Radiometric investigation of electrodeless copper plating from EDTA-complex solutions, containing glycine

1999 ◽  
Vol 240 (1) ◽  
pp. 371-374
Author(s):  
O. Gyliené ◽  
R. Tarozaité ◽  
N. Čiukšiené ◽  
J. Butkevičius
Keyword(s):  
Copper Plating ◽  
Edta Complex ◽  
Complex Solutions ◽  
Radiometric Investigation

scholarly journals Mechanism of electroless copper plating from EDTA-complex bath.

1990 ◽  
Vol 41 (10) ◽  
pp. 1039-1043
Author(s):  
Shozo MIZUMOTO ◽  
Hidemi NAWAFUNE ◽  
Kuniyoshi MATSUMOTO ◽  
Motoo KAWASAKI
Keyword(s):  
Copper Plating ◽  
Edta Complex ◽  
Electroless Copper Plating ◽  
Electroless Copper

The Employment of 197Hg EDTA in Kidney Scanning

1965 ◽  
Vol 05 (01) ◽  
pp. 56-67
Author(s):  
I. Pál ◽  
J. Földes ◽  
I. Krasznai
Keyword(s):  
Radiation Dose ◽  
Renal Cortex ◽  
Radiation Doses ◽  
Intravenous Pyelography ◽  
Edta Complex

SummaryThe authors investigated the use of 197Hg EDTA complex for kidney scanning. They describe the physical, biological and toxicological properties of the compound; its distribution within the organism, its excretion with urine and faeces and its uptake by the kidneys. The authors have established that the renal cortex selectively secretes the material which makes it suitable for kidney scanning. Some scintigrams of both normal and pathologic kidneys are presented.Finally a detailed discussion of the dosimetry is included. The radiation doses due to 197Hg EDTA are compared with those due to 203Hg-neohydrin and to intravenous pyelography. This comparison shows clearly that the use of 197Hg EDTA considerably decreases the radiation dose to the patient.

Electroless Copper Plating of Titanium Condenser Tubes for Biofouling Control

2016 ◽  
Vol 6 (1) ◽  
pp. 65-73
Author(s):  
Balakrishnan Anandkumar ◽  
Rani P. George ◽  
Alagarsamy Karthik ◽  
Dasnamoorthy Ramachandran ◽  
Uthandi Kamachi Mudali
Keyword(s):  
Copper Plating ◽  
Electroless Copper Plating ◽  
Electroless Copper ◽  
Biofouling Control

Novel fabrication of low-cost Ti–Cu alloy by electroless copper plating and vacuum sintering

Vacuum ◽  
2021 ◽  
pp. 110330
Author(s):  
Chunming Wang ◽  
Luming Zeng ◽  
Wucheng Ding ◽  
Tongxiang Liang
Keyword(s):  
Low Cost ◽  
Copper Plating ◽  
Vacuum Sintering ◽  
Electroless Copper Plating ◽  
Cu Alloy ◽  
Electroless Copper
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