Factors affecting the long-term stability of Cu/Al ball bonds subjected to standard and extended high temperature storage

2011 ◽  
Vol 51 (1) ◽  
pp. 137-147 ◽  
Author(s):  
Charles J. Vath ◽  
M. Gunasekaran ◽  
Ramkumar Malliah
Keyword(s):  
High Temperature ◽  
Factors Affecting ◽  
Term Stability ◽  
Long Term Stability ◽  
High Temperature Storage ◽  
Ball Bonds ◽  
Temperature Storage

scholarly journals FCCSP IMC growth under reliability stress follows automotive criteria

2019 ◽  
Vol 3 (1) ◽  
pp. 70-83
Author(s):  
Wei Wei Liu ◽  
Berdy Weng ◽  
Scott Chen
Keyword(s):  
High Temperature ◽  
Flip Chip ◽  
Stress Test ◽  
Temperature Cycling ◽  
Content Type ◽  
Initial Stage ◽  
High Temperature Storage ◽  
Temperature Cycling Test ◽  
Temperature Storage

Purpose The Kirkendall void had been a well-known issue for long-term reliability of semiconductor interconnects; while even the KVs exist at the interfaces of Cu and Sn, it may still be able to pass the condition of unbias long-term reliability testing, especially for 2,000 cycles of temperature cycling test and 2,000 h of high temperature storage. A large number of KVs were observed after 200 cycles of temperature cycling test at the intermetallic Cu3Sn layer which locate between the intermetallic Cu6Sn5 and Cu layers. These kinds of voids will grow proportional with the aging time at the initial stage. This paper aims to compare various IMC thickness as a function of stress test, the Cu3Sn and Cu6Sn5 do affected seriously by heat, but Ni3Sn4 is not affected by heat or moisture. Design/methodology/approach The package is the design in the flip chip-chip scale package with bumping process and assembly. The package was put in reliability stress test that followed AEC-Q100 automotive criteria and recorded the IMC growing morphology. Findings The Cu6Sn5 intermetallic compound is the most sensitive to continuous heat which grows from 3 to 10 µm at high temperature storage 2,000 h testing, and the second is Cu3Sn IMC. Cu6Sn5 IMC will convert to Cu3Sn IMC at initial stage, and then Kirkendall void will be found at the interface of Cu and Cu3Sn IMC, which has quality concerning issue if the void’s density grows up. The first phase to form and grow into observable thickness for Ni and lead-free interface is Ni3Sn4 IMC, and the thickness has little relationship to the environmental stress, as no IMC thickness variation between TCT, uHAST and HTSL stress test. The more the Sn exists, the thicker Ni3Sn4 IMC will be derived from this experimental finding compare the Cu/Ni/SnAg cell and Ni/SnAg cell. Research limitations/implications The research found that FCCSP can pass automotive criteria that follow AEC-Q100, which give the confidence for upgrading the package type with higher efficiency and complexities of the pin design. Practical implications This result will impact to the future automotive package, how to choose the best package methodology and what is the way to do the package. The authors can understand the tolerance for the kind of flip chip package, and the bump structure is then applied for high-end technology. Originality/value The overall three kinds of bump structures, Cu/Ni/SnAg, Cu/SnAg and Ni/SnAg, were taken into consideration, and the IMC growing morphology had been recorded. Also, the IMC had changed during the environmental stress, and KV formation was reserved.

High Temperature Storage Reliability of Bond Resistance of Palladium-Coated Copper Ball Bonds

2017 ◽  
Vol 2017 (1) ◽  
pp. 000432-000437 ◽  
Author(s):  
Michael David Hook ◽  
Michael Mayer ◽  
Stevan Hunter
Keyword(s):  
High Temperature ◽  
Ball Bond ◽  
Wire Bonds ◽  
High Temperature Storage ◽  
Ball Bonding ◽  
Ball Bonds ◽  
Bond Pads ◽  
Wire Resistance ◽  
Temperature Storage

Abstract Reliability of wire bonds made with palladium-coated copper (PCC) wire of 25 μm diameter is studied by measuring the wire bond resistance increase over time in high temperature storage at 225 °C. Ball bonds are made on two bond pad thicknesses and tested with and without mold compound encapsulation. Bond pads are aluminum copper (Al-0.5%Cu), 800 nm and 3000 nm thick. The wirebonding pattern is arranged to facilitate 4-wire resistance measurements of 12 bond pairs in each 28-pin ceramic test package. The ball bonding recipe is optimized to minimize splash on 3000 nm Al-0.5%Cu with shear strength at least 120 MPa. Ball bond diameter is 61 μm and height is 14 μm. Measurements include bond shear test data and in-situ resistance before and during high temperature storage. Bonds on 3000 nm pads are found to be significantly more reliable than bonds on 800 nm pads within 140 h of aging.

scholarly journals Long-Term Stability and Durability of High-Temperature Alloys

JOM ◽  
2014 ◽  
Vol 66 (12) ◽  
pp. 2476-2477
Author(s):  
Chantal K. Sudbrack ◽  
Mark C. Hardy
Keyword(s):  
High Temperature ◽  
Term Stability ◽  
Long Term Stability ◽  
High Temperature Alloys

scholarly journals Factors affecting the long-term stability of mesoporous nickel-based catalysts in combined steam and dry reforming of methane

2016 ◽  
Vol 6 (12) ◽  
pp. 4616-4631 ◽  
Author(s):  
K. Jabbour ◽  
N. El Hassan ◽  
A. Davidson ◽  
S. Casale ◽  
P. Massiani
Keyword(s):  
Dry Reforming ◽  
Coke Deposition ◽  
Dry Reforming Of Methane ◽  
One Pot ◽  
Factors Affecting ◽  
Term Stability ◽  
Long Term Stability ◽  
Highly Efficient ◽  
One Pot Synthesis

Direct “one-pot” synthesis is highly efficient to obtain performing mesoporous Ni–Al2O3catalysts able to resist deactivation by sintering and coke deposition during CH4reforming by CO2and H2O to produce “metgas”.

Nanoindentation Study on Heat Treated Gold Wire Bonding

2016 ◽  
Vol 857 ◽  
pp. 31-35
Author(s):  
Wan Yusmawati Wan Yusoff ◽  
Azman Jalar ◽  
Norinsan Kamil Othman ◽  
Irman Abdul Rahman
Keyword(s):  
High Temperature ◽  
Storage Period ◽  
Gold Wire ◽  
Constant Load ◽  
Wire Bonding ◽  
Nanoindentation Test ◽  
High Temperature Storage ◽  
Gold Ball ◽  
Ball Bonds ◽  
Temperature Storage

The effect of high temperature storage of gold ball bonds towards micromechanical properties has been investigated. Gold wire from thermosonic wire bonding exposed to high temperature storage at 150 °C for 10, 100 and 1000 hours. The nanoindentation test was used in order to evaluate the high temperature storage effect on wire bonding in more details and localized. Prior to nanoindentation test, the specimens were cross-sectioned diagonally. The constant load nanoindentation was performed at the center of gold ball bond to investigate the hardness and reduced modulus. The load-depth curve of nanoindentation for the high temperature storage gold wire has apparent the discontinuity during loading compared to as-received gold wire. The hardness value increased after subjected to high temperature storage. However, the hardness decreased when the storage period is extended. The decreasing in the hardness value may due to the grain size of Au metal which recrystallized after subjected to high temperature storage. The results obtained from nanoindentation is important in assessing the high temperature storage of wire bonding.

Sign in / Sign up

Export Citation Format

Share Document