On the use of SKPFM for in situ studies of the repassivation of the native oxide film on aluminium in air

2018 ◽  
Vol 93 ◽  
pp. 162-165 ◽  
Author(s):  
Reynier I. Revilla ◽  
Herman Terryn ◽  
Iris De Graeve
Keyword(s):  
Oxide Film ◽  
Native Oxide ◽  
In Situ Studies

In-Situ Studies of the Oxide Film Properties on BWR Fuel Cladding Materials

2008 ◽  
pp. 367-367-19 ◽  
Author(s):  
M Bojinov ◽  
L Hansson-Lyyra ◽  
P Kinnunen ◽  
T Saario ◽  
P Sirkiä
Keyword(s):  
Oxide Film ◽  
Fuel Cladding ◽  
Film Properties ◽  
In Situ Studies

Quasi-in-situ observing the growth of native oxide film on the FeCr15Ni15 austenitic alloy by TEM

2018 ◽  
Vol 140 ◽  
pp. 1-7 ◽  
Author(s):  
B. Zhang ◽  
X.Y. San ◽  
X.X. Wei ◽  
B. Wu ◽  
S.J. Zheng ◽  
...  
Keyword(s):  
Oxide Film ◽  
Native Oxide ◽  
Austenitic Alloy

In-Situ Studies of the Oxide Film Properties on BWR Fuel Cladding Materials

2005 ◽  
Vol 2 (4) ◽  
pp. 12820 ◽  
Author(s):  
M Bojinov ◽  
L Hansson-Lyyra ◽  
P Kinnunen ◽  
T Saario ◽  
P Sirkiä
Keyword(s):  
Oxide Film ◽  
Fuel Cladding ◽  
Film Properties ◽  
In Situ Studies

Preparation of integrated circuits for TEM electromigration in situ studies

1986 ◽  
Vol 44 ◽  
pp. 882-883
Author(s):  
J. V. Maskowitz ◽  
W. E. Rhoden ◽  
D. R. Kitchen ◽  
R. E. Omlor ◽  
P. F. Lloyd
Keyword(s):  
Integrated Circuits ◽  
Crystallographic Orientation ◽  
Silicon Wafers ◽  
Minimum Size ◽  
Test Vehicle ◽  
In Situ Studies ◽  
Boron Doped ◽  
Doped Silicon ◽  
Drill Holes

The fabrication of the aluminum bridge test vehicle for use in the crystallographic studies of electromigration involves several photolithographic processes, some common, while others quite unique. It is most important to start with a clean wafer of known orientation. The wafers used are 7 mil thick boron doped silicon. The diameter of the wafer is 1.5 inches with a resistivity of 10-20 ohm-cm. The crystallographic orientation is (111).Initial attempts were made to both drill and laser holes in the silicon wafers then back fill with photoresist or mounting wax. A diamond tipped dentist burr was used to successfully drill holes in the wafer. This proved unacceptable in that the perimeter of the hole was cracked and chipped. Additionally, the minimum size hole realizable was > 300 μm. The drilled holes could not be arrayed on the wafer to any extent because the wafer would not stand up to the stress of multiple drilling.

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