Mechanical stress effects on electrical breakdown of freestanding GaN thin films

2018 ◽  
Vol 81 ◽  
pp. 181-185 ◽  
Author(s):  
Tun Wang ◽  
Baoming Wang ◽  
Aman Haque ◽  
Michael Snure ◽  
Eric Heller ◽  
...  
2006 ◽  
Vol 88 (25) ◽  
pp. 252901 ◽  
Author(s):  
Jyrki Lappalainen ◽  
Vilho Lantto ◽  
Johannes Frantti ◽  
Jussi Hiltunen

Author(s):  
N A Djuzhev ◽  
A A Dedkova ◽  
E E Gusev ◽  
M A Makhiboroda ◽  
P Y Glagolev
Keyword(s):  

1994 ◽  
Vol 356 ◽  
Author(s):  
S. Y. Tam ◽  
L. E. Scriven ◽  
H. K. Stolarski

AbstractA model is developed to predict the magnitude and pattern of stress due to drying of polymer films. This model combines diffusion-and-convection equation with large deformation elasto-viscoplasticity, utilizing concentration dependent elastic and viscoplastic material properties to better represent the behavior of drying thin films.The results show that the highest stress occurs at film surface where the concentration depletion is the highest. The magnitude of this stress is induced by increasing mass transfer across the film surface but reduced by increasing diffusion coefficient. The edge effect is significant but local, limited to about four film thicknesses. Similarly, change in substrate induces extra stress.


1981 ◽  
Vol 23 (7) ◽  
pp. 3149-3158 ◽  
Author(s):  
C. A. Pelá ◽  
J. F. Suassuna ◽  
G. E. Barberis ◽  
C. Rettori

2018 ◽  
Vol 9 (27) ◽  
pp. 3820-3831 ◽  
Author(s):  
Hui-Ching Hsieh ◽  
Chih-Chien Hung ◽  
Kodai Watanabe ◽  
Jung-Yao Chen ◽  
Yu-Cheng Chiu ◽  
...  

Novel deformable and fluorescent PF-b-PBA copolymers with nanofibrillar structures were synthesized for unraveling strain-dependent optical properties.


2021 ◽  
Vol 21 (8) ◽  
pp. 4462-4465
Author(s):  
Taeho Park ◽  
Kyoungah Cho ◽  
Seunggen Yang ◽  
Sangsig Kim

In this study, we investigated thermoelectric materials with durability against mechanical stress using Ag2Se nanoparticle (NP) thin films and colorless polyimide (CPI) substrates. Ag2Se NP thin films and CPI substrates were produced by spin-coating, and their thicknesses were 40 nm and 15 μm, respectively. A bendable thermoelectric film with a channel length of 40 μm and a channel area of 1.6 μm2 generated a Seebeck voltage of 1.43 mV at a temperature difference of 4.5 K. Owing to the thickness of the extremely thin thermoelectric film and substrate, the mechanical strain was only 0.15% even when the thermoelectric devices were bent with a curvature of 3 mm. Therefore, it was determined that the bendable thermoelectric film was robust against mechanical stress.


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