scholarly journals Concrete strains under transient thermal conditions: A state-of-the-art review

2016 ◽  
Vol 127 ◽  
pp. 172-188 ◽  
Author(s):  
Giacomo Torelli ◽  
Parthasarathi Mandal ◽  
Martin Gillie ◽  
Van-Xuan Tran
Keyword(s):  
State Of The Art ◽  
Thermal Conditions ◽  
Transient Thermal

SPH Analysis for Transient Thermal Stress of FGMs with Temperature-Dependent Properties

2015 ◽  
Vol 1096 ◽  
pp. 297-301
Author(s):  
Gui Ming Rong ◽  
Hiroyuki Kisu
Keyword(s):  
Thermal Stress ◽  
Thermal Conditions ◽  
Functionally Graded ◽  
Temperature Dependent ◽  
Graded Materials ◽  
Initial Stage ◽  
Particle Hydrodynamics ◽  
Smoothed Particle ◽  
Temperature Dependent Properties ◽  
Transient Thermal

A formulation using the deviatoric stress and the continuity equation is extended to the analysis of the dynamic response of functionally graded materials (FGMs) subjected to a thermal shock by smoothed particle hydrodynamics (SPH), in which temperature dependent properties of materials are considered. Several dynamic thermal stress problems are analyzed to investigate the fluctuation of thermal stress at the initial stage under three types of thermal conditions, with the addition of two kinds of mechanical boundary conditions.

A Note on the Normalized Approach to Simulating Moisture Diffusion in a Multimaterial System Under Transient Thermal Conditions Using ansys 14 and 14.5

2014 ◽  
Vol 136 (3) ◽  
Author(s):  
Dapeng Liu ◽  
Seungbae Park
Keyword(s):  
Material Property ◽  
Thermal Conditions ◽  
Moisture Diffusion ◽  
Electronic Components ◽  
Current Version ◽  
Temperature Dependent ◽  
Moisture Concentration ◽  
Hygroscopic Swelling ◽  
Packaging Industry ◽  
Transient Thermal

Moisture can have significant effects on the performance and reliability of electronic components. Accurately simulating moisture diffusion is important for designers and manufacturers to obtain a realistic reliability evaluation. Beginning with version 14, ansys is capable of simulating diffusion and related behaviors, such as hygroscopic swelling, with newly developed elements. However, a normalized approach is still required to deal with the discontinuity of concentrations at the material boundaries, and normalization of the moisture concentration in transient thermal conditions is tricky. Case studies have shown that normalizing the moisture concentration with respect to a time- or temperature-dependent material property will lead to erroneous results. This paper re-addresses the issues of performing diffusion simulations under transient thermal conditions and more general anisothermal conditions (temporally and spatially), and suggests an easy-to-use approach to cope with the limitations of the current version for users in the electronic packaging industry.

Investigation of a periodically emitting neodymium glass laser under transient thermal conditions

1975 ◽  
Vol 5 (4) ◽  
pp. 403-405 ◽  
Author(s):  
V A Buchenkov ◽  
B N Kolesnikov ◽  
V M Mit'kin ◽  
D I Perlov ◽  
A I Stepanov
Keyword(s):  
Thermal Conditions ◽  
Glass Laser ◽  
Neodymium Glass ◽  
Transient Thermal

scholarly journals Modeling of Transient Thermal Conditions in Cutting

2017 ◽  
Vol 7 (3) ◽  
Author(s):  
T. Augspurger ◽  
F. Klocke ◽  
B. Döbbeler ◽  
M. Brockmann ◽  
S. Gierlings ◽  
...  
Keyword(s):  
Thermal Conditions ◽  
Transient Thermal

Transient Annealing of Ion-Implanted Silicon Using A Scanning IR Line Source

1982 ◽  
Vol 13 ◽  
Author(s):  
Y.S. Liu ◽  
H.E. Cline ◽  
G.E. Possin ◽  
H.G. Parks ◽  
W. Katz
Keyword(s):  
Line Source ◽  
Laser Annealing ◽  
Thermal Conditions ◽  
Alternative Methods ◽  
High Dose ◽  
Light Sources ◽  
Incoherent Light ◽  
Annealing Conditions ◽  
Transient Thermal ◽  
Ion Implanted

ABSTRACTRecent interest in finding an efficient method for transient annealing of ion-implanted silicon has led to studies of various rapid annealing schemes such as graphite heaters and high intensity incoherent light sources as alternative methods to laser annealing. In this paper, we describe a recent study of transient annealing of ion-implanted silicon using a scanning IR line source created by a single tungsten filament enclosed in a quartz envelope. Various dopants (B+, P+ and As+) with fluences of 1014 to 1016 ions/cm2 were implanted and annealed under both transient and steady-state thermal conditions. Dopant depth distributions were analyzed using the SIMS technique. Sheet resistance measurements indicated that almost 100% activations of the implanted dopants were achieved. Sensitivities of dopant activation to transient annealing conditions were studied as a function of dopant concentrations, and high-dose As- and B-implanted samples were found to be sensitive to transient thermal cycle, particularly to the peak temperature. Recrystallization was studied with Rutherford backscattering spectroscopy using 2 Mev He+ ions.

Transient elastohydrodynamic analysis of elliptical contacts. Part 2: Thermal and Newtonian lubricant solution

2005 ◽  
Vol 219 (3) ◽  
pp. 187-200 ◽  
Author(s):  
P Yang ◽  
J Cui ◽  
Z. M. Jin ◽  
D Dowson
Keyword(s):  
Surface Deformation ◽  
Computing Time ◽  
Elastohydrodynamic Lubrication ◽  
Thermal Conditions ◽  
Processing Unit ◽  
Transient Behaviour ◽  
Isothermal Conditions ◽  
Central Processing ◽  
Time Required ◽  
Transient Thermal

Transient thermal elastohydrodynamic lubrication (EHL) of general elliptical point contacts was investigated numerically in this study. Both entrainment directions along the major and the minor axes of the contact ellipse were considered, together with a transient load impulse. In this study, a Newtonian lubricant was assumed to highlight the thermal influence. The transient solution was achieved at every instant, starting from a steady state thermal EHL solution. At each instant, a multilevel solver was used for pressure and surface deformation, whereas a column-by-column relaxation technique was used for solving temperature. The unknown rigid central distance between the contact bodies was adjusted after each iteration between the transient fields of pressure and temperature, so that in each iteration, only one W cycle was required for pressure and only a few relaxation cycles were required for temperature. With these numerical techniques, the computing time required for a typical transient case was reduced to ∼ 12 h on a personal computer with a 3.0 GHz central processing unit. The transient thermal results were compared with those corresponding to isothermal conditions presented in Part 1 of this series of papers. It was found that, in general, the transient behaviour under thermal conditions was similar to that under isothermal conditions, however, the former was weaker than the latter when the slide-roll ratio was large enough.

scholarly journals Transient Thermal Response of Turbulent Compressible Boundary Layers

2011 ◽  
Vol 133 (8) ◽  
Author(s):  
Hongwei Li ◽  
M. Razi Nalim ◽  
Charles L. Merkle
Keyword(s):  
Boundary Layer ◽  
Steady State ◽  
Laminar Flow ◽  
Thermal Boundary Layer ◽  
Thermal Response ◽  
Thermal Conditions ◽  
Steady State Solution ◽  
Similarity Transformations ◽  
Keller Box Method ◽  
Transient Thermal

A numerical method is developed with the capability to predict transient thermal boundary layer response under various flow and thermal conditions. The transient thermal boundary layer variation due to a moving compressible turbulent fluid of varying temperature was numerically studied on a two-dimensional semi-infinite flat plate. The compressible Reynolds-averaged boundary layer equations are transformed into incompressible form through the Dorodnitsyn–Howarth transformation and then solved with similarity transformations. Turbulence is modeled using a two-layer eddy viscosity model developed by Cebeci and Smith, and the turbulent Prandtl number formulation originally developed by Kays and Crawford. The governing differential equations are discretized with the Keller-box method. The numerical accuracy is validated through grid-independence studies and comparison with the steady state solution. In turbulent flow as in laminar, the transient heat transfer rates are very different from that obtained from quasi-steady analysis. It is found that the time scale for response of the turbulent boundary layer to far-field temperature changes is 40% less than for laminar flow, and the turbulent local Nusselt number is approximately 4 times that of laminar flow at the final steady state.

Non-elastic stresses in composite plates under transient thermal conditions

1968 ◽  
Vol 3 (2) ◽  
pp. 103-108
Author(s):  
D J Lewis ◽  
J S Campbell
Keyword(s):  
Thermal Conditions ◽  
Composite Plates ◽  
Pressure Vessels ◽  
Stress System ◽  
Direct Solution ◽  
Plate Material ◽  
Thermal Transients ◽  
Elastic Stresses ◽  
Water Reactors ◽  
Transient Thermal

The successful use of stainless-steel cladding in the pressure vessels of nuclear water reactors is likely to stimulate interest in the applications of composite-plate material. The high cost of using austenitic materials in corrosive conditions could well make the use of clad materials attractive for certain components. A direct solution has been developed for finding the stresses induced by thermal transients in composite plates for equal biaxial stresses. A computer programme has been written and specimen results are shown. Non-elastic effects are included and residual stresses can be found. The programme can be used in any situation where a shell component has material properties varying through the shell thickness, provided that the stress system is equi-biaxial.

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