Analytical estimates of stress around a doubly periodic arrangement of through-silicon vias

2013 ◽  
Vol 53 (1) ◽  
pp. 63-69 ◽  
Author(s):  
Anirudh Udupa ◽  
Ganesh Subbarayan ◽  
Cheng-Kok Koh
Keyword(s):  
Through Silicon Vias ◽  
Silicon Vias ◽  
Periodic Arrangement

Failure and Stress Analysis of Cu TSVs Using GHz-Scanning Acoustic Microscopy and Scanning Infrared Polariscopy

2015 ◽  
Author(s):  
Ingrid De Wolf ◽  
Ahmad Khaled ◽  
Martin Herms ◽  
Matthias Wagner ◽  
Tatjana Djuric ◽  
...  
Keyword(s):  
Failure Analysis ◽  
Stress Analysis ◽  
Rayleigh Waves ◽  
Acoustic Microscopy ◽  
Scanning Acoustic Microscopy ◽  
Through Silicon Vias ◽  
Stress Anisotropy ◽  
Silicon Vias ◽  
Ic Technology ◽  
Detection Of Defects

Abstract This paper discusses the application of two different techniques for failure analysis of Cu through-silicon vias (TSVs), used in 3D stacked-IC technology. The first technique is GHz Scanning Acoustic Microscopy (GHz- SAM), which not only allows detection of defects like voids, cracks and delamination, but also the visualization of Rayleigh waves. GHz-SAM can provide information on voids, delamination and possibly stress near the TSVs. The second is a reflection-based photoelastic technique (SIREX), which is shown to be very sensitive to stress anisotropy in the Si near TSVs and as such also to any defect affecting this stress, such as delamination and large voids.

scholarly journals Resistive Programmable Through-Silicon Vias for Reconfigurable 3-D Fabrics

2012 ◽  
Vol 11 (1) ◽  
pp. 8-11 ◽  
Author(s):  
Davide Sacchetto ◽  
Michael Zervas ◽  
Yuksel Temiz ◽  
Giovanni De Micheli ◽  
Yusuf Leblebici
Keyword(s):  
Through Silicon Vias ◽  
Silicon Vias

scholarly journals On the origins of near-surface stresses in silicon around Cu-filled and CNT-filled through silicon vias

2016 ◽  
Vol 31 (5) ◽  
pp. 055008 ◽  
Author(s):  
Ye Zhu ◽  
Kaushik Ghosh ◽  
Hong Yu Li ◽  
Yiheng Lin ◽  
Chuan Seng Tan ◽  
...  
Keyword(s):  
Through Silicon Vias ◽  
Near Surface ◽  
Surface Stresses ◽  
Silicon Vias
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