Core-shell structured BN/PPS composite film for high thermal conductivity with low filler concentration

2016 ◽  
Vol 134 ◽  
pp. 209-216 ◽  
Author(s):  
Kiho Kim ◽  
Jooheon Kim
Keyword(s):  
Thermal Conductivity ◽  
Composite Film ◽  
High Thermal Conductivity ◽  
Filler Concentration ◽  
Core Shell

A combination of nanodiamond and boron nitride for the preparation of polyvinyl alcohol composite film with high thermal conductivity

Polymer ◽  
2020 ◽  
Vol 206 ◽  
pp. 122885 ◽  
Author(s):  
Kechen Zhao ◽  
Gang Liu ◽  
Wenxin Cao ◽  
Zhenhua Su ◽  
Jiwen Zhao ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Boron Nitride ◽  
Polyvinyl Alcohol ◽  
Composite Film ◽  
High Thermal Conductivity

scholarly journals Aerogel Perfusion-Prepared h-BN/CNF Composite Film with Multiple Thermally Conductive Pathways and High Thermal Conductivity

Nanomaterials ◽  
2019 ◽  
Vol 9 (7) ◽  
pp. 1051 ◽  
Author(s):  
Xiu Wang ◽  
Zhihuai Yu ◽  
Liang Jiao ◽  
Huiyang Bian ◽  
Weisheng Yang ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Composite Film ◽  
Hexagonal Boron Nitride ◽  
Traditional Approach ◽  
Synthetic Polymer ◽  
Electrical Insulation ◽  
High Thermal Conductivity ◽  
Polymer Materials ◽  
Thermally Conductive ◽  
Electrical Insulation Properties

Hexagonal boron nitride (h-BN)-based heat-spreading materials have drawn considerable attention in electronic diaphragm and packaging fields because of their high thermal conductivity and desired electrical insulation properties. However, the traditional approach to fabricate thermally conductive composites usually suffers from low thermal conductivity, and cannot meet the requirement of thermal management. In this work, novel h-BN/cellulose-nano fiber (CNF) composite films with excellent thermal conductivity in through plane and electrical insulation properties are fabricated via an innovative process, i.e., the perfusion of h-BN into porous three dimensional (3D) CNF aerogel skeleton to form the h-BN thermally conductive pathways by filling the CNF aerogel voids. When at an h-BN loading of 9.51 vol %, the thermal conductivity of h-BN/CNF aerogel perfusion composite film is 1.488 W·m−1·K−1 at through plane, an increase by 260.3%. The volume resistivity is 3.83 × 1014 Ω·cm, superior to that of synthetic polymer materials (about 109~1013 Ω·cm). Therefore, the resulting h-BN/CNF film is very promising to replace the traditional synthetic polymer materials for a broad spectrum of applications, including the field of electronics.

scholarly journals Functionalized Multiwalled Carbon Nanotube-Reinforced Polyimide Composite Films with Enhanced Mechanical and Thermal Properties

2019 ◽  
Vol 2019 ◽  
pp. 1-12 ◽  
Author(s):  
Min Chao ◽  
Yanming Li ◽  
Guanglei Wu ◽  
Zhenjun Zhou ◽  
Luke Yan
Keyword(s):  
Thermal Conductivity ◽  
Carbon Nanotube ◽  
Composite Film ◽  
Composite Films ◽  
Conductive Filler ◽  
Filler Loading ◽  
Multiwalled Carbon Nanotube ◽  
High Thermal Conductivity ◽  
Mechanical And Thermal Properties ◽  
Multiwalled Carbon

Polyimide- (PI-) based nanocomposites containing the 4,4′-diaminodiphenyl ether- (ODA-) modified multiwalled carbon nanotube (MWCNT) filler were successfully prepared. The PI/MWCNTs-ODA composite films exhibit high thermal conductivity and excellent mechanical property. The optimal value of thermal conductivity of the PI/MWCNTs-ODA composite film is 0.4397 W/mK with 3 wt.% filler loading, increased by 221.89% in comparison with that of the pure PI film. In addition, the tensile strength of the PI/MWCNTs-ODA composite film is 141.48 MPa with 3 wt.% filler loading, increased by 20.74% in comparison with that of the pure PI film. This work develops a new strategy to achieve a good balance between the high thermal conductivity and excellent mechanical properties of polyimide composite films by using functionalized carbon nanotubes as an effective thermal conductive filler.

Enhancing the thermoelectric properties of SnTe via introducing PbTe@C core–shell nanostructures

2021 ◽  
Author(s):  
Jingwen Zhang ◽  
song li ◽  
zhengyi zhu ◽  
Zhenwang Wu ◽  
Jiuxing Zhang
Keyword(s):  
Thermal Conductivity ◽  
Seebeck Coefficient ◽  
Thermoelectric Properties ◽  
Hole Concentration ◽  
High Thermal Conductivity ◽  
Concentration Limit ◽  
Core Shell ◽  
Metal Chalcogenides ◽  
Shell Nanostructures ◽  
High Hole Concentration

SnTe is an emerging IV–VI metal chalcogenides, but its low Seebeck coefficient and high thermal conductivity mainly originating from the high hole concentration limit its thermoelectric performance. In this work,...

Cellulose/boron nitride core–shell microbeads providing high thermal conductivity for thermally conductive composite sheets

RSC Advances ◽  
2016 ◽  
Vol 6 (39) ◽  
pp. 33036-33042 ◽  
Author(s):  
Shoji Nagaoka ◽  
Takuma Jodai ◽  
Yoshihiro Kameyama ◽  
Maki Horikawa ◽  
Tomohiro Shirosaki ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Boron Nitride ◽  
High Thermal Conductivity ◽  
Core Shell ◽  
Conductive Network ◽  
Conductive Composite ◽  
Thermally Conductive

Formation of a thermal conductive network in resin sheet hybridized cellulose/BN core–shell microbeads.

scholarly journals An Integrated Approach to Design and Develop High-Performance Polymer-Composite Thermal Interface Material

Polymers ◽  
2021 ◽  
Vol 13 (5) ◽  
pp. 807
Author(s):  
Syed Sohail Akhtar
Keyword(s):  
Thermal Conductivity ◽  
Aspect Ratio ◽  
High Performance ◽  
High Thermal Conductivity ◽  
Thermal Interface Material ◽  
Design Stage ◽  
Filler Concentration ◽  
Melt Mixing ◽  
Thermal Interface ◽  
Wide Range

A computational framework based on novel differential effective medium approximation and mean-field homogenization is used to design high-performance filler-laden polymer thermal interface materials (TIMs). The proposed design strategy has the capability to handle non-dilute filler concentration in the polymer matrix. The effective thermal conductivity of intended thermal interface composites can be tailored in a wide range by varying filler attributes such as size, aspect ratio, orientation, as well as filler–matrix interface with an upper limit imposed by the shear modulus. Serval potential polymers and fillers are considered at the design stage. High-density polyethylene (HDPE) and thermoplastic polyurethane (TPU) with a non-dilute concentration (~60 vol%) of ceramic fillers exhibit high thermal conductivity (4–5 W m−1 K−1) without compromising the high compliance of TIMs. The predicted thermal conductivity and coefficient of thermal expansion are in excellent agreement with measured data of various binary composite systems considering HDPE, TPU, and polypropylene (PP) loaded with Al2O3 and AlN fillers in varying sizes, shapes, and concentrations, prepared via the melt-mixing and compression-molding route. The model also validates that manipulating filler alignment and aspect ratio can significantly contribute to making heat-conducting networks in composites, which results in ultra-high thermal conductivity.

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