Evaluation of rheological properties of lead-free solder pastes and their relationship with transfer efficiency during stencil printing process

2011 ◽  
Vol 32 (6) ◽  
pp. 3189-3197 ◽  
Author(s):  
E.H. Amalu ◽  
N.N. Ekere ◽  
S. Mallik
Keyword(s):  
Rheological Properties ◽  
Lead Free ◽  
Transfer Efficiency ◽  
Lead Free Solder ◽  
Stencil Printing ◽  
Printing Process ◽  
Solder Pastes ◽  
Free Solder

Stencil printing process performance on various aperture size and optimization for lead-free solder paste

2019 ◽  
Vol 102 (9-12) ◽  
pp. 3369-3379 ◽  
Author(s):  
M. S. Rusdi ◽  
M. Z. Abdullah ◽  
S. Chellvarajoo ◽  
M. S. Abdul Aziz ◽  
M. K. Abdullah ◽  
...  
Keyword(s):  
Lead Free ◽  
Lead Free Solder ◽  
Process Performance ◽  
Solder Paste ◽  
Aperture Size ◽  
Stencil Printing ◽  
Printing Process ◽  
Free Solder

scholarly journals Lead-free solder SAC 305 Volume Reduction and Cold Slump after Stencil Printing Process

2020 ◽  
Vol 852 ◽  
pp. 012084
Author(s):  
M. S. Rusdi ◽  
M. Z. Abdullah ◽  
M. S. Abdul Aziz ◽  
M. K. Abdullah ◽  
M.H.H Ishak ◽  
...  
Keyword(s):  
Volume Reduction ◽  
Lead Free ◽  
Lead Free Solder ◽  
Stencil Printing ◽  
Printing Process ◽  
Free Solder
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