scholarly journals Application of a model of plastic porous materials including void shape effects to the prediction of ductile failure under shear-dominated loadings

2016 ◽  
Vol 94 ◽  
pp. 148-166 ◽  
Author(s):  
Léo Morin ◽  
Jean-Baptiste Leblond ◽  
Viggo Tvergaard
Keyword(s):  
Porous Materials ◽  
Ductile Failure ◽  
Shape Effects ◽  
Void Shape

scholarly journals Relevance of Incorporating Cavity Shape Change in Modelling the Ductile Failure of Metals

2018 ◽  
Vol 2018 ◽  
pp. 1-9 ◽  
Author(s):  
Mohand Ould Ouali
Keyword(s):  
Shape Change ◽  
Ductile Failure ◽  
Thermal Heating ◽  
Correct Description ◽  
Ductile Rupture ◽  
Spherical Cavities ◽  
Plastic Dissipation ◽  
Physically Based ◽  
Shape Effects ◽  
Physically Based Modelling

The purpose of this paper is to assess the relevance of considering the cavities shape change in the context of physically based modelling of the ductile rupture in metals. Two thermomechanical models have been used in this study: the GTN model, developed by Gurson, Tvergaard, and Needleman for spherical cavities keeping their shape unchanged during loading, and the GLD model, proposed by Gologanu, Leblond, and Devaux for ellipsoidal cavities that can change their shape. The GTN and GLD models have been extended to take into account material thermal heating due to plastic dissipation. These two constitutive laws have been implemented into the commercial finite element code Abaqus/Explicit in order to simulate the necking of a round bar and the failure of a sheet deep drawing. The results showed the importance of incorporating the shape effects of the cavities for a correct description of the material failure.

Observation and Modelling of Electromigration-Induced Void Growth In AI-Based Interconnects

1993 ◽  
Vol 308 ◽  
Author(s):  
O. Kraft ◽  
S. Bader ◽  
J.E. Sanchez ◽  
E. Arzt
Keyword(s):  
Thin Film ◽  
Failure Mechanism ◽  
Void Growth ◽  
Pure Aluminum ◽  
Failure Mechanisms ◽  
Reflow Process ◽  
Shape Effects ◽  
Substantial Progress ◽  
Void Shape ◽  
Aluminum Interconnects

ABSTRACTAccelerated electromigation tests on unpassivated, pure aluminum interconnects were performed. The failure mechanisms were observed by interrupting the tests and examining the conductor lines using an SEM. Because the metal thin film was subjected to a so-called laser reflow process before patterning, grain boundaries were visible in the SEM as thermal grooves. Voids were observed to move along the line and to grow in a transgranular manner, and a characteristic asymmetric void shape was identified which seems to be related to the failure mechanism. It is argued that substantial progress in modelling and understanding of electromigration failure can be made by consideration of such void shape effects.

scholarly journals Observation and Modelling of Electromigration-Induced Void growth in Al-Based Interconnects

1993 ◽  
Vol 309 ◽  
Author(s):  
O. Kraft ◽  
S. Bader ◽  
J.E. Sanchez ◽  
E. Arzt
Keyword(s):  
Thin Film ◽  
Failure Mechanism ◽  
Void Growth ◽  
Pure Aluminum ◽  
Failure Mechanisms ◽  
Reflow Process ◽  
Shape Effects ◽  
Substantial Progress ◽  
Void Shape ◽  
Aluminum Interconnects

AbstractAccelerated electromigation tests on unpassivated, pure aluminum interconnects were performed. The failure mechanisms were observed by interrupting the tests and exanming the conductor lines using an SEM. Because the metal thin film was subjected to a so-called laser reflow process before patterning, grain boundaries were visible in the SEM as thermal grooves. Voids were observed to move along the line and to grow in a transgranular manner, and a characteristic asymmetric void shape was identified which seems to be related to the failure mechanism. It is argued that substantial progress in modelling and understanding of electromigration failure can be made by consideration of such void shape effects.

Ductile failure of cylindrically porous materials. Part II: other cases of symmetry

2004 ◽  
Vol 23 (2) ◽  
pp. 191-201 ◽  
Author(s):  
J. Pastor ◽  
P. Francescato ◽  
M. Trillat ◽  
E. Loute ◽  
G. Rousselier
Keyword(s):  
Porous Materials ◽  
Ductile Failure
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