karg ◽  
C. C. Law
Keyword(s):  
Temperature Effects ◽  
Base Composition ◽  
Lattice Parameter ◽  
Control Surface ◽  
Carbide Formation ◽  
Particle Sizes ◽  
Low Carbon ◽  
Fee Structure ◽  
Heat Treated

Carbon and temperature effects on carbide formation in the carburized zone of M50NiL are of great importance because they can be used to control surface properties of bearings. A series of homogeneous alloys (with M50NiL as base composition) containing various levels of carbon in the range of 0.15% to 1.5% (in wt.%) and heat treated at temperatures between 650°C to 1100°C were selected for characterizations. Eleven samples were chosen for carbide characterization and chemical analysis and their identifications are listed in Table 1.Five different carbides consisting of M6C, M2C, M7C3 and M23C6 were found in all eleven samples examined as shown in Table 1. M6C carbides (with least carbon) were found to be the major carbide in low carbon alloys (<0.3% C) and their amounts decreased as the carbon content increased. In sample C (0.3% C), most particles (95%) encountered were M6C carbide with a particle sizes range between 0.05 to 0.25 um. The M6C carbide are enriched in both Mo and Fe and have a fee structure with lattice parameter a=1.105 nm (Figure 1).

Fault effects in asynchronous sequential logic circuits

1993 ◽  
Vol 140 (6) ◽  
pp. 327-332
Author(s):  
M.-D. Shieh ◽  
C.-L. Wey ◽  
P.D. Fisher
Keyword(s):  
Logic Circuits ◽  
Sequential Logic
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