Impeding effect of air bubbles on normal grain growth of ice

2012 ◽  
Vol 42 ◽  
pp. 184-193 ◽  
Author(s):  
Nobuhiko Azuma ◽  
Tutomu Miyakoshi ◽  
Syuhei Yokoyama ◽  
Morimasa Takata
Keyword(s):  
Grain Growth ◽  
Air Bubbles

Low Temperature Sintering and Microwave Dielectric Properties of Ba4Nd9.33Ti18O54 Ceramics Doped with Crystallizable Glass

2011 ◽  
Vol 412 ◽  
pp. 280-284
Author(s):  
Ru Zhong Zuo ◽  
Yang Lv ◽  
Yang Wu ◽  
Zhen Xing Yue
Keyword(s):  
Dielectric Properties ◽  
Low Temperature ◽  
Grain Growth ◽  
Sintering Temperature ◽  
Sol Gel ◽  
Microwave Dielectric Properties ◽  
Air Bubbles ◽  
Low Temperature Sintering ◽  
Porous Structures ◽  
Microwave Dielectric

The effect of CaO-B2O3-SiO2 glass on the densification, microstructure and microwave dielectric properties of Ba4Nd9.33Ti18O54 ceramics was investigated in this work. It was found that the addition of a few amount of glass (≤2%) could effectively decrease the sintering temperature owing to the viscous sintering. However, locally porous structures were formed when overmuch glass was added because of enwrapped air bubbles and rapid grain growth. In addition, the amount of remaining glass after sintering could be decreased due to the re-crystallization of CaO-B2O3-SiO2 glass. Sol-gel derived Ba4Nd9.33Ti18O54 ceramics containing 2 wt% glass can be well densified at 950°C and exhibit good microwave dielectric properties of εr=68 and Q×f=7400 GHz.

Grain Refinement in Titanium-Erbium Alloys

1974 ◽  
Vol 32 ◽  
pp. 522-523
Author(s):  
B. B. Rath ◽  
J. E. O'Neal ◽  
R. J. Lederich
Keyword(s):  
Electron Microscopy ◽  
Size Distribution ◽  
Grain Refinement ◽  
Grain Growth ◽  
Volume Fraction ◽  
Pure Titanium ◽  
Systematic Investigation ◽  
Second Phase ◽  
Titanium Matrix ◽  
Average Size

Addition of small amounts of erbium has a profound effect on recrystallization and grain growth in titanium. Erbium, because of its negligible solubility in titanium, precipitates in the titanium matrix as a finely dispersed second phase. The presence of this phase, depending on its average size, distribution, and volume fraction in titanium, strongly inhibits the migration of grain boundaries during recrystallization and grain growth, and thus produces ultimate grains of sub-micrometer dimensions. A systematic investigation has been conducted to study the isothermal grain growth in electrolytically pure titanium and titanium-erbium alloys (Er concentration ranging from 0-0.3 at.%) over the temperature range of 450 to 850°C by electron microscopy.

Microstructural characterization of a rapidly solidified Al-Fe-V-Si alloy for elevated temperature applications

1988 ◽  
Vol 46 ◽  
pp. 550-551
Author(s):  
R. E. Franck ◽  
J. A. Hawk ◽  
G. J. Shiflet
Keyword(s):  
High Temperature ◽  
Elevated Temperature ◽  
Grain Growth ◽  
Volume Fraction ◽  
Microstructural Characterization ◽  
Second Phase ◽  
Microstructural Stability ◽  
Elevated Temperature Strength ◽  
Temperature Applications

Rapid solidification processing (RSP) is one method of producing high strength aluminum alloys for elevated temperature applications. Allied-Signal, Inc. has produced an Al-12.4 Fe-1.2 V-2.3 Si (composition in wt pct) alloy which possesses good microstructural stability up to 425°C. This alloy contains a high volume fraction (37 v/o) of fine nearly spherical, α-Al12(Fe, V)3Si dispersoids. The improved elevated temperature strength and stability of this alloy is due to the slower dispersoid coarsening rate of the silicide particles. Additionally, the high v/o of second phase particles should inhibit recrystallization and grain growth, and thus reduce any loss in strength due to long term, high temperature annealing.The focus of this research is to investigate microstructural changes induced by long term, high temperature static annealing heat-treatments. Annealing treatments for up to 1000 hours were carried out on this alloy at 500°C, 550°C and 600°C. Particle coarsening and/or recrystallization and grain growth would be accelerated in these temperature regimes.

Microstructural Considerations on the Reliability of 3D Packaging

2012 ◽  
Author(s):  
Zhiheng Huang ◽  
Zhiyong Wu ◽  
Hua Xiong ◽  
Yucheng Ma
Keyword(s):  
Mechanical Behavior ◽  
Grain Growth ◽  
Spinodal Decomposition ◽  
Elastic Energy ◽  
Modeling Approach ◽  
3D Packaging ◽  
Ultrafine Interconnects

Abstract Microstructure and its effect on mechanical behavior of ultrafine interconnects have been studied in this paper using a modeling approach. The microstructure from the processes of solidification, spinodal decomposition, and grain growth in ultrafine interconnects has highlighted its importance. The size, geometry and composition of interconnects as well as the elastic energy can influence microstructure and thus the mechanical behavior. Quantification of microstructure in ultrafine interconnects is a necessary step to establish the linkage between microstructure and reliability.

PREDICTION OF GRAIN GROWTH IN HYBRID WELDING HAZ OF TCS STAINLESS STEEL

2013 ◽  
Vol 48 (2) ◽  
pp. 199-204 ◽  
Author(s):  
Zhuanzhuan ZHANG ◽  
Chuansong WU ◽  
Jinqiang Gao
Keyword(s):  
Stainless Steel ◽  
Grain Growth ◽  
Hybrid Welding

On the Abnormal Grain Growth in Pure Magnesium

2018 ◽  
Author(s):  
Risheng Pei ◽  
Sandra Korte-Kerzel ◽  
Talal Al-Samman
Keyword(s):  
Grain Growth ◽  
Abnormal Grain Growth ◽  
Pure Magnesium

Effect of Thermal Stress on Anisotropic Grain Growth in Nano-Twinned and Un-Twinned Copper Films

2020 ◽  
Author(s):  
I-Hsin Tseng ◽  
Yun-Ting Hsu ◽  
Jihperng Leu ◽  
K. N. Tu ◽  
Chih Chen
Keyword(s):  
Thermal Stress ◽  
Grain Growth ◽  
Copper Films

Fabrication of Lead-Free Piezoelectric Ceramics by (Reactive) Templated Grain Growth

2010 ◽  
Vol 1 (3) ◽  
pp. 241-248 ◽  
Author(s):  
Wei Zhao ◽  
Jing Ya ◽  
Ying Xin ◽  
Zhifeng Liu ◽  
Lei E. ◽  
...  
Keyword(s):  
Grain Growth ◽  
Piezoelectric Ceramics ◽  
Lead Free ◽  
Templated Grain Growth
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