Comparative study of electroless copper deposition based on the seed layers of Pd, PtPd and AuPd

2009 ◽  
Vol 255 (6) ◽  
pp. 3713-3718 ◽  
Author(s):  
Chuanli Ma ◽  
Weichun Ye ◽  
Xuezhao Shi ◽  
Yanlong Chang ◽  
Yang Chen ◽  
...  
Keyword(s):  
Comparative Study ◽  
Copper Deposition ◽  
Electroless Copper ◽  
Seed Layers

Laser-enhanced electroless plating of silver seed layers for selective electroless copper deposition

2008 ◽  
Vol 20 (4) ◽  
pp. 218-223 ◽  
Author(s):  
Nicholas S. Dellas ◽  
Kenneth Meinert ◽  
Suzanne E. Mohney
Keyword(s):  
Electroless Plating ◽  
Copper Deposition ◽  
Electroless Copper ◽  
Seed Layers

Organic Solution Deposition of Copper Seed Layers onto Barrier Metals

2000 ◽  
Vol 612 ◽  
Author(s):  
H. Gu ◽  
R. Fang ◽  
T. J. O'Keefe ◽  
M. J. O'Keefe ◽  
W.-S. Shih ◽  
...  
Keyword(s):  
Thin Films ◽  
Seed Layer ◽  
Copper Deposition ◽  
Copper Films ◽  
Exchange Reactions ◽  
Organic Solution ◽  
Spontaneous Deposition ◽  
Electroless Copper ◽  
Barrier Metal ◽  
Seed Layers

AbstractSpontaneous deposition of copper seed layers from metal bearing organic based solutions onto sputter deposited titanium, titanium nitride, and tantalum diffusion barrier thin films has been demonstrated. Based on electrochemically driven cementation exchange reactions, the process was used to produce adherent, selectively deposited copper metal particulate films on blanket and patterned barrier metal thin films on silicon substrates. The organic solution deposited copper films were capable of acting as seed layers for subsequent electrolytic and electroless copper deposition processes using standard plating baths. Electroless and electrolytic copper films from 0.1µm to 1.0µm thick were produced on a variety of samples on which the organic solution copper acted as the initial catalytic seed layer. The feasibility of using organic solution deposited palladium as a seed layer followed by electroless copper deposition has also been demonstrated. In addition, experiments conducted on patterned barrier metal samples with exposed areas of dielectric such as polyimide indicated that no organic solution copper or palladium deposition occurred on the insulating materials.

The Effect of the Microstructure of Diffusion Barriers on the Palladium Activation for Electroless Copper Deposition

2002 ◽  
Vol 716 ◽  
Author(s):  
Seok Woo Hong ◽  
Yong Sun Lee ◽  
Ki-Chul Park ◽  
Jong-Wan Park
Keyword(s):  
Electron Microscopy ◽  
Diffusion Barriers ◽  
Copper Deposition ◽  
X Ray Diffraction ◽  
Plan View ◽  
X Ray ◽  
Transmission Electron ◽  
Electroless Copper ◽  
Sheet Resistance Measurement ◽  
Scanning Electron

AbstractThe effect of microstructure of dc magnetron sputtered TiN and TaN diffusion barriers on the palladium activation for autocatalytic electroless copper deposition has been investigated by using X-ray diffraction, sheet resistance measurement, field emission scanning electron microscopy (FE-SEM) and plan view transmission electron microscopy (TEM). The density of palladium nuclei on TaN diffusion barrier increases as the grain size of TaN films decreases, which was caused by increasing nitrogen content in TaN films. Plan view TEM results of TiN and TaN diffusiton barriers showed that palladium nuclei formed mainly on the grain boundaries of the diffusion barriers.

Selective Electroless Copper Deposition within Block Copolymer Microdomains

2000 ◽  
Vol 12 (6) ◽  
pp. 1628-1633 ◽  
Author(s):  
Yot Boontongkong ◽  
Robert E. Cohen ◽  
Michael F. Rubner
Keyword(s):  
Block Copolymer ◽  
Copper Deposition ◽  
Electroless Copper

New plating bath for electroless copper deposition on sputtered barrier layers

2000 ◽  
Vol 50 (1-4) ◽  
pp. 441-447 ◽  
Author(s):  
Yuri Lantasov ◽  
Roger Palmans ◽  
Karen Maex
Keyword(s):  
Copper Deposition ◽  
Plating Bath ◽  
Barrier Layers ◽  
Electroless Copper
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