High-speed homo- and heterostructure field-effect transistors

2007 ◽  
pp. 311-330
Author(s):  
Heinrich Dämbkes ◽  
Klaus Heime
2015 ◽  
Vol 16 (1) ◽  
pp. 221-229
Author(s):  
S.P. Novosyadlyy ◽  
A.M. Bosats'kyy

Reducing the size of silicon devices is accompanied by an increase in the effective rate of electrons,  decrease transit time and the transition to a ballistic work.Power consumption is reduced too. Formation of large integrated circuits structures onSi-homotransition reduces their frequency range and performance.Nowadaysproposed several new types of devices and technologies forming of large integrated circuits structures that based on high speeds and mobility of electrons in GaAs, and  small size structures.These include, for example, the heterostructure field-effect transistors on a segmented doping, bipolar transistors with wide-emitter, transistor with soulful base, vertical ballistic transistors, devices with flat-doped barriers and hot electron transistors as element base of modern high-speed large integrated circuits.In this article we consider graded-gap technology formatting as bipolar and field-effect transistors, which are the basis of modern high-speedof large integrated circuits structures.


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