Effect of deposition conditions on thermo-mechanical properties of free standing silicon-rich silicon nitride thin film

2012 ◽  
Vol 95 ◽  
pp. 34-41 ◽  
Author(s):  
Yun Hwangbo ◽  
Jung-Min Park ◽  
Walter L. Brown ◽  
Jun-Hwan Goo ◽  
Hak-Joo Lee ◽  
...  
Keyword(s):  
Thin Film ◽  
Mechanical Properties ◽  
Silicon Nitride ◽  
Free Standing ◽  
Deposition Conditions

Dynamics of Thin Film NiTi Cantilevers on Si

1993 ◽  
Vol 311 ◽  
Author(s):  
A.Peter Jardine ◽  
Peter G. Mercado
Keyword(s):  
Thin Film ◽  
Mechanical Properties ◽  
Response Times ◽  
Bulk Material ◽  
Fast Response ◽  
Free Standing ◽  
Promising Candidate ◽  
Strain Measurements ◽  
Micro Actuators ◽  
Cycling Time

ABSTRACTAlthough the thermo-mechanical properties of NiTi are well known for bulk material, its deposition and utilization as a thin film are still in their earliest stages of research. The deposition of thin-films of Shape Memory Effect NiTi onto Si(100) wafers offers several advantages over bulk NiTi, including fast response times and comparatively large transformation forces. This has made it a promising candidate material as micro-actuators for Micro-Electro-Mechanical (MEMS) systems as well as for strain measurements. The cycling time for actuation was measured for a 20 μm free standing NiTi thin film cantilever. It was demonstrated that cycling frequencies of up to 50 Hz are achievable.

Optimization of mechanical properties of thin free-standing metal films for RF-MEMS

2004 ◽  
Vol 820 ◽  
Author(s):  
Jaap M.J. den Toonder ◽  
Auke R. van Dijken
Keyword(s):  
Thin Film ◽  
Mechanical Properties ◽  
Yield Strength ◽  
Rf Mems ◽  
High Yield ◽  
Film Material ◽  
X Ray Diffraction ◽  
Free Standing ◽  
Aluminum Films ◽  
Materials Used

AbstractThe mechanical properties of the thin film materials used in RF-MEMS are crucial for the reliability and proper functioning of the devices. In this paper we study a large number of aluminum alloys as possible RF-MEMS thin film materials. The yield strength and creep properties are measured using nano-indentation. The results show that the mechanical properties of thin aluminum films can be improved substantially by alloying elements. Of the alloys studied in this paper, AlCuMgMn in particular seems quite promising as a thin film material for RF MEMS, having both high yield strength and little creep. Using X-ray diffraction and electron microscopy, the observed effects are partly explained.

scholarly journals A Direct Comparison of Three Buckling-Based Methods to Measure the Elastic Modulus of Nanobiocomposite Thin Films

2020 ◽  
Author(s):  
Taylor C. Stimpson ◽  
Daniel A. Osorio ◽  
Emily D. Cranston ◽  
Jose Moran-Mirabal
Keyword(s):  
Thin Film ◽  
Thin Films ◽  
Mechanical Properties ◽  
Elastic Modulus ◽  
Elastic Moduli ◽  
Input Parameter ◽  
Layer By Layer ◽  
Free Standing ◽  
Film Composition ◽  
Parameter Values

<p>To engineer tunable thin film materials, accurate measurement of their mechanical properties is crucial. However, characterizing the elastic modulus with current methods is particularly challenging for sub-micrometer thick films and hygroscopic materials because they are highly sensitive to environmental conditions and most methods require free-standing films which are difficult to prepare. In this work, we directly compared three buckling-based methods to determine the elastic moduli of supported thin films: 1) biaxial thermal shrinking, 2) uniaxial thermal shrinking, and 3) the mechanically compressed, strain-induced elastic buckling instability for mechanical measurements (SIEBIMM) method. Nanobiocomposite model films composed of cellulose nanocrystals (CNCs) and polyethyleneimine (PEI) were assembled using layer-by-layer deposition to control composition and thickness. The three buckling-based methods yielded the same trends and comparable values for the elastic moduli of each CNC-PEI film composition (ranging from 15 – 44 GPa, depending on film composition). This suggests that the methods are similarly effective for the quantification of thin film mechanical properties. Increasing the CNC content in the films statistically increased the modulus, however, increasing the PEI content did not lead to significant changes. The standard deviation of elastic moduli determined from SIEBIMM was 2-4 times larger than for thermal shrinking, likely due to extensive cracking and partial film delamination. In light of these results, biaxial thermal shrinking is recommended as the method of choice because it affords the simplest implementation and analysis and is the least sensitive to small deviations in the input parameter values, such as film thickness or substrate modulus.</p>

Characterization of Sputter-Deposited NiTi Thin Film by Nanoindentation

2015 ◽  
Vol 662 ◽  
pp. 87-90
Author(s):  
Petr Haušild ◽  
Michal Landa
Keyword(s):  
Thin Film ◽  
Mechanical Properties ◽  
Large Scale ◽  
Substrate Surface ◽  
Niti Shape Memory Alloy ◽  
Alloy Thin Film ◽  
Depth Sensing ◽  
Sputter Deposited ◽  
Deposition Conditions

NiTi shape memory alloy thin film sputter-deposited on a large scale silicon wafer was characterized by means of instrumented (depth-sensing) indentation technique. Thickness of deposited thin film was measured by calotest device. Microstructure of thin film was observed using differential interference (Nomarski) contrast. It was shown that the local mechanical properties are different in areas containing different phases (austenite and martensite) according to different deposition conditions (kinetic energy of deposited atoms when impacting the substrate surface).

CHARACTERISTICS OF LOW TEMPERATURE PECVD SILICON NITRIDE FOR MEMS STRUCTURAL MATERIALS

2006 ◽  
Vol 20 (25n27) ◽  
pp. 3799-3804 ◽  
Author(s):  
H. HUANG ◽  
A. SUVOROVA ◽  
K. J. WINCHESTER ◽  
J. M. DELL ◽  
L. FARAONE
Keyword(s):  
Mechanical Properties ◽  
Silicon Nitride ◽  
Low Temperature ◽  
Mechanical Characteristics ◽  
Structural Materials ◽  
Strongly Correlated ◽  
Silicon Nitrides ◽  
Nitrogen Ratio ◽  
Testing Techniques ◽  
Deposition Conditions

Materials and mechanical characteristics of the low temperature PECVD silicon nitrides have been investigated using various analytical and testing techniques. TEM and SEM examinations reveal that there is no distinct microstructural difference existing between the films deposited under different conditions. However, their mechanical properties determined by nanoindentation indicate otherwise. The variations in mechanical properties with deposition conditions are found to be strongly correlated to the change in silicon-to-nitrogen ratio in the film.

scholarly journals Effect of deposition conditions on mechanical properties of low-temperature PECVD silicon nitride films

2006 ◽  
Vol 435-436 ◽  
pp. 453-459 ◽  
Author(s):  
H. Huang ◽  
K.J. Winchester ◽  
A. Suvorova ◽  
B.R. Lawn ◽  
Y. Liu ◽  
...  
Keyword(s):  
Mechanical Properties ◽  
Silicon Nitride ◽  
Low Temperature ◽  
Silicon Nitride Films ◽  
Deposition Conditions
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