Influence of nickel–phosphorus surface roughness on wettability and pores formation in solder joints for high power electronic applications
The effect of substrate surface roughness on the fracture toughness of Cu/96.5Sn-3.5Ag solder joints
1994 ◽
Vol 23
(10)
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pp. 1047-1053
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2019 ◽
Vol 8
(10)
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pp. 3130-3132
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2016 ◽
Vol 238
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pp. 8-14
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