Board level solder joint reliability analysis of stacked die mixed flip-chip and wirebond BGA

2006 ◽  
Vol 46 (12) ◽  
pp. 2131-2138 ◽  
Author(s):  
Tong Yan Tee ◽  
Hun Shen Ng ◽  
Zhaowei Zhong
Keyword(s):  
Solder Joint ◽  
Reliability Analysis ◽  
Flip Chip ◽  
Solder Joint Reliability ◽  
Joint Reliability ◽  
Board Level

Board level solder joint reliability analysis of a fine pitch Cu post type wafer level package (WLP)

2008 ◽  
Vol 48 (4) ◽  
pp. 602-610 ◽  
Author(s):  
Xiaowu Zhang ◽  
Vaidyanathan Kripesh ◽  
T.C. Chai ◽  
Teck Chun Tan ◽  
D. Pinjala
Keyword(s):  
Solder Joint ◽  
Reliability Analysis ◽  
Wafer Level ◽  
Solder Joint Reliability ◽  
Joint Reliability ◽  
Fine Pitch ◽  
Board Level ◽  
Wafer Level Package

Global-to-Local Modeling and Experiment Investigation of HFCBGA Package Board-Level Solder Joint Reliability

2007 ◽  
Vol 4 (4) ◽  
pp. 186-194 ◽  
Author(s):  
C.I. Chen ◽  
S.C. Wu ◽  
D.S. Liu ◽  
C.Y. Ni ◽  
T. D. Yuan
Keyword(s):  
Solder Joint ◽  
High Speed ◽  
Solder Ball ◽  
Flip Chip ◽  
Global Model ◽  
Solder Joint Reliability ◽  
Joint Reliability ◽  
Local Modeling ◽  
Formidable Challenge ◽  
Board Level

Due to the high speed and high I/O count requirements for semiconductor packages, thousands of soldered interconnections are indispensable, and this situation renders traditional finite element method (FEM) analysis a formidable challenge. This paper presents a 3D-equivalent global model and local submodeling technique to investigate board-level solder joint reliability under cyclic temperature loading. The equivalent global model is capable of addressing critical solder failure locations. An individual local solder ball is used to predict the number of cycles to failure. The high performance flip-chip ball grid array (HFCBGA) package case was studied with the provided experimental data. According to FEM results, the predicted solder ball life is close to that observed experimentally. Therefore, the global-to-local modeling technique can be concluded to provide an efficient methodology for evaluating very high pin count HFCBGA package reliability.

Experimental evaluation of SnAgCu solder joint reliability in 100-μm pitch flip-chip assemblies

2014 ◽  
Vol 54 (5) ◽  
pp. 939-944 ◽  
Author(s):  
Ye Tian ◽  
Xi Liu ◽  
Justin Chow ◽  
Yi Ping Wu ◽  
Suresh K. Sitaraman
Keyword(s):  
Solder Joint ◽  
Experimental Evaluation ◽  
Flip Chip ◽  
Solder Joint Reliability ◽  
Snagcu Solder ◽  
Joint Reliability
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