Study of electrochemical etch-stop for high-precision thickness control of single-crystal Si in aqueous TMAH : IPA : pyrazine solutions

2008 ◽  
Vol 85 (2) ◽  
pp. 271-277 ◽  
Author(s):  
Gwiy-Sang Chung
Keyword(s):  
Single Crystal ◽  
High Precision ◽  
Thickness Control ◽  
Etch Stop

Study of electrochemical etch-stop for high-precision thickness control of silicon membranes

1989 ◽  
Vol 36 (4) ◽  
pp. 663-669 ◽  
Author(s):  
B. Kloeck ◽  
S.D. Collins ◽  
N.F. de Rooij ◽  
R.L. Smith
Keyword(s):  
High Precision ◽  
Thickness Control ◽  
Etch Stop ◽  
Silicon Membranes

Redetermination of Co4Nb2O9 by single-crystal X-ray methods

2006 ◽  
Vol 62 (5) ◽  
pp. i117-i119 ◽  
Author(s):  
María A. Castellanos R. ◽  
Sylvain Bernès ◽  
Marina Vega-González
Keyword(s):  
Single Crystal ◽  
High Precision ◽  
Cation Distribution ◽  
Crystal Data ◽  
Space Group ◽  
X Ray ◽  
Ray Methods

A high-precision structure of tetracobalt diniobium nonaoxide, Co4Nb2O9, is presented, based on X-ray single-crystal data. The space group and cation distribution previously obtained from powder data [Bertaut, Corliss, Forrat, Aleonard & Pauthenet (1961). J. Phys. Chem. Solids, 21, 234–251] are confirmed.

High-precision thickness control of ice layer on CVD grown bilayer graphene for cryo-TEM

Carbon ◽  
2020 ◽  
Vol 160 ◽  
pp. 107-112 ◽  
Author(s):  
Ryuichi Kato ◽  
Yuri Hatano ◽  
Naoki Kasahata ◽  
Chikara Sato ◽  
Kazu Suenaga ◽  
...  
Keyword(s):  
High Precision ◽  
Bilayer Graphene ◽  
Thickness Control

Research for the Resonator Structure Process Technology of Resonant Pressure Sensors

2014 ◽  
Vol 609-610 ◽  
pp. 1020-1022
Author(s):  
Zheng Yuan Zhang ◽  
Yang Cao ◽  
Yong Mei ◽  
Jian Gen Li ◽  
Zhi Cheng Feng
Keyword(s):  
Surface Roughness ◽  
High Precision ◽  
Silicon Substrate ◽  
Pressure Sensors ◽  
Structure Design ◽  
Process Technology ◽  
Design And Optimization ◽  
Resonator Structure ◽  
Etch Stop ◽  
Koh Etching

The fabrication of butterfly-shape resonator is key for high precision resonator, for requiring suspend on the silicon substrate. This paper is focused on the technology of making butterfly-shape resonator. the variety of structure design can be used to make butterfly-shape resonator have been analyzed, the structure of butterfly-shape resonator is obtained, and for reducing the etch surface roughness, KOH etching conditions, such as composition, concentration, and temperature of etch solution, have been done. Combining with above testing results, the structure design and optimization KOH etching technology are obtained ,based on the technology, using the boron etch stop technique , the silicon butterfly-shape resonator has been done, it can be used effectively in the fabrication of the silicon resonant sensor.

Surface study and thickness control of thin Al2O3 film on Cu–9%Al(111) single crystal

2004 ◽  
Vol 237 (1-4) ◽  
pp. 363-368 ◽  
Author(s):  
Yasuhiro Yamauchi ◽  
Michiko Yoshitake ◽  
Weijie Song
Keyword(s):  
Single Crystal ◽  
Al2o3 Film ◽  
Thickness Control ◽  
Surface Study

Single crystal HPGe (80%) versus BGO shielded CLOVER detector for high precision decay rate measurements: a comparative study

2019 ◽  
Vol 323 (3) ◽  
pp. 1353-1358
Author(s):  
S. Pathak ◽  
P. Das ◽  
A. K. Sikdar ◽  
J. Nandi ◽  
S. Bhattacharyya ◽  
...  
Keyword(s):  
Comparative Study ◽  
Single Crystal ◽  
Decay Rate ◽  
High Precision ◽  
Clover Detector

Study on Precision Slicing Process of Single-Crystal Silicon by Using Dicing Wire Saw

2016 ◽  
Vol 1136 ◽  
pp. 350-356 ◽  
Author(s):  
Takaaki Suzuki ◽  
Toshinori Otsuki ◽  
Ji Wang Yan
Keyword(s):  
Single Crystal ◽  
High Precision ◽  
High Speed ◽  
Single Crystal Silicon ◽  
Crystal Silicon ◽  
Wire Saw ◽  
Hard And Brittle Materials ◽  
Feeding Speed ◽  
Wire Feeding ◽  
Control Technologies

Precision slicing tests were performed for single-crystal silicon by using a newly developed dicing wire saw system and diamond wires. The developed dicing wire saw enables slicing thick workpiece of hard and brittle materials which could not be sliced by conventional dicing machines. To achieve high precision and efficiency, the dicing wire saw system adopted tension control and high speed control technologies which provides a maximum wire feeding speed of 2000m/min. In this study, the diamond wire was driven in a single direction at a speed of 750-1750m/min and the slicing force, wire wear and workpiece surface roughness after slicing were investigated experimentally. The results showed that as a new slicing system, the developed dicing wire saw was useable for high-precision slicing of thick workpiece.

Sign in / Sign up

Export Citation Format

Share Document