Experimental investigation on a mechanically pumped two-phase cooling loop with dual-evaporator

2008 ◽  
Vol 31 (7) ◽  
pp. 1176-1182 ◽  
Author(s):  
Liu Jie ◽  
Pei Nian-Qiang ◽  
Guo Kai-Hua ◽  
He Zhen-Hui ◽  
Li Ting-Xuen
Keyword(s):  
Experimental Investigation ◽  
Two Phase ◽  
Cooling Loop ◽  
Two Phase Cooling

Experimental investigation on startup of a novel two-phase cooling loop

2008 ◽  
Vol 32 (4) ◽  
pp. 939-946 ◽  
Author(s):  
Liu Jie ◽  
Nian-qiang Pei ◽  
Kai-hua Guo ◽  
Zhen-hui He ◽  
Ting-xuen Li ◽  
...  
Keyword(s):  
Experimental Investigation ◽  
Two Phase ◽  
Cooling Loop ◽  
Two Phase Cooling

Ultra-Compact Micro-Scale Heat Exchanger for Advanced Thermal Management in Datacenters

2020 ◽  
Author(s):  
Raffaele L. Amalfi ◽  
Todd Salamon ◽  
Filippo Cataldo ◽  
Jackson B. Marcinichen ◽  
John R. Thome
Keyword(s):  
Heat Transfer ◽  
Form Factor ◽  
Heat Exchangers ◽  
Heat Transfer Performance ◽  
Transfer Performance ◽  
Two Phase ◽  
Pressure Drops ◽  
Cooling Technology ◽  
Cooling Loop ◽  
Two Phase Cooling

Abstract The present study is focused on the experimental characterization of two-phase heat transfer performance and pressure drops within an ultra-compact heat exchanger (UCHE) suitable for electronics cooling applications. In this specific work, the UCHE prototype is anticipated to be a critical component for realizing a new passive two-phase cooling technology for high-power server racks, as it is more compact and lighter weight than conventional heat exchangers. This technology makes use of a novel combination of thermosyphon loops, at the server-level and rack-level, to passively cool an entire rack. In the proposed two-phase cooling technology, a smaller form factor UCHE is used to transfer heat from the server-level thermosyphon cooling loop to the rack-level thermosyphon cooling loop, while a larger form factor UCHE is used to reject the total heat from the server rack into the facility-level cooling loop. The UCHE is composed of a double-side-copper finned plate enclosed in a stainless steel enclosure. The geometry of the fins and channels on both sides are optimized to enhance the heat transfer performance and flow stability, while minimizing the pressure drops. These features make the UCHE the ideal component for thermosyphon cooling systems, where low pressure drops are required to achieve high passive flow circulation rates and thus achieve high critical heat flux values. The UCHE’s thermal-hydraulic performance is first evaluated in a pump-driven system at the Laboratory of Heat and Mass Transfer (LTCM-EPFL), where experiments include many configurations and operating conditions. Then, the UCHE is installed and tested as the condenser of a thermosyphon loop that rejects heat to a pumped refrigerant system at Nokia Bell Labs, in which both sides operate with refrigerants in phase change (condensation-to-boiling). Experimental results demonstrate high thermal performance with a maximum heat dissipation density of 5455 (kW/m3/K), which is significantly larger than conventional air-cooled heat exchangers and liquid-cooled small pressing depth brazed plate heat exchangers. Finally, a thermal performance analysis is presented that provides guidelines in terms of heat density dissipations at the server- and rack-level when using passive two-phase cooling.

Optimizing the design for a two-phase cooling loop heat pipe

2016 ◽  
Vol 99 ◽  
pp. 892-904 ◽  
Author(s):  
J. Esarte ◽  
A. Bernardini ◽  
J.M. Blanco ◽  
R. Sancibrian
Keyword(s):  
Heat Pipe ◽  
Loop Heat Pipe ◽  
Two Phase ◽  
Cooling Loop ◽  
Two Phase Cooling

Experimental Analysis of Dual-Evaporators Hybrid Two-Phase Cooling Loop

2012 ◽  
Author(s):  
Chanwoo Park ◽  
Michael Crepinsek
Keyword(s):  
Experimental Analysis ◽  
Heat Input ◽  
Total Heat ◽  
Two Phase ◽  
Mechanical Pump ◽  
The Individual ◽  
Cooling Loop ◽  
Two Phase Cooling

A mechanical pump-assisted and capillary-driven (hybrid) two-phase cooling loop, with dual-evaporators in the same loop placed in parallel and series, was constructed to experimentally investigate the performance of the multi-evaporators cooling loop. This paper discusses various heat input experiments using the dual-evaporators loop that were tested up to 1200 Watts, or 600 Watts (102 W/cm2) for each evaporator. Difficulties and limitations experienced with both parallel and series tests are discussed. It is found from the tests that the total heat inputs in the system determine the system temperatures and pressures and the individual heat input to each evaporator determines the evaporator temperatures. Setting up the evaporators in parallel allows for more cooling than series.

Numerical Simulation of the Mechanically Pumped Two-Phase Cooling Loop

2011 ◽  
Vol 84-85 ◽  
pp. 244-248 ◽  
Author(s):  
Jie Liu ◽  
En Ze Zhou ◽  
Wen Jun Zhao ◽  
Cheng Cheng
Keyword(s):  
Heat Transfer ◽  
Numerical Simulation ◽  
Temperature Control ◽  
Simulation Analysis ◽  
Effective Means ◽  
Heat Transfer Area ◽  
Two Phase ◽  
Robust Solution ◽  
Cooling Loop ◽  
Two Phase Cooling

Two-phase mechanically pumped cooling loop (MPCL) has emerged as a highly effective means for dissipating large amounts of heat from a small heat transfer area and provided a robust solution for significant design with flexibility, precise temperature control, and is othermalization. In this paper, the attempt of design optimization of the work fluid is introduced, by employing thermal simulation analysis with SINDA/FLUINT.

Minipump for Two-Phase Cooling Loop

2000 ◽  
Author(s):  
Joël Maurin ◽  
Jean Benoit ◽  
Jean Duval ◽  
Eric Lorigny ◽  
Eric Werling
Keyword(s):  
Two Phase ◽  
Cooling Loop ◽  
Two Phase Cooling

Fabrication and Thermal Characterization of Novel Copper-CNT Micropillars for Electronics Cooling Applications

2017 ◽  
Author(s):  
Siavash Ghanbari ◽  
Jeff Darabi
Keyword(s):  
Experimental Investigation ◽  
Capillary Pressure ◽  
Thermal Performance ◽  
Material Characterization ◽  
Electronics Cooling ◽  
Thermal Characterization ◽  
Two Phase ◽  
Cooling Systems ◽  
Two Phase Cooling

This paper presents an experimental investigation to study the thermal and material characterization of an array of composite copper-carbon nanotubes (CNT) micropillars for applications in passive two-phase cooling systems. These novel micropillar structures have a larger spacing at the base of the micropillars to provide a higher liquid permeability and mushroom-like structures on the top surface of the micropillars with a smaller spacing to provide a greater capillary pressure. First, composite copper-CNT micropillars are fabricated by an electrodeposition method on a patterned copper template. Then, cauliflower-like nanostructures are grown on the top surface of the micropillars using chronoamperometry technique to improve the capillary pressure and thermal performance of the micropillars. Finally, a series of tests are conducted to quantify the thermal performance of the fabricated micropillars. The results indicate that the performance of mushroom-like composite copper-CNT micropillars is significantly higher than those of copper micropillar arrays.

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