Non-enzymatic hydrogen peroxide detection at NiO nanoporous thin film- electrodes prepared by physical vapor deposition at oblique angles

2017 ◽  
Vol 235 ◽  
pp. 534-542 ◽  
Author(s):  
Pedro Salazar ◽  
Victor Rico ◽  
Agustín R. González-Elipe
2017 ◽  
Vol 251 ◽  
pp. 60-70 ◽  
Author(s):  
Noora Isoaho ◽  
Niklas Wester ◽  
Emilia Peltola ◽  
Leena-Sisko Johansson ◽  
Ana Boronat ◽  
...  

2012 ◽  
Vol 1 (1) ◽  
pp. 46 ◽  
Author(s):  
Amir Mahyar Khorasani ◽  
Mohammad Reza Solymany yazdi ◽  
Mehdi Faraji ◽  
Alex Kootsookos

Thin-film coating plays a prominent role on the manufacture of many industrial devices. Coating can increase material performance due to the deposition process. Having adequate and precise model that can predict the hardness of PVD and CVD processes is so helpful for manufacturers and engineers to choose suitable parameters in order to obtain the best hardness and decreasing cost and time of industrial productions. This paper proposes the estimation of hardness of titanium thin-film layers as protective industrial tools by using multi-layer perceptron (MLP) neural network. Based on the experimental data that was obtained during the process of chemical vapor deposition (CVD) and physical vapor deposition (PVD), the modeling of the coating variables for predicting hardness of titanium thin-film layers, is performed. Then, the obtained results are experimentally verified and very accurate outcomes had been attained.


2016 ◽  
Vol 70 (11) ◽  
Author(s):  
Andreas Eder ◽  
Gerwin H.S. Schmid ◽  
Harald Mahr ◽  
Christoph Eisenmenger-Sittner

2018 ◽  
Vol 1 (7) ◽  
pp. 3724-3732 ◽  
Author(s):  
Sebastian C. Dixon ◽  
Joe A. Manzi ◽  
Michael J. Powell ◽  
Claire J. Carmalt ◽  
Ivan P. Parkin

2016 ◽  
Vol 2016 (CICMT) ◽  
pp. 000175-000182
Author(s):  
Carol Putman ◽  
Rachel Cramm Horn ◽  
Ambrose Wolf ◽  
Daniel Krueger

Abstract Low temperature cofired ceramic (LTCC) has been established as an excellent packaging technology for high reliability, high density microelectronics. The functionality and robustness of rework has been increased through the incorporation of a Physical Vapor Deposition (PVD) thin film Ti/Cu/Pt/Au metallization. PVD metallization is suitable for RF (Radio Frequency) applications as well as digital systems. Adhesion of the Ti “adhesion layer” to the LTCC as-fired surface is not well understood. While past work has established extrinsic parameters for delamination mechanisms of thin films on LTCC substrates, there is incomplete information regarding the intrinsic (i.e. thermodynamic) parameters in literature. This paper analyzes the thermodynamic favorability of adhesion between Ti, Cr, and their oxides coatings on LTCC (assumed as amorphous silica glass and Al2O3). Computational molecular calculations are used to determine interface energy as an indication of molecular stability over a range of temperatures. The end result will expand the understanding of thin film adhesion to LTCC surfaces and assist in increasing the long-term reliability of the interface bonding on RF microelectronic layers.


2018 ◽  
Vol 42 (7) ◽  
pp. 5256-5266 ◽  
Author(s):  
Rabia Naeem ◽  
Muhammad Ali Ehsan ◽  
Abdul Rehman ◽  
Zain Hassan Yamani ◽  
Abbas Saeed Hakeem ◽  
...  

Novel p–n SnO–TiO2 nanocomposite film electrodes were fabricated through a single step method and their photoelectrocatalytic properties were evaluated.


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