Enhanced adhesion between polyethylene terephthalate and metal film by surface fluorination

2018 ◽  
Vol 10 ◽  
pp. 205-208 ◽  
Author(s):  
Jae-Ho Kim ◽  
Masanari Namie ◽  
Susumu Yonezawa
Keyword(s):  
Polyethylene Terephthalate ◽  
Metal Film ◽  
Surface Fluorination

Surface fluorination of polyethylene terephthalate films with RF plasma

2004 ◽  
Vol 58 (5) ◽  
pp. 650-653 ◽  
Author(s):  
Tzong-Shing Cheng ◽  
Hsiao-Tsung Lin ◽  
Miao-Ju Chuang
Keyword(s):  
Polyethylene Terephthalate ◽  
Rf Plasma ◽  
Surface Fluorination

scholarly journals Optical performance improvement of semi-transparent metal film electrodes with biomimetic subwavelength gratings for high-performance optoelectronic device applications

RSC Advances ◽  
2015 ◽  
Vol 5 (103) ◽  
pp. 84865-84871 ◽  
Author(s):  
Minkyu Choi ◽  
Jung Woo Leem ◽  
Jae Su Yu
Keyword(s):  
Polymer Film ◽  
Performance Improvement ◽  
Polyethylene Terephthalate ◽  
Metal Film ◽  
High Performance ◽  
Optoelectronic Device ◽  
Optical Performance ◽  
Metal Electrodes ◽  
Subwavelength Gratings ◽  
Device Applications

Semi-transparent metal electrodes consisting of silver-coated subwavelength gratings on polymer film/polyethylene terephthalate substrates for high-performance optoelectronic device applications.

Enhanced Adhesion Strength between Silicon Substrate and Metal Film by Surface Fluorination

2017 ◽  
Vol 46 (11) ◽  
pp. 1643-1645
Author(s):  
Fumihiro Nishimura ◽  
Jae-Ho Kim ◽  
Susumu Yonezawa
Keyword(s):  
Adhesion Strength ◽  
Silicon Substrate ◽  
Metal Film ◽  
Surface Fluorination

The method of replication affects metal film granularity and resolution

1989 ◽  
Vol 47 ◽  
pp. 708-709
Author(s):  
George C. Ruben
Keyword(s):  
Electron Beam ◽  
High Resolution ◽  
Film Thickness ◽  
Single Molecule ◽  
Metal Film ◽  
Vertical Surface ◽  
High Resolution Imaging ◽  
Controllable Factors ◽  
Resolution Imaging

Single molecule resolution in electron beam sensitive, uncoated, noncrystalline materials has been impossible except in thin Pt-C replicas ≤ 150Å) which are resistant to the electron beam destruction. Previously the granularity of metal film replicas limited their resolution to ≥ 20Å. This paper demonstrates that Pt-C film granularity and resolution are a function of the method of replication and other controllable factors. Low angle 20° rotary , 45° unidirectional and vertical 9.7±1 Å Pt-C films deposited on mica under the same conditions were compared in Fig. 1. Vertical replication had a 5A granularity (Fig. 1c), the highest resolution (table), and coated the whole surface. 45° replication had a 9Å granulartiy (Fig. 1b), a slightly poorer resolution (table) and did not coat the whole surface. 20° rotary replication was unsuitable for high resolution imaging with 20-25Å granularity (Fig. 1a) and resolution 2-3 times poorer (table). Resolution is defined here as the greatest distance for which the metal coat on two opposing faces just grow together, that is, two times the apparent film thickness on a single vertical surface.

Treatment of polyethylene terephthalate in a He glow discharge

2001 ◽  
Vol 11 (PR3) ◽  
pp. Pr3-357-Pr3-362 ◽  
Author(s):  
D. D. Papakonstantinou ◽  
D. Mataras ◽  
Arefi-Khonsari
Keyword(s):  
Glow Discharge ◽  
Polyethylene Terephthalate

AlCu Pattern Generation on 3D StructuredWafer Using Multi Level Exposure Method on Electrodeposited Polymer Material

2003 ◽  
Vol 766 ◽  
Author(s):  
Vineet Sharma ◽  
Arief B. Suriadi ◽  
Frank Berauer ◽  
Laurie S. Mittelstadt
Keyword(s):  
Line Width ◽  
Metal Film ◽  
Focal Depth ◽  
Cost Effective ◽  
Pattern Generation ◽  
Promising Technique ◽  
Critical Dimensions ◽  
Exposure Method ◽  
Multi Level ◽  
3D Surfaces

AbstractNormal photolithography tools have focal depth limitations and are unable to meet the expectations of high resolution photolithography on highly topographic structures. This paper shows a cost effective and promising technique of combining two different approaches to achieve critical dimensions of traces on slope pattern continuity on highly topographic structures. Electrophoretically deposited photoresist is used on 3-D structured wafers. This photoresist coating technique is fairly known in the MEMS industries to achieve uniform and conformal photoresist films on 3D surfaces. Multi step exposures are used to expose electrophoretically deposited photoresist. AlCu (Cu-0.5%), 0.47-0.53 μm thick metal film is deposited on 3D structured silicon substrate to plate photoresist. By combining these two novel methods, metal (AlCu) traces of 75 μm line width and 150 μm pitch (from top flat to down the slope) have been demonstrated on isotropically etched 350 μm deep trenches with 5-10% line width loss.

Electrical Failure and Damage Analysis of Multi-Layer Metal Films on Flexible Substrate during Cyclic Bending Deformation

2011 ◽  
Author(s):  
Byoung-Joon Kim ◽  
Hae-A-Seul Shin ◽  
In-Suk Choi ◽  
Young-Chang Joo
Keyword(s):  
Fatigue Resistance ◽  
Electrical Resistance ◽  
Metal Film ◽  
Flexible Substrate ◽  
Resistance Change ◽  
Cyclic Bending ◽  
Capping Layer ◽  
Bending Strain ◽  
Cu Film ◽  
Electrical Resistance Change

Abstract The electrical resistance Cu film on flexible substrate was investigated in cyclic bending deformation. The electrical resistance of 1 µm thick Cu film on flexible substrate increased up to 120 % after 500,000 cycles in 1.1 % tensile bending strain. Crack and extrusion were observed due to the fatigue damage of metal film. Low bending strain did not cause any damage on metal film but higher bending strain resulted in severe electrical and mechanical damage. Thinner film showed higher fatigue resistance because of the better mechanical property of thin film. Cu film with NiCr under-layer showed poorer fatigue resistance in tensile bending mode. Ni capping layer did not improve the fatigue resistance of Cu film, but Al capping layer suppressed crack formation and lowered electrical resistance change. The NiCr under layer, Ni capping layer, and Al capping layer effect on electrical resistance change of Cu film was compared with Cu only sample.

Comportement diélectrique du polyéthylène téréphthalate (PET). Mesures de charges d'espace

2005 ◽  
Vol 8 (2) ◽  
pp. 205-220 ◽  
Author(s):  
Serge Agnel ◽  
Jérôme Castellon ◽  
Petru Nothinger Jr ◽  
Alain Toureille ◽  
Jean-Luc Franceschi ◽  
...  
Keyword(s):  
Polyethylene Terephthalate
Sign in / Sign up

Export Citation Format

Share Document