Covalent polymer functionalization of graphene for improved dielectric properties and thermal stability of epoxy composites

2016 ◽  
Vol 122 ◽  
pp. 27-35 ◽  
Author(s):  
Yan-Jun Wan ◽  
Wen-Hu Yang ◽  
Shu-Hui Yu ◽  
Rong Sun ◽  
Ching-Ping Wong ◽  
...  
Keyword(s):  
Thermal Stability ◽  
Dielectric Properties ◽  
Epoxy Composites ◽  
Thermal Stability Of

scholarly journals Effect of Nanodiamond Particles on Properties of Epoxy Composites

2008 ◽  
Vol 17 (1) ◽  
pp. 096369350801700 ◽  
Author(s):  
Zdeno Špitalský ◽  
Alexander Kromka ◽  
Libor Matějka ◽  
Peter Černoch ◽  
Jana Kovářová ◽  
...  
Keyword(s):  
Thermal Stability ◽  
Epoxy Composites ◽  
Neat Epoxy ◽  
Light Transmittance ◽  
Cross Linking ◽  
Amino Groups ◽  
Multiwalled Carbon ◽  
Epoxy Network ◽  
Epoxy Nanocomposite ◽  
Thermal Stability Of

The epoxy nanocomposites filled with 0.1, 0.5, and 1 wt% nanodiamonds (nanoD) were prepared and their properties were compared with neat epoxy network or epoxy nanocomposite filled with 1 wt% multiwalled carbon nanotubes (MWCNTs). The obtained nanoD-epoxy composites increased significantly thermal stability of prepared nanocomposites in comparison with neat epoxy matrix. The exponential decay of light transmittance with increasing concentration of nanoD in sample was observed. The values of storage modulus G` and glass transition temperature Tg significantly decreased by addition of nanoD to epoxy network. This is caused by inhibition of cross-linking reaction of epoxy- and amino- groups by nanoD.

The Thermal Stability of Fluorine Doped Silicon Oxide Films Formed by Ecrcvd With SiF4 and O2 Gases

1996 ◽  
Vol 443 ◽  
Author(s):  
Seoghyeong Lee ◽  
Jae-Yoon Yoo ◽  
Jong-Wan Park
Keyword(s):  
Thermal Stability ◽  
Dielectric Properties ◽  
Plasma Treatment ◽  
Exposure Time ◽  
Moisture Absorption ◽  
Silicon Oxide ◽  
Reliability Test ◽  
Air Exposure ◽  
Doped Silicon ◽  
Thermal Stability Of

AbstractThe reliability of SiOF films for intermetal dielectrics in multilevel interconnections of ULSIs is investigated. SiOF films were deposited by ECRCVD using H-free source gases, i.e., SiF4 and O2. The effect of post plasma treatment on the moisture absorption and dielectric properties of SiOF films were carried out in terms of air exposure time. The reliability test of Cu / TiN / SiOF / Si specimen was carried out in terms of temperatures by RTA in N2 ambient. After O2 plasma treatment, no appreciable peak directly related to moisture absorption was detected. The C-V characteristics of the O2 plasma treated SiOF film showed that the film remained to hold the sound dielectric properties even after boiling treatment. The Cu / TiN / SiOF / Si system was found to be reliable up to 600 °C.

Effect of silica content on thermal stability of fumed silica/epoxy composites

2008 ◽  
Vol 93 (12) ◽  
pp. 2133-2137 ◽  
Author(s):  
J. Tarrío-Saavedra ◽  
J. López-Beceiro ◽  
S. Naya ◽  
R. Artiaga
Keyword(s):  
Thermal Stability ◽  
Fumed Silica ◽  
Silica Content ◽  
Epoxy Composites ◽  
Thermal Stability Of

scholarly journals Thermal and Mechanical Interfacial Behaviors of Graphene Oxide-Reinforced Epoxy Composites Cured by Thermal Latent Catalyst

Materials ◽  
2019 ◽  
Vol 12 (8) ◽  
pp. 1354 ◽  
Author(s):  
Shahina Riaz ◽  
Soo-Jin Park
Keyword(s):  
Thermal Stability ◽  
Fracture Toughness ◽  
Graphene Oxide ◽  
Mechanical Performance ◽  
Gradual Increase ◽  
Diglycidyl Ether ◽  
Crack Deflection ◽  
Epoxy Composites ◽  
Curing Agent ◽  
Thermal Stability Of

A series of composites was prepared from a diglycidyl ether of bisphenol A (DGEBA) with different graphene filler contents to improve their mechanical performance and thermal stability. Graphene oxide (GO) and GO modified with hexamethylene tetraamine (HMTA) were selected as reinforcing agents. As a latent cationic initiator and curing agent, N-benzylepyrizinium hexafluoroantimonate (N-BPH) was used. The effect of fillers and their contents on the mechanical properties and thermal stability of the composites were studied. Fracture toughness improved by 23% and 40%, and fracture energy was enhanced by 1.94- and 2.27-fold, for the composites containing 0.04 wt.% GO and HMTA-GO, respectively. The gradual increase in fracture toughness at higher filler contents was attributed to both crack deflection and pinning mechanisms. Maximum thermal stability in the composites was achieved by using up to 0.1 wt.% graphene fillers.

High thermal stability of RF dielectric properties of BiVO4 matrix with added ZnO

2020 ◽  
Author(s):  
R. G. M. Oliveira ◽  
D. C. Souza ◽  
J. E. V. de Morais ◽  
G. S. Batista ◽  
M. A. S. Silva ◽  
...  
Keyword(s):  
Thermal Stability ◽  
Dielectric Properties ◽  
High Thermal Stability ◽  
Thermal Stability Of

scholarly journals Mechanical Property and Thermal Stability of Epoxy Composites Containing Poly(ether sulfone)

Polymer Korea ◽  
2015 ◽  
Vol 39 (3) ◽  
pp. 426-432
Author(s):  
Si-Eun Lee ◽  
Mi-Seon Park ◽  
Euigyung Jeong ◽  
Man Young Lee ◽  
Min-Kyung Lee ◽  
...  
Keyword(s):  
Mechanical Property ◽  
Thermal Stability ◽  
Epoxy Composites ◽  
Thermal Stability Of
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