Study on reliability of PQFP assembly with lead free solder joints under random vibration test

2015 ◽  
Vol 55 (12) ◽  
pp. 2769-2776 ◽  
Author(s):  
F.X. Che ◽  
John H.L. Pang
Keyword(s):  
Random Vibration ◽  
Solder Joints ◽  
Lead Free ◽  
Vibration Test ◽  
Lead Free Solder ◽  
Free Solder

scholarly journals Finite element modeling and random vibration analysis of BGA electronic package soldered using lead free solder alloy − Sn-1Cu-1Ni-1Ag

2019 ◽  
Vol 10 ◽  
pp. A11 ◽  
Author(s):  
S. Jayesh ◽  
J. Elias
Keyword(s):  
Finite Element ◽  
Solder Joint ◽  
Vibration Analysis ◽  
Random Vibration ◽  
Solder Joints ◽  
Lead Free ◽  
Lead Free Solder ◽  
Electronic Package ◽  
Free Solder ◽  
Random Vibration Analysis

As a result of the ban of lead from solder joints, many lead-free solder joints were developed. Most of the electronic equipment is subjected to random vibration. This study develops an analysis methodology based on finite element analysis and vibration tests to predict the failure and fatigue life of the electronic package soldered using Sn-1Cu-1Ni-1Ag under random vibration. A specially designed printed circuit board having ball grid array packages soldered is used in the study. Finite element model is developed in ANSYS and modal analysis was done. The finite element results were validated with experiments (impact test). Random vibration analysis was also done. These results were validated with random vibration experiments. Using the finite element results, it was predicted that the corner solder joints will fail first. It was observed in the random vibration experiment that corner solder joint failed first and the maximum stress generated was 12.8 MPa. Thus, Sn-1Cu-1Ni-1Ag is a promising lead-free solder joint alloy under random vibration combining with its mechanical properties.

Void Formation and Their Effect on Reliability of Lead-Free Solder Joints on MID and PCB Substrates

2017 ◽  
Vol 66 (4) ◽  
pp. 1229-1237 ◽  
Author(s):  
P. Wild ◽  
T. Grozinger ◽  
D. Lorenz ◽  
A. Zimmermann
Keyword(s):  
Solder Joints ◽  
Void Formation ◽  
Lead Free ◽  
Lead Free Solder ◽  
Free Solder

Quantitative Evaluation of Voids in Lead Free Solder Joints

2015 ◽  
Vol 772 ◽  
pp. 284-289 ◽  
Author(s):  
Sabuj Mallik ◽  
Jude Njoku ◽  
Gabriel Takyi
Keyword(s):  
Solder Bump ◽  
Solder Joints ◽  
Void Formation ◽  
Lead Free ◽  
Lead Free Solder ◽  
Solder Paste ◽  
X Ray ◽  
Size And Shape ◽  
Solder Bumps ◽  
Free Solder

Voiding in solder joints poses a serious reliability concern for electronic products. The aim of this research was to quantify the void formation in lead-free solder joints through X-ray inspections. Experiments were designed to investigate how void formation is affected by solder bump size and shape, differences in reflow time and temperature, and differences in solder paste formulation. Four different lead-free solder paste samples were used to produce solder bumps on a number of test boards, using surface mount reflow soldering process. Using an advanced X-ray inspection system void percentages were measured for three different size and shape solder bumps. Results indicate that the voiding in solder joint is strongly influenced by solder bump size and shape, with voids found to have increased when bump size decreased. A longer soaking period during reflow stage has negatively affectedsolder voids. Voiding was also accelerated with smaller solder particles in solder paste.

Retarding Electromigration in Lead-Free Solder Joints by Alloying and Composite Approaches

2012 ◽  
Vol 42 (2) ◽  
pp. 280-287 ◽  
Author(s):  
Ran Zhao ◽  
Limin Ma ◽  
Yong Zuo ◽  
Sihan Liu ◽  
Fu Guo
Keyword(s):  
Solder Joints ◽  
Lead Free ◽  
Lead Free Solder ◽  
Free Solder
Sign in / Sign up

Export Citation Format

Share Document