Interrogating failure mechanisms of notched composites through a discrete crack modeling approach

2020 ◽  
Vol 196 ◽  
pp. 108203 ◽  
Author(s):  
Jie Zhi ◽  
Tong-Earn Tay
Holzforschung ◽  
2016 ◽  
Vol 70 (9) ◽  
pp. 845-853 ◽  
Author(s):  
Markus Lukacevic ◽  
Josef Füssl

Abstract A more accurate prediction of the mechanical behavior of wood is needed to increase its ability to compete with other building materials. Especially, when it comes to estimate failure loads, the lack of appropriate prediction tools becomes obvious. The present work contributes to this goal in two different ways: First, a damage concept for wood is revisited, which allows for transferring information about failure processes through different scales of observation. In this concept, the failure behavior of clear wood is linked to the different characteristic of earlywood and latewood layers in softwoods. This reduces the number of empirically determined strength parameters, while the definition of multisurface failure criteria is still possible. Secondly, it will be demonstrated that the combination of these models with discrete crack modeling based on the extended finite element method provides a numerical simulation tool capable to describe failure mechanisms more realistically than existing approaches. The results obtained by numerical calculations and experiments by means of a micro wedge splitting test show very good agreement, especially, if the load capacity and failure mechanisms are in focus. The presented approach shows a much better performance compared to linear elastic or elastoplastic simulations.


Author(s):  
Jin Young Kim ◽  
R. E. Hummel ◽  
R. T. DeHoff

Gold thin film metallizations in microelectronic circuits have a distinct advantage over those consisting of aluminum because they are less susceptible to electromigration. When electromigration is no longer the principal failure mechanism, other failure mechanisms caused by d.c. stressing might become important. In gold thin-film metallizations, grain boundary grooving is the principal failure mechanism.Previous studies have shown that grain boundary grooving in gold films can be prevented by an indium underlay between the substrate and gold. The beneficial effect of the In/Au composite film is mainly due to roughening of the surface of the gold films, redistribution of indium on the gold films and formation of In2O3 on the free surface and along the grain boundaries of the gold films during air annealing.


Author(s):  
Robert C. Cieslinski ◽  
H. Craig Silvis ◽  
Daniel J. Murray

An understanding of the mechanical behavior polymers in the ductile-brittle transition region will result in materials with improved properties. A technique has been developed that allows the realtime observation of dynamic plane stress failure mechanisms in the transmission electron microscope. With the addition of a cryo-tensile stage, this technique has been extented to -173°C, allowing the observation of deformation during the ductile-brittle transition.The technique makes use of an annealed copper cartridge in which a thin section of bulk polymer specimen is bonded and plastically deformed in tension in the TEM using a screw-driven tensile stage. In contrast to previous deformation studies on solvent-cast films, this technique can examine the frozen-in morphology of a molded part.The deformation behavior of polypropylene and polypropylene impact modified with EPDM (ethylene-propylene diene modified) and PE (polyethylene) rubbers were investigated as function of temperature and the molecular weight of the impact modifier.


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