Calorimetric study of oxygen bond strength in the surface layer of manganese dioxide

1977 ◽  
Vol 7 (2) ◽  
pp. 133-137
Author(s):  
Yu. D. Pankratiev ◽  
V. M. Turkov ◽  
M. Forissier ◽  
J. L. Portefaix
Keyword(s):  
Surface Layer ◽  
Bond Strength ◽  
Manganese Dioxide ◽  
Calorimetric Study ◽  
Oxygen Bond

scholarly journals Importance of the oxygen bond strength for catalytic activity in soot oxidation

2016 ◽  
Vol 188 ◽  
pp. 235-244 ◽  
Author(s):  
Jakob M. Christensen ◽  
Jan-Dierk Grunwaldt ◽  
Anker D. Jensen
Keyword(s):  
Catalytic Activity ◽  
Bond Strength ◽  
Soot Oxidation ◽  
Oxygen Bond

Carbon−Oxygen Bond Strength in Diphenyl Ether and Phenyl Vinyl Ether:  An Experimental and Computational Study

1997 ◽  
Vol 101 (30) ◽  
pp. 5404-5411 ◽  
Author(s):  
Wibo van Scheppingen ◽  
Edwin Dorrestijn ◽  
Isabel Arends ◽  
Peter Mulder ◽  
Hans-Gert Korth
Keyword(s):  
Bond Strength ◽  
Vinyl Ether ◽  
Computational Study ◽  
Diphenyl Ether ◽  
Oxygen Bond ◽  
Phenyl Vinyl

scholarly journals Effect of Removal of Enamel on Rebonding Strength of Resin Composite to Enamel

2016 ◽  
Vol 2016 ◽  
pp. 1-7 ◽  
Author(s):  
L. Kilponen ◽  
L. Lassila ◽  
M. Tolvanen ◽  
J. Varrela ◽  
P. K. Vallittu
Keyword(s):  
Surface Layer ◽  
Bond Strength ◽  
Resin Composite ◽  
Optical Profilometer ◽  
Bond Strengths

Objective. To examine the effect of removing the surface layer of enamel on the rebonding strength of resin composite.Methods. Teeth in four groups (n=10) were etched, a small amount of resin composite was bonded and debonded, then specimens in three groups were ground for different lengths of time (10 s, 20 s, 30 s) to remove an increasing amount of enamel, one group was left untouched. The teeth were bonded again and the bond strengths of 1st and 2nd bonding were compared and analysed against the amount of enamel loss in different groups (7 µm (±2); 12 µm (±1); 16 µm (±3)). Specimens were examined with SEM and by noncontacting optical profilometer.Results. Although results indicated higher rebonding strength with increasing enamel removal ANOVA showed low statistical differences between the groups (p>0.05). However, values between first bonding and rebonding strengths differed significantly (p<0.05) in the group that was not ground. SEM revealed that enamel-surfaces that were ground after debonding etched well, compared to the surfaces that still contained adhesive remnants.Conclusions. Removal of small amount of enamel refreshed the surface for rebonding. Rebonding strengths without grinding the surface before bonding were lower than bond strength to intact enamel.

Adhesion of Resins to Ag-Pd Alloys by Means of the Silicoating Technique

1987 ◽  
Vol 66 (8) ◽  
pp. 1380-1385 ◽  
Author(s):  
H. Herø ◽  
I.E. Ruyter ◽  
M.L. Waarli ◽  
G. Hultquist
Keyword(s):  
Surface Layer ◽  
Bond Strength ◽  
Chemical Bonding ◽  
Silicon Oxide ◽  
Surface Defects ◽  
Water Storage ◽  
Flame Spraying ◽  
Four Point Bending ◽  
Bond Strengths ◽  
Oxide Particles

The purpose of the investigation was to study the effect of water storage on the bond strengths between silanized, silicoated Ag-Pd alloys and veneered composites, in comparison with the bond strengths of systems with conventional retention beads. Furthermore, the mechanism of the bonding was examined. The bond strength of silanized, silicoated dry specimens and similar specimens stored in water was measured by four-point bending. Water storage for 90 days at 37°C reduced the bond strength by approximately 30% to about 15-20 MPa. Mechanical retention beads caused bond strengths of approximately 16-18 MPa which were unaffected by water storage. SEM and microprobe investigations showed that sandblasting with Al2O3 prior to silanization caused substantial numbers of cracks and porosities in the surface layer of the alloy, partly filled with Al2O3. Some particles of silicon oxide in these surface defects were produced by the flame-spraying of the so-called silicoating technique. Further painting of the surface with a silane adhesion primer provided chemical bonding to the composite at the densely spaced Si-O-H-containing silica particles. Many cracks were observed in the interfaces between these particles; thus, water is likely to penetrate the interface with time. The bond strength is most likely reduced by reaction between water and the compositelSi-O structure. The silicon oxide particles are probably attached to the alloy substrate by mechanical retention. Without sandblasting, no bonding was obtained by means of the silicoating technique.

Carbon-oxygen bond strength as a control of reaction kinetics: Phenol on Mo(110)

1989 ◽  
Vol 209 (3) ◽  
pp. L163-L175 ◽  
Author(s):  
J.G. Serafin ◽  
C.M. Friend
Keyword(s):  
Bond Strength ◽  
Reaction Kinetics ◽  
Oxygen Bond

Zu einer Bindungslängen-Kristallchemie

1992 ◽  
Vol 200 (3-4) ◽  
Author(s):  
Martin Trömel
Keyword(s):  
Electrical Conductivity ◽  
Bond Strength ◽  
Bond Length ◽  
Chemical Bonds ◽  
Ionic Radii ◽  
Interatomic Distances ◽  
Secondary Bonds ◽  
Oxidizing Power ◽  
Oxygen Bond ◽  
Weak Chemical

AbstractFundamentals of a bond length based crystal chemistry which emerges from the bond valence method and goes beyond the concept of ionic radii are discussed. In many cases, atomic distances can serve as a measure of chemical bonding. Unobserved interatomic distances and ionic radii can be predicted from bond-length – bond-strength relationships. Electrical conductivity appears to be connected with peculiarities of bondlengths. The oxidizing power of oxides and oxo-complexes seems to be correlated with oxygen bond-lengths. Secondary bonds and intermolecular interactions appear as weak chemical bonds.

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