Fractal-time stochastic processes and dynamic functions of polymeric systems

1990 ◽  
Vol 29 (2) ◽  
pp. 137-144 ◽  
Author(s):  
J. Stastna ◽  
D. De Kee ◽  
M. Powley ◽  
P. Schümmer ◽  
B. Otten
Gels ◽  
2021 ◽  
Vol 7 (1) ◽  
pp. 32
Author(s):  
Alessandra Adrover ◽  
Claudia Venditti ◽  
Massimiliano Giona

Experiments on swelling and solute transport in polymeric systems clearly indicate that the classical parabolic models fail to predict typical non-Fickian features of sorption kinetics. The formulation of moving-boundary transport models for solvent penetration and drug release in swelling polymeric systems is addressed hereby employing the theory of Poisson–Kac stochastic processes possessing finite propagation velocity. The hyperbolic continuous equations deriving from Poisson–Kac processes are extended to include the description of the temporal evolution of both the Glass–Gel and the Gel–Solvent interfaces. The influence of polymer relaxation time on sorption curves and drug release kinetics is addressed in detail.


2002 ◽  
Vol 722 ◽  
Author(s):  
Ram W. Sabnis ◽  
Mary J. Spencer ◽  
Douglas J. Guerrero

AbstractNovel organic, polymeric materials and processes of depositing thin films on electronics substrates by chemical vapor deposition (CVD) have been developed and the lithographic behavior of photoresist coated over these CVD films at deep ultraviolet (DUV) wavelength has been evaluated. The specific monomers synthesized for DUV applications include [2.2](1,4)- naphthalenophane, [2.2](9,10)-anthracenophane and their derivatives which showed remarkable film uniformity on flat wafers and conformality over structured topography wafers, upon polymerization by CVD. The chemical, physical and optical properties of the deposited films have been characterized by measuring parameters such as thickness uniformity, solubility, conformality, adhesion to semiconductor substrates, ultraviolet-visible spectra, optical density, optical constants, defectivity, and resist compatibility. Scanning electron microscope (SEM) photos of cross-sectioned patterned wafers showed verticle profiles with no footing, standing waves or undercut. Resist profiles down to 0.10 νm dense lines and 0.09 νm isolated lines were achieved in initial tests. CVD coatings generated 96-100% conformal films, which is a substantial improvement over commercial spin-on polymeric systems. The light absorbing layers have high optical density at 248 nm and are therefore capable materials for DUV lithography applications. CVD is a potentially useful technology to extend lithography for sub-0.15 νm devices. These films have potential applications in microelectronics, optoelectronics and photonics.


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