scholarly journals Ultra-fine pitch palladium-coated copper wire bonding: Effect of bonding parameters

2014 ◽  
Vol 54 (11) ◽  
pp. 2555-2563 ◽  
Author(s):  
Adeline B.Y. Lim ◽  
Andrew C.K. Chang ◽  
Oranna Yauw ◽  
Bob Chylak ◽  
Chee Lip Gan ◽  
...  
Keyword(s):  
Copper Wire ◽  
Wire Bonding ◽  
Bonding Parameters ◽  
Fine Pitch ◽  
Bonding Effect ◽  
Copper Wire Bonding

Fine pitch copper wire bonding on 45nm tech Cu/low-k chip with different bond pad metallurgy

2011 ◽  
Author(s):  
Leong Ching Wai ◽  
Norhanani Binte Jaafar ◽  
Michelle Chew ◽  
Sivakumar ◽  
Gunasekaran ◽  
...  
Keyword(s):  
Copper Wire ◽  
Wire Bonding ◽  
Fine Pitch ◽  
Copper Wire Bonding ◽  
Low K

Copper wire bonding ready for industrial mass production

2015 ◽  
Vol 2015 (1) ◽  
pp. 000399-000405 ◽  
Author(s):  
M. Brökelmann ◽  
D. Siepe ◽  
M. Hunstig ◽  
M. McKeown ◽  
K. Oftebro
Keyword(s):  
Tool Wear ◽  
Copper Wire ◽  
Tool Material ◽  
Wire Bonding ◽  
Bond Quality ◽  
Process Data ◽  
Power Semiconductors ◽  
Bonding Parameters ◽  
Copper Wire Bonding ◽  
The Impact

Copper wire as a bonding material for the top side connection of power semiconductors is highly desired. One current drawback in heavy copper wire bonding is the relatively low lifetime of the consumables. The bonding tool wear mechanisms and the corresponding factors are investigated. To reduce wear, different approaches are tested in long-term bonding tests. Optimized bonding tool tip geometry and tool material are two of these factors. Optimized bonding parameters were investigated as well and show a significant improvement in bonding tool lifetime. Wear and lifetime of the cutter and the wire guide are also examined. Additionally, the impact of bonding tool wear on different aspects of bond quality is addressed. It is also shown how wear can be monitored by machine process data recording and how a derived signal correlates to the actual wear status. These major advances in heavy copper wire bonding now make it a robust, reliable and efficient interconnection technology.

Fine Pitch Cu Wire Bonding – As Good As Gold

2010 ◽  
Vol 2010 (1) ◽  
pp. 000650-000655
Author(s):  
Bernd K. Appelt ◽  
William T. Chen ◽  
Andy Tseng ◽  
Yi-Shao Lai
Keyword(s):  
Raw Materials ◽  
Copper Wire ◽  
Commodity Prices ◽  
Gold Wire ◽  
Wire Bonding ◽  
Fine Pitch ◽  
Methodical Approach ◽  
Copper Wire Bonding ◽  
Gold Wires ◽  
The Impact

Fine pitch wire bonding has traditionally been the domain of gold wires. The significant increase in gold commodity prices has driven a continuous reduction in wire diameters to minimize the impact of the raw materials cost of the wire. This has reached a point now where copper wires are beginning to displace gold wires despite the technical challenges associated with copper wires. The basic challenges like propensity for oxidation, hardness and propensity for corrosion can be managed with the appropriate investment in tooling and infrastructure. Doubts are persisting about yield and reliability. With a very methodical approach to developing the process controls, it can be demonstrated that yields are as good as those for gold despite the fact that copper bonds are not reworkable. Likewise, the typical JEDEC reliability tests can be full filled. Here, an extensive effort has been placed on extended JEDEC testing to demonstrate that with good process control and proper materials choices, test durations of more than 2x can be passed. This excellent performance demonstrates that copper wire bonding can be as good as or better than gold wire bonding.

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