scholarly journals Self-assembled film thickness determination by focused ion beam

2008 ◽  
Vol 254 (17) ◽  
pp. 5506-5510 ◽  
Author(s):  
J. Dejeu ◽  
R. Salut ◽  
M. Spajer ◽  
F. Membrey ◽  
A. Foissy ◽  
...  
Keyword(s):  
Film Thickness ◽  
Focused Ion Beam ◽  
Ion Beam ◽  
Thickness Determination ◽  
Self Assembled

Mechanical Properties of Electroplated Copper Thin Films

1999 ◽  
Vol 594 ◽  
Author(s):  
R. Spolenak ◽  
C. A. Volkert ◽  
K. Takahashi ◽  
S. Fiorillo ◽  
J. Miner ◽  
...  
Keyword(s):  
Thin Films ◽  
Mechanical Properties ◽  
Grain Size ◽  
Film Thickness ◽  
Yield Stress ◽  
Laser Scanning ◽  
Focused Ion Beam ◽  
Ion Beam ◽  
Cu Films ◽  
Electroplated Copper

AbstractIt is well known that the mechanical properties of thin films depend critically on film thickness However, the contributions from film thickness and grain size are difficult to separate, because they typically scale with each other. In one study by Venkatraman and Bravman, Al films, which were thinned using anodic oxidation to reduce film thickness without changing grain size, showed a clear increase in yield stress with decreasing film thickness.We have performed a similar study on both electroplated and sputtered Cu films by using chemical-mechanical polishing (CMP) to reduce the film thickness without changing the grain size. Stress-temperature curves were measured for both the electroplated and sputtered Cu films with thicknesses between 0.1 and 1.8 microns using a laser scanning wafer curvature technique. The yield stress at room temperature was found to increase with decreasing film thickness for both sets of samples. The sputtered films, however, showed higher yield stresses in comparison to the electroplated films. Most of these differences can be attributed to the different microstructures of the films, which were determined by focused ion beam (FIB) microscopy and x-ray diffraction.

scholarly journals Focused ion beam milling of self-assembled magnetic superstructures: an approach to fabricate nanoporous materials with tunable porosity

2018 ◽  
Vol 5 (6) ◽  
pp. 1211-1218 ◽  
Author(s):  
Verner Håkonsen ◽  
Gurvinder Singh ◽  
Jianying He ◽  
Zhiliang Zhang
Keyword(s):  
Porous Materials ◽  
Focused Ion Beam ◽  
Ion Beam ◽  
Nanoporous Materials ◽  
Porous Network ◽  
Novel Approach ◽  
Self Assembled ◽  
Focused Ion Beam Milling

Focused ion beam milling of self-assembled magnetic superstructures is demonstrated as a novel approach to fabricate porous materials with tunable porosity. During exposure to the ion beam, nanoparticles in the superstructure are subjected to combined milling and melting, thus merging together into a porous network.

Preferential ordering of self-assembled Ge islands on focused ion-beam patterned Si(100)

2012 ◽  
Vol 14 (2) ◽  
Author(s):  
K. Das ◽  
S. Das ◽  
R. K. Singha ◽  
S. K. Ray ◽  
A. K. Raychaudhuri
Keyword(s):  
Focused Ion Beam ◽  
Ion Beam ◽  
Self Assembled

Formation of self-assembled Ga-rich droplet chains on GaAs (100) patterned by focused ion beam

2016 ◽  
Vol 109 (12) ◽  
pp. 123102
Author(s):  
Sabina D. Koukourinkova ◽  
Mourad Benamara ◽  
Morgan E. Ware ◽  
Zhiming M. Wang ◽  
Gregory J. Salamo
Keyword(s):  
Focused Ion Beam ◽  
Ion Beam ◽  
Self Assembled

Tuning Surface Wettability at the Submicron-Scale: Effect of Focused Ion Beam Irradiation on a Self-Assembled Monolayer

2015 ◽  
Vol 120 (1) ◽  
pp. 274-280 ◽  
Author(s):  
Yutaka Yamada ◽  
Koji Takahashi ◽  
Tatsuya Ikuta ◽  
Takashi Nishiyama ◽  
Yasuyuki Takata ◽  
...  
Keyword(s):  
Scale Effect ◽  
Focused Ion Beam ◽  
Ion Beam ◽  
Surface Wettability ◽  
Beam Irradiation ◽  
Ion Beam Irradiation ◽  
Self Assembled Monolayer ◽  
Submicron Scale ◽  
Self Assembled

scholarly journals The Accuracy of Al and Cu Film Thickness Determinations and the Implications for Electron Probe Microanalysis

2018 ◽  
Vol 24 (2) ◽  
pp. 83-92 ◽  
Author(s):  
Mike B. Matthews ◽  
Stuart L. Kearns ◽  
Ben Buse
Keyword(s):  
Film Thickness ◽  
Electron Probe Microanalysis ◽  
Electron Probe ◽  
Focused Ion Beam ◽  
Ion Beam ◽  
Cu Film ◽  
Reduced Density ◽  
20 Nm ◽  
Linear Trends

AbstractThe accuracy to which Cu and Al coatings can be determined, and the effect this has on the quantification of the substrate, is investigated. Cu and Al coatings of nominally 5, 10, 15, and 20 nm were sputter coated onto polished Bi using two configurations of coater: One with the film thickness monitor (FTM) sensor colocated with the samples, and one where the sensor is located to one side. The FTM thicknesses are compared against those calculated from measured Cu Lαand Al Kα k-ratios using PENEPMA, GMRFilm, and DTSA-II. Selected samples were also cross-sectioned using focused ion beam. Both systems produced repeatable coatings, the thickest coating being approximately four times the thinnest coating. The side-located FTM sensor indicated thicknesses less than half those of the software modeled results, propagating on to 70% errors in substrate quantification at 5 kV. The colocated FTM sensor produced errors in film thickness and substrate quantification of 10–20%. Over the range of film thicknesses and accelerating voltages modeled both the substrate and coatingk-ratios can be approximated by linear trends as functions of film thickness. The Al films were found to have a reduced density of ~2 g/cm2.

Lateral control of self-assembled island nucleation by focused-ion-beam micropatterning

2003 ◽  
Vol 82 (7) ◽  
pp. 1093-1095 ◽  
Author(s):  
M. Kammler ◽  
R. Hull ◽  
M. C. Reuter ◽  
F. M. Ross
Keyword(s):  
Focused Ion Beam ◽  
Ion Beam ◽  
Lateral Control ◽  
Island Nucleation ◽  
Self Assembled

Laser Induced High-Strain-Rate Superplastic 3D Micro-Forming of Metallic Thin Film

2009 ◽  
Author(s):  
Huang Gao ◽  
Gary J. Cheng
Keyword(s):  
Thin Film ◽  
Thin Films ◽  
Film Thickness ◽  
Strain Rate ◽  
Focused Ion Beam ◽  
Laser Intensity ◽  
Ion Beam ◽  
Micro Forming ◽  
Forming Process ◽  
Metal Thin Films

Microforming of metals has always been a challenge because of the limited formability of metals at micro-scales. This paper investigates an innovative micro-forming technique: Laser Dynamic Forming (LDF), which induces 3-D superplastic forming in metal thin films. This forming process proceeds in a sequence of laser irradiation of ablative coating, ionization, shockwave generation and propagation in metal thin films, and conformation of metal thin films to the shape of micro/nanoscale molds. Because the deformation proceeds at ultrahigh strain rate, it is found that materials experience superplastic deformation at microscales. In this paper, experiments are carried out to understand the deformation characteristics of LDF. The shapes of the formed samples are characterized by scanning electron microscopy (SEM) and optical profilometer. The thickness variations are characterized by slicing the cross section using focused ion beam (FIB). The magnitude of deformation depth in LDF is determined primarily by three critical factors: thin film thickness, geometry of molds, and laser intensity. The relationships between laser intensity, film thickness, and mold size are explored in process maps to find out suitable processing conditions of LDF. Nanoindentation testings are conducted to show that the mechanical properties (hardness and yield strength) are increased significantly after LDF.

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