Silicon surface texturing by electro-deoxidation of a thin silica layer in molten salt

2010 ◽  
Vol 12 (10) ◽  
pp. 1270-1274 ◽  
Author(s):  
Eimutis Juzeliunas ◽  
Antony Cox ◽  
Derek J. Fray
Keyword(s):  
Molten Salt ◽  
Silicon Surface ◽  
Surface Texturing ◽  
Silica Layer

scholarly journals Nanotexturing of Silicon by Metal-Assisted Chemical Etching

2015 ◽  
Vol 16 (1) ◽  
pp. 140-144
Author(s):  
Ye. I. Berezhanskyi ◽  
S. I. Nichkalo ◽  
V. Yu. Yerokhov ◽  
A. A. Druzhynin
Keyword(s):  
Chemical Etching ◽  
Silicon Surface ◽  
High Efficiency ◽  
Surface Texturing ◽  
Geometric Parameters ◽  
Silicon Surfaces ◽  
Photovoltaic Converter ◽  
Efficient Approach ◽  
Metal Assisted Chemical Etching

This paper describes the method of metal assisted chemical etching (MacEtch) as an efficient approach for structuring the silicon surface with the ability to manage effectively the geometric parameters of the structures and their distribution on the surface of substrate. The surface texturing technology was presented and the structured silicon surfaces with regular and irregular types of surfaces have been obtained. This technology can be used for nanotexturing of the surface of silicon photovoltaic converters. The model of photovoltaic converter based on the crater-textured silicon surface with high efficiency was presented.

Solar Cell Surface Texturing Combined Wet Etching and Ultrasonic Vibration

2010 ◽  
Vol 37-38 ◽  
pp. 1210-1213 ◽  
Author(s):  
Yan Chao ◽  
Yu Tao Wu ◽  
Jie Yu ◽  
Li Qun Wu
Keyword(s):  
Solar Cell ◽  
Ultrasonic Vibration ◽  
Social Life ◽  
Silicon Surface ◽  
Molecular Motion ◽  
Surface Texturing ◽  
Wet Etching ◽  
New Approach ◽  
Pyramid Structure

With the development of economy and society, more and more energy is needed to meet the requirement of industries and social life. It is necessary to find new types of energy that is clear, high effective and non-polluted. Although wet etching is widely used in industries to prepare the silicon surface texture, the etching process is stochastic and the influence light is trapping. Many efforts have been made, such as adjusting the proportion of different acids, to improve the quality of silicon surface by wet etching, the effectiveness is still limited. In this paper, a new approach is presented to prepare the surface texturing. By combining wet etching and ultrasonic vibration, the sodium or acid molecular motion can be controlled, and the pyramid structure in silicon surface can be made regular.

Solar Cell Fabrication by Wet Etching Combined with Ultrasonic Vibration for Multicrystalline Silicon

2011 ◽  
Vol 216 ◽  
pp. 596-599 ◽  
Author(s):  
Li Qun Wu ◽  
Yan Chao ◽  
Xiao Lu Luo
Keyword(s):  
Ultrasonic Vibration ◽  
Social Life ◽  
Silicon Surface ◽  
Light Trapping ◽  
Surface Texturing ◽  
Wet Etching ◽  
New Approach ◽  
Pyramid Structure ◽  
Cell Fabrication

With the development of economy and society, more and more energy is needed to meet the requirement of industries and social life. It is necessary to find new types of energy that is clear, high effective and non-polluted. Although wet etching is widely used in industries to prepare the silicon surface texture, the etching process is stochastic and the influence light trapping. Many efforts have been made such as adjusting the proportion of different acids, to improve the quality of silicon surface by wet etching, the result does not meet the ideal requirement by now. In this paper, a new approach is presented to prepare the surface texturing. By combining wet etching and ultrasonic vibration, the sodium or acid molecular motion can be controlled, and the pyramid structure in silicon surface can be made regular.

scholarly journals Silicon surface texturing for enhanced nanocrystalline diamond seeding efficiency

2013 ◽  
Vol 23 (2) ◽  
pp. 86-92 ◽  
Author(s):  
Jong Cheon Park ◽  
Ok Geun Jeong ◽  
Sang Youn Kim ◽  
Se Jin Park ◽  
Young-Hoon Yun ◽  
...  
Keyword(s):  
Silicon Surface ◽  
Surface Texturing ◽  
Nanocrystalline Diamond ◽  
Seeding Efficiency

Silicon Surface Texturization Mechanism by Hydrogen Radicals Using Tungsten Hot Filament

2005 ◽  
Vol 891 ◽  
Author(s):  
Hiroshi Nagayoshi ◽  
Hiroaki Sato ◽  
Suzuka Nishimura ◽  
Kazutaka Terashima
Keyword(s):  
Silicon Surface ◽  
Particle Deposition ◽  
Surface Texturing ◽  
Tungsten Particle ◽  
Particle Layer ◽  
Silicon Hydrides ◽  
Hydrogen Radical ◽  
Hydrogen Radicals ◽  
Hot Filament ◽  
Short Time

ABSTRACTThis paper describes the surface texturing mechanism on crystalline Si using hydrogen radicals generated by a tungsten hot filament. Inverted pyramid or labyrinthV groove structure could be obtained by particle deposition before etching. Mesh like tungsten particle layer, works as an etching mask against hydrogen radical, was obtained when silicon substrate was used. On the other hand, tungstem particles were not deposited as mesh like pattern when SiO2/Si substrate was used. The results suggest that evaporation of silicon hydrides from the silicon surface by hydrogen radical etching causes the mesh like pattern deposition of tungsten particles. Increase of filament current enables short time texturing process of less than 1 minute.

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