Automatic determination of the thermal diffusivity of heat insulators

1966 ◽  
Vol 11 (3) ◽  
pp. 199-201 ◽  
Author(s):  
V. V. Vlasov ◽  
N. N. Dorogov
Keyword(s):  
Thermal Diffusivity ◽  
Automatic Determination

On Automatic Determination of Movement Phases in Manual Transport During the Precision Grip

2000 ◽  
Vol 28 (1-2) ◽  
pp. 237-245 ◽  
Author(s):  
Nasser Hosseini ◽  
Blanka Hejdukova ◽  
Pall E. Ingvarsson ◽  
Bo Johnels ◽  
Torsten Olsson
Keyword(s):  
Precision Grip ◽  
Automatic Determination

Automatic Determination of Optimal FIB Operations for Improved Circuit Probing and Fast Reconfiguration

2000 ◽  
Author(s):  
Romain Desplats ◽  
Timothee Dargnies ◽  
Jean-Christophe Courrege ◽  
Philippe Perdu ◽  
Jean-Louis Noullet
Keyword(s):  
Integrated Circuit ◽  
Focused Ion Beam ◽  
Ion Beam ◽  
Semiconductor Devices ◽  
Front Side ◽  
Automatic Determination ◽  
Metal Line ◽  
New Approach ◽  
Metal Layers

Abstract Focused Ion Beam (FIB) tools are widely used for Integrated Circuit (IC) debug and repair. With the increasing density of recent semiconductor devices, FIB operations are increasingly challenged, requiring access through 4 or more metal layers to reach a metal line of interest. In some cases, accessibility from the front side, through these metal layers, is so limited that backside FIB operations appear to be the most appropriate approach. The questions to be resolved before starting frontside or backside FIB operations on a device are: 1. Is it do-able, are the metal lines accessible? 2. What is the optimal positioning (e.g. accessing a metal 2 line is much faster and easier than digging down to a metal 6 line)? (for the backside) 3. What risk, time and cost are involved in FIB operations? In this paper, we will present a new approach, which allows the FIB user or designer to calculate the optimal FIB operation for debug and IC repair. It automatically selects the fastest and easiest milling and deposition FIB operations.

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