Transient thermal gratings at surfaces for thermal characterization of bulk materials and thin films

1995 ◽  
Vol 61 (3) ◽  
pp. 253-261 ◽  
Author(s):  
O.W. K�ding ◽  
H. Skurk ◽  
A.A. Maznev ◽  
E. Matthias
Keyword(s):  
Thin Films ◽  
Thermal Characterization ◽  
Bulk Materials ◽  
Transient Thermal

Transient thermal gratings at surfaces for thermal characterization of bulk materials and thin films

1995 ◽  
Vol 61 (3) ◽  
pp. 253-261 ◽  
Author(s):  
O. W. K�ding ◽  
H. Skurk ◽  
A. A. Maznev ◽  
E. Matthias
Keyword(s):  
Thin Films ◽  
Thermal Characterization ◽  
Bulk Materials ◽  
Transient Thermal

scholarly journals Thermal Characterization of Polycrystalline CVD Diamond Thin Films

2009 ◽  
Vol 1 (1) ◽  
pp. 609-613 ◽  
Author(s):  
S. Lani ◽  
C. Ataman ◽  
W. Noell ◽  
D. Briand ◽  
N. de Rooij
Keyword(s):  
Thin Films ◽  
Thermal Characterization ◽  
Cvd Diamond ◽  
Diamond Thin Films

Transient Thermal Characterization of ErAs/In0.53Ga0.47As Thermoelectric Module

2007 ◽  
Author(s):  
Y. Ezzahri ◽  
R. Singh ◽  
K. Fukutani ◽  
Z. Bian ◽  
A. Shakouri ◽  
...  
Keyword(s):  
Metallic Nanoparticles ◽  
Thermoelectric Module ◽  
Thermal Characterization ◽  
Hot Electrons ◽  
Thermoelectric Power Factor ◽  
Scattering Centers ◽  
Network Identification ◽  
Transient Thermal

Embedded metallic nanoparticles in semiconductors have recently been proven to be of great interest for thermoelectric applications. These metallic nanoparticles play the role of scattering centers for phonons and a source of doping for electrons; they reduce simultaneously the thermal conductivity and increase the thermoelectric power factor of the semiconductor. It has also shown that metal/semiconductor heterostructures can be used to break the crystal momentum symmetry for hot electrons in thermionic devices, then increasing the number of electrons participating in transport. A thermoelectric module of 200 N-P pairs of InGaAlAs with embedded ErAs metallic nanoparticles has been fabricated. Network Identification by Deconvolution (NID) technique is then applied for transient thermal characterization of this thermoelectric module. The combination of this new representation of the dynamic behavior of the packaged device with high resolution thin film temperature measurement allows us to obtain information about heat transfer within the thermoelectric module. This is used to extract the thermal resistances and heat capacitances of the module.

Optical and thermal characterization of AlN thin films deposited by pulsed laser deposition

2002 ◽  
Vol 186 (1-4) ◽  
pp. 507-512 ◽  
Author(s):  
A. Jacquot ◽  
B. Lenoir ◽  
A. Dauscher ◽  
P. Verardi ◽  
F. Craciun ◽  
...  
Keyword(s):  
Thin Films ◽  
Pulsed Laser Deposition ◽  
Pulsed Laser ◽  
Thermal Characterization ◽  
Laser Deposition

Characterization of thin films and bulk materials for DUV optical components

2006 ◽  
Author(s):  
Sven Schröder ◽  
Mathias Kamprath ◽  
Angela Duparré
Keyword(s):  
Thin Films ◽  
Bulk Materials ◽  
Optical Components

Physical and thermal characterization of graphene oxide modified gelatin-based thin films

2014 ◽  
Vol 35 (10) ◽  
pp. 2043-2049 ◽  
Author(s):  
Elham Mohammad Zadeh ◽  
Aimin Yu ◽  
Li Fu ◽  
Masoud Dehghan ◽  
Igor Sbarski ◽  
...  
Keyword(s):  
Thin Films ◽  
Graphene Oxide ◽  
Thermal Characterization

Thermal characterization of Se–Te thin films

2015 ◽  
Vol 644 ◽  
pp. 40-46 ◽  
Author(s):  
Roman Svoboda ◽  
Miloslav Kincl ◽  
Jiří Málek
Keyword(s):  
Thin Films ◽  
Thermal Characterization
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