Effect of bonding time on the microstructure and isothermal solidification completion during transient liquid phase bonding of dissimilar nickel-based superalloys IN738LC and Nimonic 75

2015 ◽  
Vol 653 ◽  
pp. 386-394 ◽  
Author(s):  
M. Khakian ◽  
S. Nategh ◽  
S. Mirdamadi
Keyword(s):  
Liquid Phase ◽  
Transient Liquid Phase ◽  
Isothermal Solidification ◽  
Bonding Time ◽  
Transient Liquid Phase Bonding ◽  
Nimonic 75

scholarly journals Transient Liquid Phase Bonding of Semi-Solid Metal 7075 Aluminum Alloy using ZA27 Zinc Alloy Interlayer

Metals ◽  
2018 ◽  
Vol 8 (8) ◽  
pp. 637 ◽  
Author(s):  
Chaiyoot Meengam ◽  
Yongyuth Dunyakul ◽  
Dech Maunkhaw ◽  
Suppachai Chainarong
Keyword(s):  
Aluminum Alloy ◽  
Liquid Phase ◽  
Bonding Strength ◽  
Transient Liquid Phase ◽  
Solid Metal ◽  
Bonding Time ◽  
Zinc Alloy ◽  
Transient Liquid Phase Bonding ◽  
Bonding Zone ◽  
Semi Solid

Transient Liquid Phase Bonding (TLPB) process of semi-solid metal 7075 aluminum alloys (SSM7075) using 50 μm thick of ZA27 zinc alloys as interlayers for the experiment were carried out under bonding temperatures of 480 and 540 °C and bonding times of 30, 60, 90 and 120 min respectively. In the bonding zone, the semi-solid state of ZA27 zinc alloy interlayers were diffused into the SSM7075 aluminum alloy. Examination of the bonding zone using Scanning Electron Microscope (SEM) and Energy-dispersive X-ray spectroscopy (EDS) showed that the precipitation of the intermetallic compound of η(Zn–Al–Cu), β(Al2Mg3Zn3), T′(Zn10Al35Cu55) and MgZn2 were formed in the bonding zone. The better homogenized microstructure in the bonding zone was formed when increasing bonding time and bonding temperature. The highest bonding strength was recorded at 17.44 MPa and average hardness was at 87.67 HV with the bonding time of 120 min and temperature at 540 °C. Statistically, the coefficient of determination analysis of bonding strength data was at 99.1%.

Effect of Bonding Pressure on Transient Liquid Phase Bonding Joint Microstructure and Properties of T91/12Cr2MoWVTiB

2010 ◽  
Vol 97-101 ◽  
pp. 107-110 ◽  
Author(s):  
Si Jie Chen ◽  
Si Jing Guo ◽  
Feng Liang
Keyword(s):  
Liquid Phase ◽  
Transient Liquid Phase ◽  
Optical Microscope ◽  
Isothermal Solidification ◽  
Transient Liquid Phase Bonding ◽  
Bonded Joints ◽  
Electron Microscopic ◽  
Bonding Pressure ◽  
Scanning Electron Microscopic ◽  
Microscopic Techniques

T91/12Cr2MoWVTiB was bonded by transient liquid phase bonding process with different pressures, one commercial FeNiCrSiB was used as the interlayer. The microstructure and components distribution of the bonded joints were examined by optical microscope and scanning electron microscopic techniques. Furthermore, the properties of the joints were also tested. The results indicate that with the increase of the pressure – from 2 MPa to 6 MPa – the microstructures and mechanical properties were improved, and more similar to those base alloys. A theoretical study also revealed that the isothermal solidification complication time can be shorter, because the maximum liquid width was reduced with the existence of pressure.

scholarly journals Transient Liquid Phase Bonding of Ti-6Al-4V and Mg-AZ31 Alloys Using Zn Coatings

Materials ◽  
2019 ◽  
Vol 12 (5) ◽  
pp. 769 ◽  
Author(s):  
Abdulaziz AlHazaa ◽  
Ibrahim Alhoweml ◽  
Muhammad Shar ◽  
Mahmoud Hezam ◽  
Hany Abdo ◽  
...  
Keyword(s):  
Liquid Phase ◽  
Microstructural Analysis ◽  
Transient Liquid Phase ◽  
Isothermal Solidification ◽  
Uniaxial Pressure ◽  
Transient Liquid Phase Bonding ◽  
Vacuum Furnace ◽  
Joint Region ◽  
Ductile Fractures ◽  
Zinc Coatings

Ti-6Al-4V and Mg-AZ31 were bonded together using the Transient Liquid Phase Bonding Process (TLP) after coating both surfaces with zinc. The zinc coatings were applied using the screen printing process of zinc paste. Successful bonds were obtained in a vacuum furnace at 500 °C and under a uniaxial pressure of 1 MPa using high frequency induction heat sintering furnace (HFIHS). Various bonding times were selected and all gave solid joints. The bonds were successfully achieved at 5, 10, 15, 20, 25, and 30 min. The energy dispersive spectroscopy (EDS) line scan confirmed the diffusion of Zn in both sides but with more diffusion in the Mg side. Diffusion of Mg into the joint region was detected with significant amounts at bonds made for 20 min and above, which indicate that the isothermal solidification was achieved. In addition, Ti and Al from the base alloys were diffused into the joint region. Based on microstructural analysis, the joint mechanism was attributed to the formation of solidified mixture of Mg and Zn at the joint region with a presence of diffused Ti and Al. This conclusion was also supported by structural analysis of the fractured surfaces as well as the analysis across the joint region. The fractured surfaces were analyzed and it was concluded that the fractures occurred within the joint region where ductile fractures were observed. The strength of the joint was evaluated by shear test and found that the maximum shear strength achieved was 30.5 MPa for the bond made at 20 min.

Microstructural Evolution of TLP Bonded Ti3Al-Nb Alloy Joints

2014 ◽  
Vol 33 (6) ◽  
pp. 525-529 ◽  
Author(s):  
X.Y. Gu ◽  
Z.Z. Duan ◽  
X.P. Gu ◽  
D.Q. Sun
Keyword(s):  
Solid Solution ◽  
Liquid Phase ◽  
Microstructural Evolution ◽  
Bonding Temperature ◽  
Pure Copper ◽  
Transient Liquid Phase ◽  
Base Material ◽  
Isothermal Solidification ◽  
Bonding Time ◽  
Solid Solution Phase

AbstractIn the present study microstructural evolution in transient liquid phase (TLP) bonded Ti3Al-Nb alloy joints using a pure copper as interlayer was investigated. TLP bonded Ti3Al-Nb alloy joints composed of intermetallic compound layers were produced. Microstructural evolution of joints depended on both bonding time and bonding temperature. With increasing bonding time and bonding temperature, the joint width increased and amount of compounds in the joint decreased. The joint microstructure at 1173 K × 1 min mainly consisted of Ti (solid solution) + Ti2Cu + TiCu + Ti3Cu4 + Ti2Cu3 + TiCu4 + Cu (solid solution) phase and it changed to Ti (solid solution) + Ti2Cu + TiCu at 1223 K × 60 min. Compounds formed on cooling from the bonding temperature by liquid phase were eliminated from the joint at 1223 K × 60 min due to isothermal solidification of liquid phase. The increase of the width of joint is attributed to the composition difference between the isothermal solidification production and its adjacent base material.

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