The combinational or selective usage of the laser SQUID microscope, the non-bias laser terahertz emission microscope, and fault simulations in non-electrical-contact fault localization

2011 ◽  
Vol 51 (9-11) ◽  
pp. 1624-1631 ◽  
Author(s):  
Kiyoshi Nikawa ◽  
Masatsugu Yamashita ◽  
Toru Matsumoto ◽  
Katsuyoshi Miura ◽  
Yoshihiro Midoh ◽  
...  
Keyword(s):  
Electrical Contact ◽  
Fault Localization ◽  
Terahertz Emission

Epitaxial ferroelectric thin films

1994 ◽  
Vol 52 ◽  
pp. 572-573
Author(s):  
S. G. Ghonge ◽  
E. Goo ◽  
R. Ramesh ◽  
R. Haakenaasen ◽  
D. K. Fork
Keyword(s):  
Single Crystal ◽  
Work Function ◽  
Nonvolatile Memory ◽  
Ferroelectric Properties ◽  
Electrical Contact ◽  
Memory Devices ◽  
Ferroelectric Films ◽  
Si Substrates ◽  
Electro Optic ◽  
Wide Range

Microstructure of epitaxial ferroelectric/conductive oxide heterostructures on LaAIO3(LAO) and Si substrates have been studied by conventional and high resolution transmission electron microscopy. The epitaxial films have a wide range of potential applications in areas such as non-volatile memory devices, electro-optic devices and pyroelectric detectors. For applications such as electro-optic devices the films must be single crystal and for applications such as nonvolatile memory devices and pyroelectric devices single crystal films will enhance the performance of the devices. The ferroelectric films studied are Pb(Zr0.2Ti0.8)O3(PLZT), PbTiO3(PT), BiTiO3(BT) and Pb0.9La0.1(Zr0.2Ti0.8)0.975O3(PLZT).Electrical contact to ferroelectric films is commonly made with metals such as Pt. Metals generally have a large difference in work function compared to the work function of the ferroelectric oxides. This results in a Schottky barrier at the interface and the interfacial space charge is believed to responsible for domain pinning and degradation in the ferroelectric properties resulting in phenomenon such as fatigue.

A Method of Fabricating Electroplated Structures using Side-wall Electrical Contact

2014 ◽  
Vol 134 (2) ◽  
pp. 20-25 ◽  
Author(s):  
Takanori Aono ◽  
Yasuhiro Yoshimura ◽  
Yoshinori Nakayama ◽  
Masatoshi Kanamaru
Keyword(s):  
Electrical Contact ◽  
Side Wall

Preliminary Study of Electrical Contact Behaviors of Au-plated Material at Super Low Making/Breaking Velocity

2015 ◽  
Vol E98.C (4) ◽  
pp. 364-370 ◽  
Author(s):  
Wanbin REN ◽  
Shengjun XUE ◽  
Hongxu ZHI ◽  
Guofu ZHAI
Keyword(s):  
Electrical Contact ◽  
Preliminary Study

Lightweight Fault Localization using Weighted Dynamic Control Flow Subgraph

2020 ◽  
Vol 16 (2) ◽  
pp. 214
Author(s):  
Wang Yong ◽  
Liu SanMing ◽  
Li Jun ◽  
Cheng Xiangyu ◽  
Zhou Wan
Keyword(s):  
Dynamic Control ◽  
Fault Localization ◽  
Control Flow

AMBRONZE 413

Alloy Digest ◽  
1969 ◽  
Vol 18 (6) ◽  
Keyword(s):  
Corrosion Resistance ◽  
Physical Properties ◽  
Surface Treatment ◽  
Stress Corrosion ◽  
Tensile Properties ◽  
Stress Corrosion Cracking ◽  
Electrical Contact ◽  
Heat Treating ◽  
Corrosion Cracking ◽  
Tin Bronze

Abstract AMBRONZE 413 is a copper-tin bronze recommended for plater's plates and electrical contact springs. It is relatively immune to stress-corrosion cracking. This datasheet provides information on composition, physical properties, hardness, elasticity, and tensile properties. It also includes information on corrosion resistance as well as forming, heat treating, machining, joining, and surface treatment. Filing Code: Cu-201. Producer or source: Anaconda American Brass Company.

CONSIL 901

Alloy Digest ◽  
1979 ◽  
Vol 28 (11) ◽  
Keyword(s):  
Corrosion Resistance ◽  
Physical Properties ◽  
Surface Treatment ◽  
Tensile Properties ◽  
Electrical Contact ◽  
Heat Treating ◽  
Silver Copper ◽  
Contact Devices ◽  
Resistance To Wear

Abstract CONSIL 901 is the most commonly used of the silver-copper electrical contact alloys. It has higher hardness and better resistance to wear than fine silver. It is used widely for light and medium-duty applications involving electrical-contact devices. This datasheet provides information on composition, physical properties, microstructure, tensile properties. It also includes information on corrosion resistance as well as casting, forming, heat treating, joining, and surface treatment. Filing Code: Ag-9. Producer or source: Handy & Harman.

A Manual Diagnosis Approach Using Targeted Fault Injection and Fault Simulation to Extend ATPG Diagnostic Resolution in Localizing Faults

2019 ◽  
Author(s):  
Rommel Estores ◽  
Karo Vander Gucht
Keyword(s):  
Fault Injection ◽  
Fault Simulation ◽  
Fault Localization ◽  
Pattern Generation ◽  
Test Coverage ◽  
Actual Case ◽  
Electrical Failure ◽  
Starting Point ◽  
Diagnostic Resolution ◽  
Diagnosis Approach

Abstract This paper discusses a creative manual diagnosis approach, a complementary technique that provides the possibility to extend Automatic Test Pattern Generation (ATPG) beyond its own limits. The authors will discuss this approach in detail using an actual case – a test coverage issue where user-generated ATPG patterns and the resulting ATPG diagnosis isolated the fault to a small part of the digital core. However, traditional fault localization techniques was unable to isolate the fault further. Using the defect candidates from ATPG diagnosis as a starting point, manual diagnosis through fault Injection and fault simulation was performed. Further fault localization was performed using the ‘not detected’ (ND) and/or ‘detected’ (DT) fault classes for each of the available patterns. The result has successfully deduced the defect candidates until the exact faulty net causing the electrical failure was identified. The ability of the FA lab to maximize the use of ATPG in combination with other tools/techniques to investigate failures in detail; is crucial in the fast root cause determination and, in case of a test coverage, aid in having effective test screen method implemented.

Advanced IR-OBIRCH Analysis Technique for High Isb Failure Analysis

2010 ◽  
Author(s):  
Kuo Hsiung Chen ◽  
Wen Sheng Wu ◽  
Yu Hsiang Shu ◽  
Jian Chan Lin
Keyword(s):  
Failure Analysis ◽  
Failure Mechanisms ◽  
Fault Localization ◽  
Resistance Change ◽  
The Real ◽  
Analysis Techniques ◽  
Analysis Technique ◽  
Leakage Failure ◽  
Failure Site

Abstract IR-OBIRCH (Infrared Ray – Optical Beam Induced Resistance Change) is one of the main failure analysis techniques [1] [2] [3] [4]. It is a useful tool to do fault localization on leakage failure cases such as poor Via or contact connection, FEoL or BEoL pattern bridge, and etc. But the real failure sites associated with the above failure mechanisms are not always found at the OBIRCH spot locations. Sometimes the real failure site is far away from the OBIRCH spot and it will result in inconclusive PFA Analysis. Finding the real failure site is what matters the most for fault localization detection. In this paper, we will introduce one case using deep sub-micron process generation which suffers serious high Isb current at wafer donut region. In this case study a BEoL Via poor connection is found far away from the OBIRCH spots. This implies that layout tracing skill and relation investigation among OBIRCH spots are needed for successful failure analysis.

Fault Localization of Power-Ground Short via Signal Injection and Oscilloscope Technique

2010 ◽  
Author(s):  
Binh Nguyen
Keyword(s):  
Low Cost ◽  
Short Circuit ◽  
Fault Localization ◽  
Fault Isolation ◽  
Test Apparatus ◽  
Good Working ◽  
Signal Injection ◽  
Set Up ◽  
Non Destructive ◽  
Short Circuit Condition

Abstract For those attempting fault isolation on computer motherboard power-ground short issues, the optimal technique should utilize existing test equipment available in the debug facility, requiring no specialty equipment as well as needing a minimum of training to use effectively. The test apparatus should be both easy to set up and easy to use. This article describes the signal injection and oscilloscope technique which meets the above requirements. The signal injection and oscilloscope technique is based on the application of Ohm's law in a short-circuit condition. Two experiments were conducted to prove the effectiveness of these techniques. Both experiments simulate a short-circuit condition on the VCC3 power rail of a good working PC motherboard and then apply the signal injection and oscilloscope technique to localize the short. The technique described is a simple, low cost and non-destructive method that helps to find the location of the power-ground short quickly and effectively.

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