Strain engineering for bumping over IPs: Numerical investigations of thermo-mechanical stress induced mobility variations for CMOS 32nm and beyond
2013 ◽
Vol 53
(2)
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pp. 229-235
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2009 ◽
Vol 30
(7)
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pp. 760-762
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2015 ◽
Vol 55
(6)
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pp. 980-989
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2003 ◽
Vol 84
(5)
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pp. 770-777
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2003 ◽
Vol 112
◽
pp. 943-946
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Keyword(s):
1977 ◽
Vol 37
(02)
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pp. 329-338
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EFFECTS OF AIR ON SPLASHING DURING A LARGE DROPLET IMPACT: EXPERIMENTAL AND NUMERICAL INVESTIGATIONS
2006 ◽
Vol 16
(8)
◽
pp. 981-996
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