Improved mechanical properties in new, Pb-free solder alloys

1994 ◽  
Vol 23 (8) ◽  
pp. 715-720 ◽  
Author(s):  
M. Mccormack ◽  
S. Jin
Keyword(s):  
Mechanical Properties ◽  
Solder Alloys ◽  
Free Solder

Nanoindentation Characterization of Lead-free Solders and Intermetallic Compounds under Thermal Aging

2010 ◽  
Vol 2010 (1) ◽  
pp. 000314-000318
Author(s):  
Tong Jiang ◽  
Fubin Song ◽  
Chaoran Yang ◽  
S. W. Ricky Lee
Keyword(s):  
Mechanical Properties ◽  
Thermal Aging ◽  
Solder Joints ◽  
Lead Free ◽  
Small Range ◽  
Lead Free Solder ◽  
Solder Alloys ◽  
Aging Test ◽  
Free Solder ◽  
Lead Free Solders

The enforcement of environmental legislation is pushing electronic products to take lead-free solder alloys as the substitute of traditional lead-tin solder alloys. Applications of such alloys require a better understanding of their mechanical behaviors. The mechanical properties of the lead-free solders and IMC layers are affected by the thermal aging. The lead-free solder joints on the pads subject to thermal aging test lead to IMC growth and cause corresponding reliability concerns. In this paper, the mechanical properties of the lead-free solders and IMCs were characterized by nanoindentation. Both the Sn-rich phase and Ag3Sn + β-Sn phase in the lead-free solder joint exhibit strain rate depended and aging soften effect. When lead-free solder joints were subject to thermal aging, Young's modulus of the (Cu, Ni)6Sn5 IMC and Cu6Sn5 IMC changed in very small range. While the hardness value decreased with the increasing of the thermal aging time.

Influence of Indium and Antimony Additions on Mechanical Properties and Microstructure of Sn-3.0Ag-0.5Cu Lead Free Solder Alloys

2017 ◽  
Vol 266 ◽  
pp. 196-200 ◽  
Author(s):  
Suchart Chantaramanee ◽  
Phairote Sungkhaphaitoon ◽  
Thawatchai Plookphol
Keyword(s):  
Mechanical Properties ◽  
Grain Size ◽  
Vickers Microhardness ◽  
Lead Free ◽  
Mechanical And Thermal Properties ◽  
Lead Free Solder ◽  
Solder Alloys ◽  
Sac305 Solder ◽  
Percent Elongation ◽  
Free Solder

In this research, we investigated the influence of indium and antimony additions on the microstructure, mechanical and thermal properties of Sn-3.0Ag-0.5Cu lead free solder alloys. The results revealed that the addition of 0.5 wt.%InSb into SAC305 solder alloys resulted to a reduced melting temperature by 3.8 °C and IMCs phases formed new Ag3(Sn,In) and SnSb in the Sn-rich matrix with a decreased grain size of 28%. These phases improved the mechanical properties of solder alloys. In addition, the mechanical properties of SAC305 solder alloys increased by adding 0.5 wt.%InSb, resulting in an increase of ultimate tensile strength of 24%, but the percent elongation decreased to 45.8%. Furthermore, the Vickers microhardness slightly increased of the SAC305 solder alloys.

scholarly journals Evaluation of Mechanical Properties of Pb Free Solder Alloys.

1997 ◽  
Vol 12 (7) ◽  
pp. 503-506
Author(s):  
Kazuki TATEYAMA ◽  
Takashi EBISUYA ◽  
Hiroshi YAMADA ◽  
Kuniaki TAKAHASHI
Keyword(s):  
Mechanical Properties ◽  
Solder Alloys ◽  
Free Solder

scholarly journals Improved Reliability and Mechanical Performance of Ag Microalloyed Sn58Bi Solder Alloys

Metals ◽  
2019 ◽  
Vol 9 (4) ◽  
pp. 462 ◽  
Author(s):  
Guang Ren ◽  
Maurice N. Collins
Keyword(s):  
Mechanical Properties ◽  
Mechanical Performance ◽  
Temperature Cycling ◽  
Time To Failure ◽  
Solder Alloys ◽  
Hardening Mechanism ◽  
Solder Microstructure ◽  
Free Solder ◽  
Board Level ◽  
Board Level Reliability

Ag microalloyed Sn58Bi has been investigated in this study as a Pb-free solder candidate to be used in modern electronics industry in order to cope with the increasing demands for low temperature soldering. Microstructural and mechanical properties of the eutectic Sn58Bi and microalloyed Sn57.6Bi0.4Ag solder alloys were compared. With the addition of Ag microalloy, the tensile strength was improved, and this was attributed to a combination of microstructure refinement and an Ag3Sn precipitation hardening mechanism. However, ductility was slightly deteriorated due to the brittle nature of the Ag3Sn intermetallic compounds (IMCs). Additionally, a board level reliability study of Ag microalloyed Sn58Bi solder joints produced utilizing a surface-mount technology (SMT) process, were assessed under accelerated temperature cycling (ATC) conditions. Results revealed that microalloyed Sn57.6Bi0.4Ag had a higher characteristic lifetime with a narrower failure distribution. This enhanced reliability corresponds with improved bulk mechanical properties. It is postulated that Ag3Sn IMCs are located at the Sn–Bi phase boundaries and suppress the solder microstructure from coarsening during the temperature cycling, hereby extending the time to failure.

Microstructure and mechanical properties of Sn–Bi, Sn–Ag and Sn–Zn lead-free solder alloys

2013 ◽  
Vol 572 ◽  
pp. 97-106 ◽  
Author(s):  
Wislei R. Osório ◽  
Leandro C. Peixoto ◽  
Leonardo R. Garcia ◽  
Nathalie Mangelinck-Noël ◽  
Amauri Garcia
Keyword(s):  
Mechanical Properties ◽  
Lead Free ◽  
Lead Free Solder ◽  
Solder Alloys ◽  
Microstructure And Mechanical Properties ◽  
Free Solder

scholarly journals Effects Of Nickel On The Microstructure And The Mechanical Properties Of Sn-0.7Cu Lead-Free Solders

2015 ◽  
Vol 60 (2) ◽  
pp. 1449-1454 ◽  
Author(s):  
A. Gyenes ◽  
A. Simon ◽  
P. Lanszki ◽  
Z. Gácsi
Keyword(s):  
Mechanical Properties ◽  
Morphological Evolution ◽  
Nickel Content ◽  
Lead Free ◽  
Solder Alloys ◽  
Nickel Addition ◽  
Free Solder ◽  
Ni Additions ◽  
Lead Free Solders ◽  
Addition Level

AbstractThis paper investigates the effects of small amount nickel addition (0, 200, 400, 800, 1800 ppm) on the microstructure and the mechanical properties of Sn-0.7Cu lead-free solder alloys. It is known that even ppm level Ni additions have significant effects on the microstructure of Sn-Cu solder alloys. Ni suppresses the growth ofβ-Sn dendrites in favour of eutectic formation. As the nickel content increases, the microstructure undergoes a morphological evolution from hypoeutectic through fully eutectic to hypereutectic. Along with these transformations, the mechanical properties of the alloy also significantly change. Based on the experimental results presented in this paper, the Sn-0.7Cu solder achieves maximum strength at the addition level of 800 ppm Ni, when the microstructure becomes fully eutectic.

High Strain Rate Mechanical Properties of SAC-Q Solder for Extreme Temperatures After Exposure to Isothermal Aging Up to 90 Days

2021 ◽  
Author(s):  
Pradeep Lall ◽  
Vishal Mehta ◽  
Jeffrey C. Suhling ◽  
Ken Blecker
Keyword(s):  
Mechanical Properties ◽  
Oil And Gas ◽  
High Strain ◽  
Strain Rates ◽  
Solder Alloys ◽  
Aerospace Medical ◽  
Free Solder ◽  
Electronic Parts ◽  
Sac Solder ◽  
Temperature Storage

Abstract In many industries, such as automotive, oil and gas, aerospace, medical technologies, electronic parts can often be exposed to high strain loads during shocks, vibrations and drop-impact conditions. Such electronic parts can often be subjected to extreme low and high temperatures ranging from -65oC to 200oC. Also, these electronic devices can be subjected to strain rates of 1 to 100 per second in the critical environment. Recently, many doped SAC solder alloys are being introduced in the electronic component e.g. SAC-Q, SAC-R, Innolot, etc. SAC-Q is made with addition of Bi in Sn-Ag-Cu are composition. Mechanical characteristic results and data for lead-free solder alloys are extremely important for optimizing electronic package reliability, at high temperature storage and elevated strain rates. Furthermore, the mechanical properties of solder alloys can be changed significantly due to a thermal aging, which is causing modification of microstructure. Data for the SAC-Q solder alloy with a high temp aging and testing at extreme low to high operating temperatures are not available.

scholarly journals Evaluation of Microstructures and Mechanical Properties of Sn-10Sb-Ni Lead-Free Solder Alloys with Small Amount of Ni Using Miniature Size Specimens

Metals ◽  
2019 ◽  
Vol 9 (12) ◽  
pp. 1348
Author(s):  
Tatsuya Kobayashi ◽  
Ikuo Shohji
Keyword(s):  
Mechanical Properties ◽  
Lead Free ◽  
Fatigue Properties ◽  
Strength Increase ◽  
Lead Free Solder ◽  
Solder Alloys ◽  
Power Module ◽  
Power Semiconductors ◽  
Ni Content ◽  
Free Solder

Sn-Sb-Ni solder alloy is expected to be used as a die-attach material for a next-generation power semiconductors in power module. The aim of this paper is to investigate the effects of the Ni content on microstructures, tensile, and fatigue properties of Sn-10Sb-xNi (x = 0.05, 0.10, 0.25, 0.50) (mass%) lead-free solder alloys using miniature size specimens. The Sn-10Sb-Ni solder alloys have the microstructure in which Sb-Sn and Ni-Sb compounds are dispersed in the β-Sn matrix. As the Sb and Ni content increases, Sb-Sn and Ni-Sb compounds are coarsened, respectively. The effect of the Ni content on tensile properties of the alloy is slight at 25 °C. At 150 °C and 200 °C, 0.1% proof stress and tensile strength increase gradually with the Ni content increases, and saturate at the Ni amount over 0.25 mass%. According to the fatigue test at 200 °C, the fatigue properties of Sn-10Sb-Ni with 0.10–0.25 mass% Ni are better than that of the Sn-10Sb. From the experimental results, Sn-10Sb-Ni with 0.10–0.25 mass% Ni have superior mechanical properties.

Mechanical properties of Sn–Ag lead-free solder alloys based on the dendritic array and Ag3Sn morphology

2013 ◽  
Vol 562 ◽  
pp. 194-204 ◽  
Author(s):  
Wislei R. Osório ◽  
Daniel R. Leiva ◽  
Leandro C. Peixoto ◽  
Leonardo R. Garcia ◽  
Amauri Garcia
Keyword(s):  
Mechanical Properties ◽  
Lead Free ◽  
Lead Free Solder ◽  
Solder Alloys ◽  
Dendritic Array ◽  
Free Solder

scholarly journals Microstructure and mechanical properties of Sn-9Zn-xAl and Sn-9Zn-xCu lead-free solder alloys

2020 ◽  
Vol 38 (1) ◽  
pp. 34-40
Author(s):  
B. Yavuzer ◽  
D. Özyürek ◽  
T. Tunçay
Keyword(s):  
Mechanical Properties ◽  
Tensile Strength ◽  
Eutectic Alloy ◽  
Investment Casting ◽  
The Other ◽  
Lead Free ◽  
Lead Free Solder ◽  
Solder Alloys ◽  
Casting Method ◽  
Free Solder

AbstractThis study investigates microstructures and mechanical properties of the alloys obtained by adding Cu (0.7 % and 0.9 %) and Al (0.7 % and 0.9 %) to lead-free Sn-9Zn eutectic soldering alloy produced by investment casting method. The results show that Cu5Zn8 phase has formed in the structure of Cu added alloys and the Al2O3 phase has formed due to addition of Al. It was found that small and round-shaped Al2O3 phase increased the tensile strength of the new alloy compared to the eutectic alloy. In addition, it was observed that the microhardness of Cu added alloys was lower than that of Sn-9Zn eutectic alloy, but the microhardness of alloys containing Al was higher compared to the other eutectic Sn-9Zn alloy.

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