Effect of neutron irradiation on the long-term thermal cycling resistance of austenitic steels

1986 ◽  
Vol 18 (5) ◽  
pp. 599-605
Author(s):  
Yu. F. Balandin ◽  
A. F. Malygin ◽  
V. A. Nikolaev
Keyword(s):  
Thermal Cycling ◽  
Neutron Irradiation ◽  
Austenitic Steels

Analysis of Long-Term and Thermal Cycling Tests for a Commercial Solid Oxide Fuel Cell

2017 ◽  
Vol 14 (4) ◽  
Author(s):  
Dustin Lee ◽  
Jing-Kai Lin ◽  
Chun-Huang Tsai ◽  
Szu-Han Wu ◽  
Yung-Neng Cheng ◽  
...  
Keyword(s):  
Fuel Cell ◽  
Thermal Cycling ◽  
Solid Oxide Fuel Cell ◽  
Coefficient Of Thermal Expansion ◽  
Solid Oxide ◽  
Oxide Fuel ◽  
Flow Rates ◽  
Degradation Rates ◽  
Two Stages

The effects of isothermally long-term and thermal cycling tests on the performance of an ASC type commercial solid oxide fuel cell (SOFC) have been investigated. For the long-term test, the cells were tested over 5000 h in two stages, the first 3000 h and the followed 2000 h, under the different flow rates of hydrogen and air. Regarding the thermal cycling test, 60 cycles in total were also divided into two sections, the temperature ranges of 700 °C to 250 °C and 700 °C to 50 °C were applied for the every single cycle of first 30 cycles and the later 30 cycles, respectively. The results of long-term test show that the average degradation rates for the cell in the first 3000 h and the followed 2000 h under different flow rates of fuel and air are 1.16 and 2.64%/kh, respectively. However, there is only a degradation of 6.6% in voltage for the cell after 60 thermal cycling tests. In addition, it is found that many pores formed in the anode of the cell which caused by the agglomeration of Ni after long-term test. In contrast, the vertical cracks penetrating through the cathode of the cell and the in-plane cracks between the cathode and barrier layer of the cell formed due to the coefficient of thermal expansion (CTE) mismatch after 60 thermal cycling tests.

Impact of isothermal aging on fine pitch BGA packages with Sn-Ag-Cu solder interconnects

2010 ◽  
Vol 2010 (1) ◽  
pp. 000298-000305
Author(s):  
Tae-Kyu Lee ◽  
Weidong Xie ◽  
Thomas R. Bieler ◽  
Kuo-Chuan Liu ◽  
Jie Xue
Keyword(s):  
Thermal Cycling ◽  
Microstructure Evolution ◽  
Isothermal Aging ◽  
Substrate Surface ◽  
Solder Interconnects ◽  
Surface Finishes ◽  
Bga Packages ◽  
Fine Pitch ◽  
Solder Balls

The interaction between isothermal aging and long-term reliability of fine pitch ball grid array (BGA) packages with Sn-3.0Ag-0.5Cu (wt%) solder ball interconnects are investigated. In this study, 0.4mm fine pitch packages with 0.3mm diameter Sn-Ag-Cu solder balls are used. Two different die sizes and two different package substrate surface finishes are selected to compare the internal strain impact and alloy effect, especially the Ni effect during thermal cycling. To see the thermal impact on the thermal performance and long-term reliability, the samples are isothermally aged and thermal cycled from 0 to 100°C with a 10minute dwell time. Based on weibull plots for each aging condition, the lifetime of the package reduced approximately 44% with 150°C aging precondition. The microstructure evolution is observed during thermal aging and thermal cycling with different phase microstructure transformations between electrolytic Ni/Au and OSP surface finishes, focusing on the microstructure evolution near the package side interface. Different mechanisms after aging at various conditions are observed, and their impacts on the fatigue life of solder joints are discussed.

Influence of LBE long term exposure and simultaneous fast neutron irradiation on the mechanical properties of T91 and 316L

2016 ◽  
Vol 473 ◽  
pp. 28-34 ◽  
Author(s):  
E. Stergar ◽  
S.G. Eremin ◽  
S. Gavrilov ◽  
M. Lambrecht ◽  
O. Makarov ◽  
...  
Keyword(s):  
Mechanical Properties ◽  
Fast Neutron ◽  
Neutron Irradiation ◽  
Fast Neutron Irradiation
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