scholarly journals Multiphysics modeling approach for micro electro–thermo–mechanical actuator: Failure mechanisms coupled analysis

2015 ◽  
Vol 55 (5) ◽  
pp. 771-782 ◽  
Author(s):  
Jinling Wang ◽  
Shengkui Zeng ◽  
Vadim V. Silberschmidt ◽  
Jianbin Guo
Keyword(s):  
Failure Mechanisms ◽  
Coupled Analysis ◽  
Actuator Failure ◽  
Multiphysics Modeling ◽  
Modeling Approach

Numerical Modeling and Ocean Testing of a Direct-Drive Wave Energy Device Utilizing a Permanent Magnet Linear Generator for Power Take-Off

2009 ◽  
Author(s):  
David Elwood ◽  
Al Schacher ◽  
Ken Rhinefrank ◽  
Joe Prudell ◽  
Solomon Yim ◽  
...  
Keyword(s):  
Energy Conversion ◽  
Wave Energy ◽  
Large Scale ◽  
Intermediate Energy ◽  
Coupled Analysis ◽  
Analysis Tool ◽  
State University ◽  
Direct Drive ◽  
Test Bed ◽  
Modeling Approach

For the past several years an inter-disciplinary research group at Oregon State University (OSU), working in conjunction with Columbia Power Technologies (CPT) has been researching innovative direct-drive wave energy systems. These systems simplify the conversion of wave energy into electricity by eliminating intermediate energy conversion processes. In support of this research OSU and CPT have developed a hybrid numerical/physical modeling approach utilizing a large scale linear test bed (LTB), and a commercial coupled analysis tool. This paper will present an overview of this modeling approach and its application to the design of a 10kW prototype wave energy conversion system that was tested in the open ocean in the fall of 2008. The data gathered during ocean testing was used to calibrate the numerical model of the device and predict the energy capture potential of the system.

On the role of tin underlays for the prevention of thermal grooving in thin gold films

1986 ◽  
Vol 44 ◽  
pp. 732-733
Author(s):  
Jin Young Kim ◽  
R. E. Hummel ◽  
R. T. DeHoff
Keyword(s):  
Thin Film ◽  
Free Surface ◽  
Grain Boundary ◽  
Beneficial Effect ◽  
Failure Mechanism ◽  
Failure Mechanisms ◽  
Distinct Advantage ◽  
Gold Films ◽  
Gold Thin Film

Gold thin film metallizations in microelectronic circuits have a distinct advantage over those consisting of aluminum because they are less susceptible to electromigration. When electromigration is no longer the principal failure mechanism, other failure mechanisms caused by d.c. stressing might become important. In gold thin-film metallizations, grain boundary grooving is the principal failure mechanism.Previous studies have shown that grain boundary grooving in gold films can be prevented by an indium underlay between the substrate and gold. The beneficial effect of the In/Au composite film is mainly due to roughening of the surface of the gold films, redistribution of indium on the gold films and formation of In2O3 on the free surface and along the grain boundaries of the gold films during air annealing.

Real-time cryo-deformation of polypropylene and impact-modified polypropylene in the transmission electron microscope

1993 ◽  
Vol 51 ◽  
pp. 892-893
Author(s):  
Robert C. Cieslinski ◽  
H. Craig Silvis ◽  
Daniel J. Murray
Keyword(s):  
Electron Microscope ◽  
Transmission Electron Microscope ◽  
Failure Mechanisms ◽  
Brittle Transition ◽  
Molded Part ◽  
Transmission Electron ◽  
Solvent Cast ◽  
The Impact ◽  
Annealed Copper ◽  
Dynamic Plane

An understanding of the mechanical behavior polymers in the ductile-brittle transition region will result in materials with improved properties. A technique has been developed that allows the realtime observation of dynamic plane stress failure mechanisms in the transmission electron microscope. With the addition of a cryo-tensile stage, this technique has been extented to -173°C, allowing the observation of deformation during the ductile-brittle transition.The technique makes use of an annealed copper cartridge in which a thin section of bulk polymer specimen is bonded and plastically deformed in tension in the TEM using a screw-driven tensile stage. In contrast to previous deformation studies on solvent-cast films, this technique can examine the frozen-in morphology of a molded part.The deformation behavior of polypropylene and polypropylene impact modified with EPDM (ethylene-propylene diene modified) and PE (polyethylene) rubbers were investigated as function of temperature and the molecular weight of the impact modifier.

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