Surface characterization of polyethylene terephthalate films treated by ammonia low-temperature plasma

2012 ◽  
Vol 258 (18) ◽  
pp. 7207-7212 ◽  
Author(s):  
Zhiwen Zheng ◽  
Li Ren ◽  
Wenjiang Feng ◽  
Zhichen Zhai ◽  
Yingjun Wang
Keyword(s):  
Low Temperature ◽  
Polyethylene Terephthalate ◽  
Surface Characterization ◽  
Low Temperature Plasma ◽  
Temperature Plasma

scholarly journals Surface Characterization of Low Temperature Plasma-Induced Cashmere Fibre by Air Gas

2017 ◽  
Vol 25 (0) ◽  
pp. 37-41 ◽  
Author(s):  
Yong Wang ◽  
Weidong Yu ◽  
Weidong Yu
Keyword(s):  
Low Temperature ◽  
Surface Characterization ◽  
Plasma Modification ◽  
Tensile Behaviour ◽  
Chemical Compositions ◽  
Low Temperature Plasma ◽  
Temperature Plasma ◽  
Polar Groups ◽  
Surface Morphologies

Low temperature plasma (LTP) processing technology was successfully applied to modify cashmere fibres and three kinds of assemblies were formed, i.e., weak-treated, optimised -treated and severe-treated ones. Treatment parameters were optimised in terms of the tensile behaviour, friction effect, wettability and touch feeling of cashmere without major modification of the properties inside the fibre. Detailed characterisation was performed to investigate the surface morphologies and chemical compositions of plasma-induced fibres. SEM demonstrates different minor etching effects of the treated cashmere fibres. XPS results indicate a significant increase in surface concentrations of O and N, and an obvious decrease in C after different LTP treatments as a whole. The C-H/C-C non-polar bonds were reduced and C-O/C-N, C = O polar groups were remarkably increased on the cashmere surface after plasma modification. In addition, a carboxyl group (O-C = O) formed. It is found that oxygen-containing bonds, namely, C-O/C-N, C = O and O-C = O, are responsible for the hydrophilic properties of cashmere.

Electrical Characterization of Low Temperature PECVD Oxides for TSV Applications

2018 ◽  
Vol 2018 (1) ◽  
pp. 000728-000733
Author(s):  
Piotr Mackowiak ◽  
Rachid Abdallah ◽  
Martin Wilke ◽  
Jash Patel ◽  
Huma Ashraf ◽  
...  
Keyword(s):  
Low Temperature ◽  
Electrical Characterization ◽  
Chemical Vapor ◽  
Silicon Substrates ◽  
Low Temperature Plasma ◽  
Temperature Plasma ◽  
Charge Densities ◽  
Doped Silicon

Abstract In the present work we investigate the quality of low temperature Plasma Enhanced Chemical Vapor Deposition (PECVD) and plasma treated Tetraethyl orthosilicate (TEOS)-based TSV-liner films. Different designs of Trough Silicon Via (TSV) Test structures with 10μm and 20μm width and a depth of 100μm have been fabricated. Two differently doped silicon substrates have been used – highly p-doped and moderately doped. The results for break-through, resistivity and capacitance for the 20μm structures show a better performance compared to the 10μm structures. This is mainly due to increased liner thickness in the reduced aspect ratio case. Lower interface traps and oxide charge densities have been observed in the C-V measurements results for the 10μm structures.

scholarly journals Multi‐technique characterization of low‐temperature plasma nitrided austenitic AISI 304L and AISI 904L stainless steel

2014 ◽  
Vol 46 (10-11) ◽  
pp. 856-860 ◽  
Author(s):  
Y. Cao ◽  
G. Maistro ◽  
M. Norell ◽  
S. A. Pérez‐Garcia ◽  
L. Nyborg
Keyword(s):  
Stainless Steel ◽  
Low Temperature ◽  
Low Temperature Plasma ◽  
Temperature Plasma ◽  
Aisi 304L
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