The influence of substrate material and annealing procedure on the properties of superconducting thin films

1988 ◽  
Vol 46 (3) ◽  
pp. 215-220 ◽  
Author(s):  
T. S. Baller ◽  
G. N. A. Veen ◽  
H. A. M. Hal
Coatings ◽  
2021 ◽  
Vol 11 (2) ◽  
pp. 173
Author(s):  
Paul Schmitt ◽  
Vivek Beladiya ◽  
Nadja Felde ◽  
Pallabi Paul ◽  
Felix Otto ◽  
...  

Ultra-thin metallic films are widely applied in optics and microelectronics. However, their properties differ significantly from the bulk material and depend on the substrate material. The nucleation, film growth, and layer properties of atomic layer deposited (ALD) iridium thin films are evaluated on silicon wafers, BK7, fused silica, SiO2, TiO2, Ta2O5, Al2O3, HfO2, Ru, Cr, Mo, and graphite to understand the influence of various substrate materials. This comprehensive study was carried out using scanning electron and atomic force microscopy, X-ray reflectivity and diffraction, four-point probe resistivity and contact angle measurements, tape tests, and Auger electron spectroscopy. Within few ALD cycles, iridium islands occur on all substrates. Nevertheless, their size, shape, and distribution depend on the substrate. Ultra-thin (almost) closed Ir layers grow on a Ta2O5 seed layer after 100 cycles corresponding to about 5 nm film thickness. In contrast, the growth on Al2O3 and HfO2 is strongly inhibited. The iridium growth on silicon wafers is overall linear. On BK7, fused silica, SiO2, TiO2, Ta2O5, Ru, Cr, and graphite, three different growth regimes are distinguishable. The surface free energy of the substrates correlates with their iridium nucleation delay. Our work, therefore, demonstrates that substrates can significantly tailor the properties of ultra-thin films.


2015 ◽  
Vol 585 ◽  
pp. 40-44 ◽  
Author(s):  
S.A. Bashkirov ◽  
V.F. Gremenok ◽  
V.A. Ivanov ◽  
V.V. Shevtsova ◽  
P.P. Gladyshev

2017 ◽  
Vol 68 (7) ◽  
pp. 3-9
Author(s):  
Kateřina Dragounová ◽  
Tibor Ižák ◽  
Alexander Kromka ◽  
Zdeněk Potůček ◽  
Zdeněk Bryknar ◽  
...  

AbstractNanocrystalline diamond films with bright photoluminescence of silicon-vacancy colour centres have been grown using a microwave plasma enhanced CVD technique. The influence of substrate material (quartz, Al2O3, Mo and Si) on a reproducible fabrication of diamond thin films with Si-V optical centres is presented. Film quality and morphology are characterized by Raman spectroscopy and SEM technique. SEM shows well faceted diamond grains with sizes from 170 to 300 nm. The diamond peak is confirmed in Raman spectra for all samples. In the case of the quartz substrate, a redshift of the diamond peak is observed (≈3.5 cm−1) due to tension in the diamond film. The steady-state photoluminescence intensity was measured in the temperature range from 11 K to 300 K. All spectra consist of a broad emission band with a maximum near 600 nm and of a sharp zero phonon line in the vicinity of 738 nm corresponding to Si-V centres that is accompanied with a phonon sideband peaking at 757 nm. Activation energies for the thermal quenching of Si-V centre photoluminescence were determined and the effect of the substrate on photoluminescence properties is discussed too.


1994 ◽  
Vol 9 (5) ◽  
pp. 1126-1133 ◽  
Author(s):  
D.S. Ginley ◽  
L. Barr ◽  
C.I.H. Ashby ◽  
T.A. Plut ◽  
D. Urea ◽  
...  

The development of passive and active electronics from high-temperature superconducting thin films depends on the development of process technology capable of producing appropriate feature sizes without degrading the key superconducting properties. We present a new class of chelating etches based on di- and tri-carboxylic acids that are compatible with positive photoresists and can produce submicron feature sizes while typically producing increases in the microwave surface resistance at 94 GHz by less than 10%. This simple etching process works well for both the Y-Ba-Cu-O and Tl-Ba-Ca-Cu-O systems. In addition, we demonstrate that the use of chelating etches with an activator such as HF allows the etching of related oxides such as LaAlO3, which is a key substrate material, and Pb(Zr0.53Ti0.47)O3 (PZT) which is a key ferroelectric material for HTS and other applications such as nonvolatile memories.


2018 ◽  
Vol 13 (3) ◽  
pp. 363-367
Author(s):  
Yauheni V. Asakovich ◽  
Simon A. Bashkirov ◽  
Alena V. Stanchik ◽  
Valery F. Gremenok ◽  
Raimondas Giraitis ◽  
...  

2013 ◽  
Vol 79 (6) ◽  
pp. 849-853
Author(s):  
N. I. Mashin ◽  
I. A. Bacherikova ◽  
E. A. Chernjaeva ◽  
A. N. Tumanova ◽  
A. A. Ershov

Author(s):  
Karren L. More

Beta-SiC is an ideal candidate material for use in semiconductor device applications. Currently, monocrystalline β-SiC thin films are epitaxially grown on {100} Si substrates by chemical vapor deposition (CVD). These films, however, contain a high density of defects such as stacking faults, microtwins, and antiphase boundaries (APBs) as a result of the 20% lattice mismatch across the growth interface and an 8% difference in thermal expansion coefficients between Si and SiC. An ideal substrate material for the growth of β-SiC is α-SiC. Unfortunately, high purity, bulk α-SiC single crystals are very difficult to grow. The major source of SiC suitable for use as a substrate material is the random growth of {0001} 6H α-SiC crystals in an Acheson furnace used to make SiC grit for abrasive applications. To prepare clean, atomically smooth surfaces, the substrates are oxidized at 1473 K in flowing 02 for 1.5 h which removes ∽50 nm of the as-grown surface. The natural {0001} surface can terminate as either a Si (0001) layer or as a C (0001) layer.


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