scholarly journals Three-layer matrix/sample preparation method for MALDI MS analysis of low nanomolar protein samples

2006 ◽  
Vol 17 (6) ◽  
pp. 780-785 ◽  
Author(s):  
Bernd O. Keller ◽  
Liang Li
Keyword(s):  
Sample Preparation ◽  
Preparation Method ◽  
Maldi Ms ◽  
Sample Preparation Method ◽  
Ms Analysis ◽  
Matrix Sample

Simple and Robust Two-Layer Matrix/Sample Preparation Method for MALDI MS/MS Analysis of Peptides

2005 ◽  
Vol 4 (5) ◽  
pp. 1709-1716 ◽  
Author(s):  
Jing Zheng ◽  
Nan Li ◽  
Marc Ridyard ◽  
Hui Dai ◽  
Stephen M. Robbins ◽  
...  
Keyword(s):  
Sample Preparation ◽  
Preparation Method ◽  
Maldi Ms ◽  
Sample Preparation Method ◽  
Ms Analysis ◽  
Matrix Sample

An improved sample preparation method for the sensitive detection of peptides by MALDI-MS

2013 ◽  
Vol 48 (11) ◽  
pp. 1217-1223 ◽  
Author(s):  
Yusaku Hioki ◽  
Hiroki Kuyama ◽  
Chikako Hamana ◽  
Kohei Takeyama ◽  
Koichi Tanaka
Keyword(s):  
Sample Preparation ◽  
Preparation Method ◽  
Maldi Ms ◽  
Sensitive Detection ◽  
Sample Preparation Method

An automated high-throughput sample preparation method using double-filtration for serum metabolite LC-MS analysis

2019 ◽  
Vol 11 (31) ◽  
pp. 4060-4065 ◽  
Author(s):  
Minjoong Joo ◽  
Jong-Moon Park ◽  
Van-An Duong ◽  
Dami Kwon ◽  
Jongho Jeon ◽  
...  
Keyword(s):  
Sample Preparation ◽  
High Throughput ◽  
Preparation Method ◽  
Sample Preparation Method ◽  
Ms Analysis ◽  
System P ◽  
Filtration System ◽  
Automated Sample Preparation ◽  
Double Filtration

A novel, automated sample preparation method for serum metabolite LC-MS analysis was developed using a double-filtration system.

To Eliminate Curtain Effect of FIB TEM Samples by a Combination of Sample Dicing and Backside Milling

2014 ◽  
Author(s):  
Jian-Shing Luo ◽  
Hsiu Ting Lee
Keyword(s):  
Sample Preparation ◽  
Focused Ion Beam ◽  
Preparation Method ◽  
Low Cost ◽  
Ion Beam ◽  
Sample Preparation Method ◽  
Site Specific ◽  
Dual Beam ◽  
Transmission Electron

Abstract Several methods are used to invert samples 180 deg in a dual beam focused ion beam (FIB) system for backside milling by a specific in-situ lift out system or stages. However, most of those methods occupied too much time on FIB systems or requires a specific in-situ lift out system. This paper provides a novel transmission electron microscopy (TEM) sample preparation method to eliminate the curtain effect completely by a combination of backside milling and sample dicing with low cost and less FIB time. The procedures of the TEM pre-thinned sample preparation method using a combination of sample dicing and backside milling are described step by step. From the analysis results, the method has applied successfully to eliminate the curtain effect of dual beam FIB TEM samples for both random and site specific addresses.

Cross-Section Sample Preparation Method for Imaging Dopant Related Anomalies Using Scanning Probe Microscopy Techniques

2014 ◽  
Author(s):  
Swaminathan Subramanian ◽  
Khiem Ly ◽  
Tony Chrastecky
Keyword(s):  
Sample Preparation ◽  
Failure Analysis ◽  
Cross Section ◽  
Scanning Probe Microscopy ◽  
Preparation Method ◽  
Fault Isolation ◽  
Scanning Probe ◽  
Sample Preparation Method ◽  
Probe Microscopy ◽  
Section Sample

Abstract Visualization of dopant related anomalies in integrated circuits is extremely challenging. Cleaving of the die may not be possible in practical failure analysis situations that require extensive electrical fault isolation, where the failing die can be submitted of scanning probe microscopy analysis in various states such as partially depackaged die, backside thinned die, and so on. In advanced technologies, the circuit orientation in the wafer may not align with preferred crystallographic direction for cleaving the silicon or other substrates. In order to overcome these issues, a focused ion beam lift-out based approach for site-specific cross-section sample preparation is developed in this work. A directional mechanical polishing procedure to produce smooth damage-free surface for junction profiling is also implemented. Two failure analysis applications of the sample preparation method to visualize junction anomalies using scanning microwave microscopy are also discussed.

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