scholarly journals Progress in III-nitrides: Process issue and purity perspective

2005 ◽  
Vol 28 (4) ◽  
pp. 355-360 ◽  
Author(s):  
J. Kumar
Keyword(s):  
Process Issue

3D Integrated Power—A Discrete Perspective

2015 ◽  
Author(s):  
Ian Kearney ◽  
Stephen Brink
Keyword(s):  
Heat Dissipation ◽  
Automatic Test Equipment ◽  
Systematic Analysis ◽  
Power Mosfet ◽  
Root Cause ◽  
Industry Standard ◽  
Bona Fide ◽  
Process Issue ◽  
Board Level ◽  
3D Package

Abstract The shift in power conversion and power management applications to thick copper clip technologies and thinner silicon dies enable high-current connections (overcoming limitations of common wire bond) and enhance the heat dissipation properties of System-in-Package solutions. Powerstage innovation integrates enhanced gate drivers with two MOSFETs combining vertical current flow with a lateral power MOSFET. It provides a low on-resistance and requires an extremely low gate charge with industry-standard package outlines - a combination not previously possible with existing silicon platforms. These advancements in both silicon and 3D Multi-Chip- Module packaging complexity present multifaceted challenges to the failure analyst. The various height levels and assembly interfaces can be difficult to deprocess while maintaining all the critical evidence. Further complicating failure isolation within the system is the integration of multiple chips, which can lead to false positives. Most importantly, the discrete MOSFET all too often gets overlooked as just a simple threeterminal device leading to incorrect deductions in determining true root cause. This paper presents the discrete power MOSFET perspective amidst the competing forces of the system-to-board-level failure analysis. It underlines the requirement for diligent analysis at every step and the importance as an analyst to contest the conflicting assumptions of challenging customers. Automatic Test Equipment (ATE) data-logs reported elevated power MOSFET leakage. Initial assumptions believed a MOSFET silicon process issue existed. Through methodical anamnesis and systematic analysis, the true failure was correctly isolated and the power MOSFET vindicated. The authors emphasize the importance of investigating all available evidence, from a macro to micro 3D package perspective, to achieve the bona fide path forward and true root cause.

Part II Legal Challenges, 6 European Antitrust Criminalization and the Second Challenge of Due Process: Imposing Criminal Sanctions alongside Civil Sanctions

2014 ◽  
Author(s):  
Whelan Peter
Keyword(s):  
Due Process ◽  
Eu Law ◽  
Double Jeopardy ◽  
Legal Requirement ◽  
Criminal Sanctions ◽  
Actual Impact ◽  
Exchange Of Information ◽  
Legal Challenges ◽  
Process Issue ◽  
Administrative Sanctions

This chapter evaluates the ‘additional dynamic’ contention which holds that the introduction of criminal antitrust sanctions in a particular jurisdiction does not preclude the imposition of civil/administrative sanctions alongside criminal sanctions for a given cartel. After establishing the validity of this contention, the chapter determines the actual impact of the contention, and hence the extent of the challenge presented by this aspect of the legal requirement of due process. A potential due process issue was identified with the exchange of information from administrative antitrust regimes to criminal antitrust regimes. The second identified issue of due process concerned ‘double jeopardy’. It was argued that this issue becomes relevant due to: (i) the validity of the ‘additional dynamic’ contention; and (ii) the fact that an individual can in fact constitute an ‘undertaking’ for the purposes of EU law. The final identified issue of due process related to concurrent proceedings.

In-Situ Control of Wafer Charge Neutralization During High Current Ion Implants

1993 ◽  
Vol 316 ◽  
Author(s):  
E.N. Shauly ◽  
E. Koltin ◽  
I. Munin ◽  
Y. Avrahamov
Keyword(s):  
Real Time ◽  
Ion Beam ◽  
High Yield ◽  
Wafer Surface ◽  
High Current ◽  
Charge Condition ◽  
Major Process ◽  
Process Issue ◽  
Current Monitoring

ABSTRACTIon implantation in semiconductor devices frequently leads to a substantial wafer surface charge build up. Control of this charge during high current implantation is a major process issue, as it may affect the yield and reliability of thin dielectric layers. In addition, the charge build up may affect the ion beam resulting in a non-uniform implant and a reduction in device yield. Control of a specific machine parameter, that will give the charge condition of the ion implanter will enable to neutralize the charge build up.In this study, Disk Current Monitoring (DCM) is shown to be a reliable method for monitoring the Electron Shower (ES) performance in real time. A correlation was found between DCM level and yields, and between DCM level and breakdown voltage, as well as different maintenance activities regarding me ES. A simple 5 steps method is described to achieve a reliable, real time charge monitor, to insure operation within the “High Yield Range”.

The Cooperative Resolution of Policy Conflict

1989 ◽  
Vol 83 (3) ◽  
pp. 905-921 ◽  
Author(s):  
Paul J. Quirk
Keyword(s):  
Political Institutions ◽  
Policy Process ◽  
Party Politics ◽  
Policy Conflict ◽  
Policy Conflicts ◽  
Game Theoretic ◽  
Process Issue ◽  
Issue Content

I develop an approach for analyzing the conditions for cooperative resolution of policy conflict. I analyze certain policy conflicts as bargaining situations, with opportunity for cooperation, among opposing issue factions. As a framework for analysis, I present an informal game-theoretic interpretation of nonzero-sum policy conflict. With that foundation, I derive implications about the conditions for cooperative outcomes with respect to several aspects of the policy process: issue content, the structure of conflict, leadership, party politics, and political institutions.

scholarly journals The Transition from the Temple of Jupiter to the Great Mosque of Damascus in Architecture and Design

2015 ◽  
Vol 5 ◽  
pp. 311-320
Author(s):  
Kamil Sobczak
Keyword(s):  
Strong Influence ◽  
Sacred Space ◽  
First Century ◽  
Saint John ◽  
Architecture And Design ◽  
Process Issue ◽  
Art And Architecture ◽  
The Temple ◽  
Religious Aspect

Great Mosque of Damascus was built between 705 and 715 by the Umayyad Caliph al-Walid I. However, the origins of this building dates to the distant past. At first it was a location of an ancient Aramaean temple dedicated to the god Hadad. With Hellenization the temple was dedicated to Zeus and in the first century BC the Romans transformation it into the Temple of Jupiter Damascenus. In 391 Emperor Theodosius converted the temple into Christian Cathedral of Saint John. Erection of the mosque by Caliph al-Walid I was under strong influence of earlier constructions. Meaning and consequences of such transitions, from the Roman temple (there is almost no data of the Aramaic building) through the Christian Cathedral to the Islamic mosque is an interesting process. Issue not only within the art and architecture, but what is more, in a religious aspect of the continuity of sacred space.

Failure Analysis for Gate Oxide Breakdown

2008 ◽  
Author(s):  
Xianfeng Chen ◽  
Ming Li ◽  
Qiang Guo ◽  
Kary Chien ◽  
YanBo Gao
Keyword(s):  
Failure Analysis ◽  
Substrate Surface ◽  
Gate Oxide ◽  
Surface Damage ◽  
Process Window ◽  
Mos Capacitors ◽  
Mos Capacitor ◽  
Oxide Breakdown ◽  
Oxide Deposition ◽  
Process Issue

Abstract Damage-free gate oxide is one of the important factors to ensure device performance and reliability. Special wafer accepts test structures such as a large size MOS capacitor must be laid on test line to monitor the oxide process issue and process window. However, it brings about many challenges to failure analysis engineer. To overcome the EFA and PFA limitations, fresh samples were taken from the passed wafer and the failed ones to identify the root cause of VBD failure. A novel lapping down method was used to access the capacitor structure. Two VBD failure cases were studied. In this study, poor wet clean process was defined as the cause of the silicon substrate surface damage and crystalline defect. It induced poor oxide deposition, which reduced breakdown voltage. Additionally, 12hrs BOE dip was shown to be an effective method for removing poly and oxide layers from large MOS capacitors.

scholarly journals Système et crise en politique internationale

2005 ◽  
Vol 15 (4) ◽  
pp. 755-788 ◽  
Author(s):  
Michael Brecher
Keyword(s):  
International Relations ◽  
System Change ◽  
Core System ◽  
The Third ◽  
The Core ◽  
Systemic Crisis ◽  
New Perspective ◽  
Definition Of ◽  
Process Issue ◽  
International Systems

This paper is designed to enrich basic concepts. The specific goals are twofold: to stimulate a renewed interest in a System orientation to international relations ; and to prepare the g round for an analysis of the system-crisis linkage, that is, crises as international earthquakes or triggers to System change. The first section analyses approches to international Systems. In the light of their shortcomings a revised definition of a System is presented, along with a discussion of the core System components - structure, process, issue, boundaries, context and environment. The second part attempts to break fresh ground on the concepts of stability and equilibrium. The third section provides a new perspective on systemic crisis. Part four confronts the major task of linking the unit and System levels of crisis analysis, conceptually and empirically.

An International Due Process Standard for Competition Adjudication? A Critical Approach

2020 ◽  
pp. 1-24
Author(s):  
Soojin NAM
Keyword(s):  
Decision Maker ◽  
Due Process ◽  
The United States ◽  
The European Union ◽  
Critical Approach ◽  
Administrative Procedures ◽  
Anglo American ◽  
The Right ◽  
Multinational Businesses ◽  
Process Issue

Abstract With the global proliferation of antitrust law enforcement, multinational businesses, scholars, and practitioners have clamoured for stronger due process protection in competition adjudication. Often, the argument assumes the existence of a due process standard applicable internationally to all competition jurisdictions. The standard comprises certain features typical of adversarial adjudication, including a neutral decision-maker, a live in-person hearing before such decision-maker, and the right to present and cross-examine evidence and witnesses. This paper challenges this alleged due process standard on two different levels by comparing the competition adjudication procedures of the United States Federal Trade Commission, the European Commission, and the Korea Fair Trade Commission. First, the paper shows that such a standard, which advances certain features of Anglo-American adversarial adjudication, is at odds with the local due process laws of the European Union and South Korea. Second, the paper shows that implementing such adversarial features would pose significant practical problems in jurisdictions where existing administrative procedures are largely inquisitorial or ‘continental.’ While the supporters of the due process argument identify a number of procedural problems that should be addressed, framing these problems as a due process issue would only be counterproductive.

The Mediator as Coalition Builder: George Mitchell in Northern Ireland

2003 ◽  
Vol 8 (1) ◽  
pp. 111-147 ◽  
Author(s):  
Daniel Curran ◽  
James Sebenius
Keyword(s):  
Northern Ireland ◽  
The Other ◽  
Significant Progress ◽  
Barriers And Opportunities ◽  
Dominant Coalition ◽  
Process Issue ◽  
Timing Strategies

AbstractIn 1996, George Mitchell became the co-chairman of the All-Party Talks in a polarized Northern Ireland where the extremes had the dominant voice while the center was relatively mute politically. In analyzing Mitchell's actions, we seek to break new ground in the study of mediation. First, we explicitly assess the context to identify key barriers and opportunities. Second, we move beyond general categories of mediator approach – such as communication, formulation, and manipulation – to match classes of mediator action to barriers. Finally,we place these discrete actions in service of a larger purpose by exploring the "mediator as coalition-builder."Whether explicit or implicit, Mitchell's overarching approach in the All-Party Peace Talks can be interpreted as a drive toward creating an outward rippling "coalition of the center against the extremes."Mitchell's effort to forge a coalition of the center led him to follow coordinated and multi-pronged process, issue and timing strategies, which are the main focus of this article. In principle, Mitchell might have sought to forge agreement via very different potential coalitional approaches: for example, seeking to bridge the extremes, seeking consensus among all parties, seeking to forge a dominant coalition on one side or the other that could have prevailed over its opponents, or seeking a sequential divideand-conquer approach to isolate and overwhelm the opposition, etc. Yet for this particular context, the centrist coalitional approach led to significant progress.

scholarly journals Integrating Building Information Modelling and Intelligent Contract to Payment Process Under Conventional Procurement in Malaysia

2019 ◽  
Vol 1 (2) ◽  
pp. 79-81
Author(s):  
Rozana Mohamed Salleh ◽  
Nur Emma Mustaffa ◽  
Nafisah Abdul Rahiman
Keyword(s):  
Construction Industry ◽  
Digital Technology ◽  
Construction Projects ◽  
Building Information Modelling ◽  
Information Modelling ◽  
Project Completion ◽  
Technological Advances ◽  
Building Information ◽  
Process Issue ◽  
To Receive

Conflict caused by payment issues are common in construction industry.  A lengthy payment process issue is a common phenomenon especially in public work projects, which commonly opt for conventional contracts.  Delay in payment process have caused many contractors not being able to receive payment within the stipulated time.  In turn, it may affect the contractor’s cash flow and eventually ended up causing delays in project completion. The effect of technological advances has brought significant changes to the construction industry, which is year after year becoming increasingly complex.  Therefore, in the era of technology and digital, there are many management systems which have been established and introduced amongst construction players for the convenience of managing and administering construction projects.  The introduction of Building Information Modelling (BIM) is to establish a centralised information system, which improves the collaboration, communication and integration between interdisciplines in construction industry.  The development of digital technology of Intelligent Contracts will bring great potential as an automate support system in BIM management process.  These combinations create possible solutions towards payment conflicts in the construction project, through integration of BIM and Intelligent Contracts that may help to reduce the unnecessary procedure and interference that prolong the payment process. The analysis revealed that the adoption of BIM and Intelligent Contracts attributes in payment process under conventional procurement could improve the efficiency and reduce the time by eliminating unnecessary procedure and third parties interference along the process.

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