Local etching of copper films by the Scanning Electrochemical Microscope in the feedback mode: A theoretical and experimental investigation

2011 ◽  
Vol 56 (28) ◽  
pp. 10701-10707 ◽  
Author(s):  
Renaud Cornut ◽  
Sandra Nunige ◽  
Christine Lefrou ◽  
Frédéric Kanoufi
Keyword(s):  
Experimental Investigation ◽  
Copper Films ◽  
Feedback Mode ◽  
Scanning Electrochemical Microscope ◽  
Mode A

scholarly journals Experimental Investigation on Micro Milling of Polyester/Halloysite Nano-Clay Nanocomposites

Nanomaterials ◽  
2019 ◽  
Vol 9 (7) ◽  
pp. 917 ◽  
Author(s):  
Guoyu Fu ◽  
Dehong Huo ◽  
Islam Shyha ◽  
Ketan Pancholi ◽  
Mohd Shahneel Saharudin
Keyword(s):  
Surface Roughness ◽  
Experimental Investigation ◽  
Flank Wear ◽  
Micro Milling ◽  
Clay Nanocomposites ◽  
Workpiece Material ◽  
Ductile Mode ◽  
Nano Clay ◽  
Surface Breakage ◽  
Mode A

Efficient machining of the polyester nanocomposite components requires a better understanding of machinability characteristics of such material, which has become an urgent requirement for modern industrial production. In this research, the micro-milling of polyester/halloysite nano-clay (0.1, 0.3, 0.7, 1.0 wt%) nanocomposites were carried out and the outcomes in terms of tool wear, cutting force, the size effect, surface morphology, and surface roughness were compared with those for plain polyester. In order to accomplish the machining of the material in ductile mode, the required feed per tooth was found to be below 0.3 µm. The degree of surface breakage was also found to decrease in ductile mode. A maximum flank wear VB of 0.012 mm after removing 196 mm3 of workpiece material was measured.

Experimental investigation on wetting process of water droplets on micro-/nanoporous copper films

2015 ◽  
Vol 120 (1) ◽  
pp. 255-263 ◽  
Author(s):  
Limei Miao ◽  
Longsheng Lu ◽  
Ting Fu ◽  
Yong Tang ◽  
Biao Tang
Keyword(s):  
Experimental Investigation ◽  
Copper Films ◽  
Water Droplets ◽  
Nanoporous Copper ◽  
Wetting Process

Experimental Investigation on the Roles of Chemical Corrosion and Mechanical Polishing on Copper CMP

2004 ◽  
Author(s):  
Jhy-Cherng Tsai ◽  
Yaw-Yi Shieh ◽  
Ming-Shih Tsai ◽  
Bau-Tong Dai
Keyword(s):  
Experimental Investigation ◽  
Corrosion Rate ◽  
Removal Rate ◽  
Copper Film ◽  
Mechanical Polishing ◽  
Copper Films ◽  
Linear Superposition ◽  
Chemical Corrosion ◽  
The Relationship ◽  
Better Than

This paper is an experimental investigation on the roles of chemical corrosion and mechanical polishing of the chemical mechanical polishing (CMP) of wafers with copper film of 1,000 nm thickness. Three types of experiments are designed and conducted: chemical corrosion, mechanical polishing, and CMP with φ0.3μm Al2O3 as abrasives. The results showed that copper films after PVD and annealing sustain tensile stress that intensifies corrosion rate. In general, the stress of copper film increases at higher annealing temperature and the corrosion rate increases correspondingly though the relationship is weak. The polishing rate of pure mechanical polishing is about the same as that of pure chemical corrosion, but surface roughness of mechanical polishing and CMP are much better than that of chemical corrosion. Furthermore, the removal rate of mechanical polishing and chemical corrosion, about 2nm/min, are relatively low compared to that of CMP, about 30nm/min, it indicates that the removal mechanism of CMP is not simply a linear superposition of chemical corrosion and mechanical polishing. The strong interaction and the combined reaction of chemical corrosion and mechanical polishing need further investigation.

Do moods and expectancies have unique or interactive effects?: An experimental investigation

2014 ◽  
Author(s):  
Shane Close ◽  
Victoria Adkins ◽  
Kandice Perry ◽  
Katheryn Eckles ◽  
Jill Brown ◽  
...  
Keyword(s):  
Experimental Investigation ◽  
Interactive Effects

Therapy research as a feedback mode in the training of therapists

1977 ◽  
Author(s):  
Peter R. Kilmann ◽  
Albert W. Scovern ◽  
Gregory D. Roeder ◽  
Alexander F. Julian
Keyword(s):  
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