Low temperature de-oxidation for copper surface by catalyzed formic acid vapor

2018 ◽  
Vol 456 ◽  
pp. 890-898 ◽  
Author(s):  
Pei-Wen Chou ◽  
Jenn-Ming Song ◽  
Zong-Yu Xie ◽  
Masatake Akaike ◽  
Tadatomo Suga ◽  
...  
Keyword(s):  
Low Temperature ◽  
Formic Acid ◽  
Copper Surface ◽  
Acid Vapor

scholarly journals Robust Ag-Cu Sintering Bonding at 160 °C via Combining Ag2O Microparticle Paste and Pt-Catalyzed Formic Acid Vapor

Metals ◽  
2020 ◽  
Vol 10 (3) ◽  
pp. 315 ◽  
Author(s):  
Liangliang He ◽  
Junlong Li ◽  
Xin Wu ◽  
Fengwen Mu ◽  
Yinghui Wang ◽  
...  
Keyword(s):  
Low Temperature ◽  
Formic Acid ◽  
Material Selection ◽  
Structure Design ◽  
Acid Vapor ◽  
Higher Temperature ◽  
Cu Bonding ◽  
Bonding Method ◽  
Sintered Ag ◽  
Pt Catalyzed

With the assistance of Pt-catalyzed formic acid vapor, robust Ag-Cu bonding was realized at an ultra-low temperature of 160 °C under 3 MPa for 30 min via the sintering of Ag nanoparticles in situ generated from Ag2O microparticles. The Cu oxide layer at the interface after bonding can be eliminated, which improves the bond strength and electrical conductivity of the joint. A metallic bond contact between the sintered Ag and the Cu substrate is obtained without interfacial solid solution and intermetallic phases, and the shear strength is comparable to previous bonding at a higher temperature. The bonding mechanisms were figured out by comparing the bonding with and without the Pt-catalyzed formic acid vapor. This ultra-low temperature Ag-Cu bonding method may create more flexibilities in the structure design and material selection for power device integration.

Study of Cu Film Surface Treatment Using Formic Acid Vapor/Solution for Low Temperature Bonding

2017 ◽  
Vol 165 (4) ◽  
pp. H3080-H3084 ◽  
Author(s):  
Wenhua Yang ◽  
Yangting Lu ◽  
Chenggong Zhou ◽  
Jian Zhang ◽  
Tadatomo Suga
Keyword(s):  
Low Temperature ◽  
Formic Acid ◽  
Surface Treatment ◽  
Film Surface ◽  
Acid Vapor ◽  
Cu Film ◽  
Low Temperature Bonding

scholarly journals Hydrophilic Nanoporous Copper Surface Prepared by Modified Formic Acid Vapor Treatment

2021 ◽  
pp. 101620
Author(s):  
Lap-Hong Chan ◽  
Kiyokazu Yasuda ◽  
Jenn-Ming Song ◽  
Tadatomo Suga
Keyword(s):  
Formic Acid ◽  
Copper Surface ◽  
Acid Vapor ◽  
Nanoporous Copper ◽  
Vapor Treatment

Vapor Treatment of Copper Surface Using Organic Acids

2003 ◽  
Vol 766 ◽  
Author(s):  
Kenji Ishikawa ◽  
Teruo Yagishita ◽  
Moritaka Nakamura
Keyword(s):  
Organic Acids ◽  
Formic Acid ◽  
Copper Surface ◽  
Cold Trap ◽  
Acid Vapor ◽  
Acetate Complex ◽  
Infrared Reflection ◽  
Volatile Products ◽  
Vapor Treatment ◽  
Acetic Acids

AbstractThe mechanism for cleaning Cu surfaces using the vapor from organic acids was studied by infrared reflection-absorption spectroscopy (IR-RAS) and by analysis of products collected using a cold-trap placed downstream of a reactor. When formic acid vapor was exposed to oxidized Cu samples heated to about 200°C for about a half an hour, the oxides were reduced. The surface seemed to have a shiny metallic appearance but no Cu-containing volatile products were collected, and the decomposition of formic acid molecules into CO2 was observed. In contrast, using acetic acid vapor, Cu-containing etching products were collected and identified as a dinuclear Cu (II) acetate complex. The vapor treatment using formic and acetic acids can be reduced Cu oxides to have metallic Cu surfaces. Furthermore, controlling temperature and choice of organic acids enabled the advantageous establishment of a control for the reduction in, and etching of, the Cu oxides.

scholarly journals Resin-supported iridium complex for low-temperature vanillin hydrogenation using formic acid in water

RSC Advances ◽  
2021 ◽  
Vol 11 (26) ◽  
pp. 15835-15840
Author(s):  
Christene A. Smith ◽  
Francesco Brandi ◽  
Majd Al-Naji ◽  
Ryan Guterman
Keyword(s):  
Low Temperature ◽  
Formic Acid ◽  
Iridium Complex ◽  
Molecular Catalysis

Solid-supported molecular catalysis for biorefinery. Hydrogenation using formic acid in water at low temperature.

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