Studies of craters’ dimension for long-pulse laser ablation of metal targets at various experimental conditions

2008 ◽  
Vol 254 (9) ◽  
pp. 2797-2803 ◽  
Author(s):  
D. Margarone ◽  
L. Láska ◽  
L. Torrisi ◽  
S. Gammino ◽  
J. Krása ◽  
...  
2007 ◽  
Vol 36 (4) ◽  
pp. 508-509 ◽  
Author(s):  
Tetsuo Sakka ◽  
Hisayuki Oguchi ◽  
Satoru Masai ◽  
Yukio H. Ogata

2017 ◽  
Vol 396 ◽  
pp. 732-739 ◽  
Author(s):  
Marzieh Akbari Jafarabadi ◽  
Mohammad Hossein Mahdieh

Author(s):  
F. Beaudoin ◽  
P. Perdu ◽  
C. DeNardi ◽  
R. Desplats ◽  
J. Lopez ◽  
...  

Abstract Ultra-short pulse laser ablation is applied to IC backside sample preparation. It is contact-less, non-thermal, precise and can ablate the various types of material present in IC packages. This study concerns the optimization of ultra-short pulse laser ablation for silicon thinning. Uncontrolled silicon roughness and poor uniformity of the laser thinned cavity needed to be tackled. Special care is taken to minimize the silicon RMS roughness to less than 1µm. Application to sample preparation of 256Mbit devices is presented.


2009 ◽  
Vol 255 (17) ◽  
pp. 7605-7609 ◽  
Author(s):  
D.P. Korfiatis ◽  
K.-A. Th. Thoma ◽  
J.C. Vardaxoglou

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