Residual stress and Curie temperature of Fe–N thin films prepared by dc magnetron sputtering at elevated temperature

2006 ◽  
Vol 252 (14) ◽  
pp. 4995-5001 ◽  
Author(s):  
W.L. Li ◽  
Y. Sun ◽  
W.D. Fei
Keyword(s):  
Thin Films ◽  
Residual Stress ◽  
Elevated Temperature ◽  
Curie Temperature ◽  
Magnetron Sputtering ◽  
Dc Magnetron Sputtering

The mechanical and corrosion resistance properties of Ti/TiN multi-layer films produced by physical vapor deposition

2015 ◽  
Vol 62 (3) ◽  
pp. 149-155 ◽  
Author(s):  
Meiling Dong ◽  
Xiufang Cui ◽  
Guo Jin ◽  
Haidou Wang ◽  
Lina Zhu ◽  
...  
Keyword(s):  
Thin Films ◽  
Mechanical Properties ◽  
Residual Stress ◽  
Corrosion Resistance ◽  
Magnetron Sputtering ◽  
Film Surface ◽  
Dc Magnetron Sputtering ◽  
Content Type ◽  
Nano Indentation ◽  
Modulation Period

Purpose – The aim of the present paper is to investigate the mechanical performance of multi-layer films. With the wide application of optic and electronic thin-films, membrane materials and membrane technology have become one of the most active fields of research in contemporary materials science (Dumont et al., 1997). Multi-layer films have evolved as candidates for these applications because of their unique properties. TiN and Ti/TiN multi-layer films were fabricated using the DC magnetron sputtering method. A nano-indentation tester and electronic film distribution tester were utilized to evaluate the mechanical properties and residual stress of the films. The existence of interface effects on the mechanical properties and corrosion resistance of the films were analyzed. Design/methodology/approach – In this study, the Ti/TiN multi-layer films were fabricated using the DC magnetron sputtering method. The films were deposited on polished 45# steels. Ti was used as the sputtering target. Ar and N2 were applied as working and reactive gases, respectively. Surface morphology was measured using transmission electron microscopy. The composition was analyzed using D8 X-ray diffraction. Nano-indentation tests were performed using Nanoindenter G200 with a Berkovich indenter. A BGS 6341 electronic film stress distribution tester was used to measure the distribution of stress in the films. Findings – The film surface was very smooth and the structure was very dense. The elastic modulus and micro-hardness of Ti/TiN multi-layer films were smaller, compared to those of the TiN film. Furthermore, both of these parameters initially decreased and later increased, with a decrease in the modulation period. The residual stress in the film was compressive. The corrosion resistance properties of TiN films were the best in NaCl solution, less so in alkaline solution and worst in acid solution. For the Ti/TiN multi-layer films tested in an acid medium, the corrosion resistance performance was better when the modulation period was decreased to micron grade under exposure conditions at ambient temperature. Originality/value – In the present paper, the Ti/TiN multi-layer films were fabricated using PVD with different variations, and the influence on the performance of Ti/TiN multi-layer films due to each single layer period of TiN was studied. The findings should provide useful guidelines for the preparation of high quality Ti/TiN multi-layer thin films.

Preparing transparent cobalt-doped ZnO thin films by DC magnetron sputtering

2017 ◽  
Vol 4 (5) ◽  
pp. 6311-6316 ◽  
Author(s):  
Pongladda Panyajirawut ◽  
Nattha Pratumsuwan ◽  
Kornkamon Meesombad ◽  
Kridsana Thanawattana ◽  
Artit Chingsungnoen ◽  
...  
Keyword(s):  
Thin Films ◽  
Magnetron Sputtering ◽  
Zno Thin Films ◽  
Dc Magnetron Sputtering ◽  
Doped Zno

Characterization of Ti–Zr–V thin films deposited by DC and unipolar pulsed DC magnetron sputtering

Vacuum ◽  
2021 ◽  
Vol 188 ◽  
pp. 110200
Author(s):  
Sihui Wang ◽  
Wei Wei ◽  
Yonghao Gao ◽  
Haibin Pan ◽  
Yong Wang
Keyword(s):  
Thin Films ◽  
Magnetron Sputtering ◽  
Dc Magnetron Sputtering ◽  
Pulsed Dc ◽  
Pulsed Dc Magnetron Sputtering

The influence of pressure and magnetic field on the deposition of epitaxial TiBx thin films from DC magnetron sputtering

Vacuum ◽  
2020 ◽  
Vol 177 ◽  
pp. 109355
Author(s):  
Nils Nedfors ◽  
Daniel Primetzhofer ◽  
Igor Zhirkov ◽  
Justinas Palisaitis ◽  
Per O.Å. Persson ◽  
...  
Keyword(s):  
Magnetic Field ◽  
Thin Films ◽  
Magnetron Sputtering ◽  
Dc Magnetron Sputtering

On‐axis dc magnetron sputtering of large area high quality YBa2Cu3O7superconducting thin films

1992 ◽  
Vol 61 (3) ◽  
pp. 348-350 ◽  
Author(s):  
Y. Z. Zhang ◽  
L. Li ◽  
Y. Y. Zhao ◽  
B. R. Zhao ◽  
J. W. Li ◽  
...  
Keyword(s):  
Thin Films ◽  
Magnetron Sputtering ◽  
Dc Magnetron Sputtering ◽  
Large Area ◽  
High Quality

Transparent Conductive Cu-In-O Thin Films Deposited by Reactive DC Magnetron Sputtering with Different Targets

2011 ◽  
Vol 239-242 ◽  
pp. 2752-2755
Author(s):  
Fan Ye ◽  
Xing Min Cai ◽  
Fu Ping Dai ◽  
Dong Ping Zhang ◽  
Ping Fan ◽  
...  
Keyword(s):  
Thin Films ◽  
Magnetron Sputtering ◽  
Optical Band Gap ◽  
Diffraction Peak ◽  
X Ray Diffraction ◽  
Dc Magnetron Sputtering ◽  
Flow Rates ◽  
X Ray ◽  
Equal Distance ◽  
Transmittance Curve

Transparent conductive Cu-In-O thin films were deposited by reactive DC magnetron sputtering. Two types of targets were used. The first was In target covered with a fan-shaped Cu plate of the same radius and the second was Cu target on which six In grains of 1.5mm was placed with equal distance between each other. The samples were characterized with scanning electron microscopy (SEM), energy dispersive X-ray spectroscopy (EDX), X-ray diffraction (XRD), UV/VIS spectrophotometer, four-probe measurement etc. SEM shows that the surfaces of all the samples are very smooth. EDX shows that the samples contain Cu, In as well as O, and different targets result in different atomic ratios of Cu to In. A diffraction peak related to rhombohedra-centered In2O3(012) is observed in the XRD spectra of all the samples. For both the two targets, the transmittance decreases with the increase of O2flow rates. The direct optical band gap of all the samples is also estimated according to the transmittance curve. For both the two targets, different O2flow rates result in different sheet resistances and conductivities. The target of Cu on In shows more controllability in the composition and properties of Cu-In-O films.

Crystallite size and microstrain: XRD line broadening analysis of AgSiN thin films

2019 ◽  
Vol 48 (6) ◽  
pp. 473-480 ◽  
Author(s):  
Umi Zalilah Mohamad Zaidi ◽  
A.R. Bushroa ◽  
Reza Rahbari Ghahnavyeh ◽  
Reza Mahmoodian
Keyword(s):  
Thin Films ◽  
Residual Stress ◽  
Magnetron Sputtering ◽  
Crystallite Size ◽  
Approximation Method ◽  
Ti6al4v Alloy ◽  
Line Broadening ◽  
X Ray Diffraction ◽  
Content Type ◽  
Three Samples

Purpose This paper aims to determine the crystallite size and microstrain values of AgSiN thin films using potential approach called approximation method. This method can be used as a replacement for other determination methods such as Williamson-Hall (W-H) plot and Warren-Averbach analysis. Design/methodology/approach The monolayer AgSiN thin films on Ti6Al4V alloy were fabricated using magnetron sputtering technique. To evaluate the crystallite size and microstrain values, the thin films were deposited under different bias voltage (−75, −150 and −200 V). X-ray diffraction (XRD) broadening profile along with approximation method were used to determine the crystallite size and microstrain values. The reliability of the method was proved by comparing it with scanning electron microscopy graph and W-H plot method. The second parameters’ microstrain obtained was used to project the residual stress present in the thin films. Further discussion on the thin films was done by relating the residual stress with the adhesion strength and the thickness of the films. Findings XRD-approximation method results revealed that the crystallite size values obtained from the method were in a good agreement when it is compared with Scherer formula and W-H method. Meanwhile, the calculations for thin films corresponding residual stresses were correlated well with scratch adhesion critical loads with the lowest residual stress was noted for sample with lowest microstrain and has thickest thickness among the three samples. Practical implications The fabricated thin films were intended to be used in antibacterial applications. Originality/value Up to the knowledge from literature review, there are no reports on depositing AgSiN on Ti6Al4V alloy via magnetron sputtering to elucidate the crystallite size and microstrain properties using the approximation method.

Sign in / Sign up

Export Citation Format

Share Document