Factors in the adhesion strength of polymers toward a solid substrate

1977 ◽  
Vol 12 (2) ◽  
pp. 312-314
Author(s):  
B. Z. Cherkinskii ◽  
G. I. Gushchina ◽  
O. I. Seregina
2003 ◽  
Vol 766 ◽  
Author(s):  
A. Sekiguchi ◽  
J. Koike ◽  
K. Ueoka ◽  
J. Ye ◽  
H. Okamura ◽  
...  

AbstractAdhesion strength in sputter-deposited Cu thin films on various types of barrier layers was investigated by scratch test. The barrier layers were Ta1-xNx with varied nitrogen concentration of 0, 0.2, 0.3, and 0.5. Microstructure observation by TEM indicated that each layer consists of mixed phases of β;-Ta, bcc-TaN0.1, hexagonal-TaN, and fcc-TaN, depending on the nitrogen concentration. A sulfur- containing amorphous phase was also present discontinuously at the Cu/barrier interfaces in all samples. Scratch test showed that delamination occurred at the Cu/barrier interface and that the overall adhesion strength increased with increasing the nitrogen concentration. A good correlation was found between the measured adhesion strength and the composing phases in the barrier layer.


2013 ◽  
Vol E96.C (3) ◽  
pp. 374-377 ◽  
Author(s):  
Kazuo SENDA ◽  
Tsuyoshi MATSUDA ◽  
Kuniaki TANAKA ◽  
Hiroaki USUI

2019 ◽  
Vol 29 (6) ◽  
pp. 378-384 ◽  
Author(s):  
Hui Jae Cho ◽  
◽  
You Sub Kim ◽  
Yong Chan Jung ◽  
Soo Yeol Lee

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