Current distributions in a two-dimensional random-resistor network

1992 ◽  
Vol 67 (1-2) ◽  
pp. 113-121 ◽  
Author(s):  
E. Duering ◽  
R. Blumenfeld ◽  
D. J. Bergman ◽  
A. Aharony ◽  
M. Murat
VLSI Design ◽  
2001 ◽  
Vol 13 (1-4) ◽  
pp. 363-367
Author(s):  
C. Pennetta ◽  
L. Reggiani ◽  
Gy. Trefán ◽  
R. Cataldo ◽  
G. De Nunzio

Degradation of thin film interconnects and ultra-thin dielectrics is studied within a stochastic approach based on a percolation technique. The thin film is modelled as a two-dimensional random resistor network at a given temperature and its degradation is characterized by a breaking probability of the single resistor. A recovery of the damage is also allowed so that a steady-state condition can be achieved. The main features of experiments are reproduced. This approach provides a unified description of degradation and failure processes in terms of physical parameters.


1992 ◽  
Vol 46 (19) ◽  
pp. 12137-12141 ◽  
Author(s):  
K. W. Yu ◽  
P. Y. Tong

2000 ◽  
Vol 612 ◽  
Author(s):  
C. Pennetta ◽  
L. Reggiani ◽  
Gy. Trefán ◽  
F. Fantini ◽  
A. Scorzoni ◽  
...  

AbstractWe present a stochastic model which simulates electromigration damage in metallic interconnects by biased percolation of a random resistor network. The main features of experiments including Black's law and the log-normal distribution of the times to failure are well reproduced together with compositional effects showing up in early stage measurements made on Al-0.5%Cu and Al-1%Si lines.


1990 ◽  
Vol 41 (7) ◽  
pp. 4610-4618 ◽  
Author(s):  
A. B. Harris ◽  
Yigal Meir ◽  
Amnon Aharony

2011 ◽  
Vol 199-200 ◽  
pp. 44-53 ◽  
Author(s):  
Sergiy Kalnaus ◽  
Adrian S. Sabau ◽  
Sarah Newman ◽  
Wyatt E. Tenhaeff ◽  
Claus Daniel ◽  
...  

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