scholarly journals Effect of stoichiometry on the thermal expansion coefficients of lithium niobate single crystals

1998 ◽  
Vol 21 (6) ◽  
pp. 469-474 ◽  
Author(s):  
Kamal Singh ◽  
P V Saodekar ◽  
S S Bhoga
Keyword(s):  
Thermal Expansion ◽  
Lithium Niobate ◽  
Single Crystals ◽  
Thermal Expansion Coefficients ◽  
Expansion Coefficients

Effect of pressure on the thermal expansion coefficients of CeCu2 single crystals

1992 ◽  
Vol 181 (1-2) ◽  
pp. 293-298 ◽  
Author(s):  
Y. Uwatoko ◽  
H. Okita ◽  
G. Oomi ◽  
I. Umehara ◽  
Y. Ōnuki
Keyword(s):  
Thermal Expansion ◽  
Single Crystals ◽  
Effect Of Pressure ◽  
Thermal Expansion Coefficients ◽  
Expansion Coefficients

scholarly journals Extraordinary anisotropic thermal expansion in photosalient crystals

IUCrJ ◽  
2020 ◽  
Vol 7 (1) ◽  
pp. 83-89 ◽  
Author(s):  
Khushboo Yadava ◽  
Gianpiero Gallo ◽  
Sebastian Bette ◽  
Caroline Evania Mulijanto ◽  
Durga Prasad Karothu ◽  
...  
Keyword(s):  
Thermal Expansion ◽  
Solid State ◽  
Metal Complexes ◽  
Single Crystals ◽  
Room Temperature ◽  
Volumetric Thermal Expansion ◽  
Anisotropic Thermal Expansion ◽  
Thermal Expansion Coefficients ◽  
Expansion Coefficients ◽  
Multifunctional Properties

Although a plethora of metal complexes have been characterized, those having multifunctional properties are very rare. This article reports three isotypical complexes, namely [Cu(benzoate)L 2], where L = 4-styrylpyridine (4spy) (1), 2′-fluoro-4-styrylpyridine (2F-4spy) (2) and 3′-fluoro-4-styrylpyridine (3F-4spy) (3), which show photosalient behavior (photoinduced crystal mobility) while they undergo [2+2] cycloaddition. These crystals also exhibit anisotropic thermal expansion when heated from room temperature to 200°C. The overall thermal expansion of the crystals is impressive, with the largest volumetric thermal expansion coefficients for 1, 2 and 3 of 241.8, 233.1 and 285.7 × 10−6 K−1, respectively, values that are comparable to only a handful of other reported materials known to undergo colossal thermal expansion. As a result of the expansion, their single crystals occasionally move by rolling. Altogether, these materials exhibit unusual and hitherto untapped solid-state properties.

THERMAL EXPANSION OF SINGLE CRYSTALS OF ZINC AT LOW TEMPERATURES

1965 ◽  
Vol 43 (7) ◽  
pp. 1328-1333 ◽  
Author(s):  
D. A. Channing ◽  
S. Weintroub
Keyword(s):  
Experimental Data ◽  
Thermal Expansion ◽  
Single Crystals ◽  
Low Temperatures ◽  
Linear Thermal Expansion ◽  
Optical Interference ◽  
Temperature Range ◽  
Thermal Expansion Coefficients ◽  
Expansion Coefficients ◽  
Good Agreement

The linear thermal expansion coefficients αψ of two single crystals of Zn of orientations ψ = 10.8° and 63.9 ° with the hexad axis were measured over the temperature range of about 20–270 °K using an absolute Fizeau optical interference technique. The two principal coefficients, [Formula: see text] and [Formula: see text], corresponding to ψ = 0° and 90 ° respectively, were calculated from the Voigt relation, and their values are compared with previously reported experimental data. Above 60 °K there is good agreement with previous work, and below 60 °K the results confirm, in general, the data obtained by McCammon and White. The Grüneisen parameter γ is essentially constant at about 2.1 in the range 100–270 °K, but below 100 °K γ rises appreciably with decreasing temperature and reaches the value of about 3.5 at 20 °K.

Influence of Cr deficiency on sintering, thermal expansion and electrical properties of La0.75Sr0.25Cr1−xO3−δ as a SOFC interconnect material

2016 ◽  
Vol 30 (11) ◽  
pp. 1650127 ◽  
Author(s):  
Yi Ren ◽  
Wen Ma ◽  
Xiaoying Li ◽  
Jun Wang ◽  
Yu Bai ◽  
...  
Keyword(s):  
Thermal Expansion ◽  
Electrical Properties ◽  
Perovskite Phase ◽  
Ignition Process ◽  
Thermal Expansion Coefficients ◽  
Auto Ignition ◽  
Pure Perovskite Phase ◽  
Maximum Conductivity ◽  
Expansion Coefficients ◽  
Interconnect Material

The SOFC interconnect materials La[Formula: see text]Sr[Formula: see text]Cr[Formula: see text]O[Formula: see text] [Formula: see text]–[Formula: see text] were prepared using an auto-ignition process. The influences of Cr deficiency on their sintering, thermal expansion and electrical properties were investigated. All the samples were pure perovskite phase after sintering at 1400[Formula: see text]C for 4 h. The cell volume of La[Formula: see text]Sr[Formula: see text]Cr[Formula: see text]O[Formula: see text] decreased with increasing Cr deficient content. The relative density of the sintered bulk samples increased from 93.2% [Formula: see text] to a maximum value of 94.7% [Formula: see text] and then decreased to 87.7% [Formula: see text]. The thermal expansion coefficients of the sintered bulk samples were in the range of [Formula: see text]–[Formula: see text] (30–1000[Formula: see text]C), which are compatible with that of YSZ. Among the investigated samples, the sample with 0.02 Cr deficiency had a maximum conductivity of 40.4 Scm[Formula: see text] and the lowest Seebeck coefficient of 154.8 [Formula: see text]VK[Formula: see text] at 850[Formula: see text]C in pure He. The experimental results indicate that La[Formula: see text]Sr[Formula: see text]Cr[Formula: see text]O[Formula: see text] has the best properties and is much suitable for SOFC interconnect material application.

Novel Silicon-Elastomers for Advanced Soft Lithography

2006 ◽  
Vol 947 ◽  
Author(s):  
Kyung Choi
Keyword(s):  
Thermal Expansion ◽  
High Resolution ◽  
Soft Lithography ◽  
Materials Properties ◽  
Nano Scale ◽  
Thermal Expansion Coefficients ◽  
High Thermal Expansion ◽  
Expansion Coefficients

ABSTRACTHigh resolution pattern transfers in the nano-scale regime have been considerable challenges in ‘soft lithography’ to achieve nanodevices with enhanced performances. In this technology, the resolution of pattern integrations is significantly rely on the materials' properties of polydimethylsiloxane (PDMS) stamps. Since commercial PDMS stamps have shown limitations in nano-scale resolution soft lithography due to their low physical toughness and high thermal expansion coefficients, we developed stiffer, photocured PDMS silicon elastomers designed, specifically for nano-sized soft lithography and photopatternable nanofabrications.

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