Rice Husk-derived Hierarchical Micro/Mesoporous Carbon-Silica Nanocomposite as Superior Filler for Green Electronic Packaging Material

2017 ◽  
Vol 64 (4) ◽  
pp. 427-433 ◽  
Author(s):  
Ya-Yu Hsieh ◽  
Yun-Chih Tsai ◽  
Hong-Ping Lin ◽  
Chun-Han Hsu
Keyword(s):  
Rice Husk ◽  
Electronic Packaging ◽  
Mesoporous Carbon ◽  
Packaging Material ◽  
Electronic Packaging Material ◽  
Silica Nanocomposite

Research Progress of Diamond/Al Composites

2013 ◽  
Vol 873 ◽  
pp. 379-383
Author(s):  
Yong Zheng Liu
Keyword(s):  
Composite Materials ◽  
Physical Properties ◽  
Electronic Packaging ◽  
Packaging Material ◽  
Research Progress ◽  
Packaging Materials ◽  
Al Composite ◽  
Materials Research ◽  
Electronic Packaging Material ◽  
New Generation

Due to the good physical properties of diamond, diamond/Al composites as a new generation electronic packaging material receive more and more attention. It is one of the greatest potential for the development of packaging materials. The paper on the diamond/Al composite materials research at home and abroad was summarized in detail.

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