Characterizing the temperature dependence of electronic packaging-material properties

JOM ◽  
1995 ◽  
Vol 47 (6) ◽  
pp. 31-35 ◽  
Author(s):  
Chia-Yu Fu ◽  
Charles Ume
2013 ◽  
Vol 873 ◽  
pp. 379-383
Author(s):  
Yong Zheng Liu

Due to the good physical properties of diamond, diamond/Al composites as a new generation electronic packaging material receive more and more attention. It is one of the greatest potential for the development of packaging materials. The paper on the diamond/Al composite materials research at home and abroad was summarized in detail.


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